Sk Hynix - HXSCL STOCK NEWS

SK hynix has developed the industry's first 16Gb DDR5 using its 1c node, the sixth generation of the 10nm process. This breakthrough marks the beginning of extreme scaling closer to 10nm in memory process technology. The company achieved this by extending the platform of its industry-leading 1b technology.

Key improvements include:

• Enhanced cost competitiveness through new material adoption and EUV process optimization
• 11% improvement in operating speed to 8Gbps
• 9% improvement in power efficiency
• Potential 30% reduction in data center electricity costs

SK hynix plans to begin mass production within the year, with volume shipment expected in 2025. The company aims to apply this technology to next-generation products like HBM, LPDDR6, and GDDR7.

Gauss Labs has released Panoptes VM 2.0, an upgraded AI-based virtual metrology solution for semiconductor manufacturing. This new version introduces Multi-Step Modeling, Operation-Group Modeling, and Automatic Model Selection features, significantly improving prediction accuracy and usability. SK hynix, which has been using Panoptes VM 1.0 since December 2022, plans to expand its application to include the etching process in addition to thin film deposition. The solution has already helped SK hynix improve process variability by approximately 29% and enhance yield rates. Gauss Labs, founded in 2020 and headquartered in Silicon Valley, aims to revolutionize manufacturing with AI and expand its presence in the global industrial AI market.

SK hynix Inc. announced its participation in FMS 2024, a global semiconductor memory event in Santa Clara, California, from August 6-8. The company will showcase advancements in memory technologies and present its future visions in the AI space. Key highlights include:

1. A keynote speech on "AI Memory & Storage Solution Leadership and Vision for AI Era"
2. Display of next-generation AI memory products, including 12-layer HBM3E and 321-high NAND
3. Demonstration of customer systems featuring SK hynix's flagship products
4. Sponsorship of the FMS Super Women Conference to promote diversity in the industry

SK hynix aims to promote its leadership in AI memory solutions and showcase its technological competitiveness in the global market.

SK hynix has unveiled GDDR7, the industry's best-performing graphics memory product. Key features include:

1. 60% speed improvement (32Gbps, up to 40Gbps) over previous generation
2. 50% better power efficiency
3. Ability to process 1.5TB per second (300 Full-HD movies) when used in high-end graphics cards
4. 74% reduction in thermal resistance through new packaging technology
5. Mass production to start in Q3 2024

GDDR7 is expected to be adopted in 3D graphics, AI, high-performance computing, and autonomous driving. This development strengthens SK hynix's position as a leading AI memory solution provider.

SK hynix has announced the development of PCB01, a cutting-edge SSD optimized for on-device AI PCs. This fifth-generation 8-channel PCIe technology SSD offers unparalleled sequential read and write speeds of 14GB and 12GB per second, respectively. The product also boasts a 30% improvement in power efficiency and incorporates SLC caching for faster AI and conventional computing performance. Security is enhanced with a built-in Root of Trust (RoT) solution. SK hynix plans to mass produce and ship PCB01 within the year, available in 512GB, 1TB, and 2TB capacities.

SK hynix Inc. announced the development of ZUFS 4.0, a mobile NAND solution optimized for on-device AI applications, set to begin mass production in the third quarter. The product improves performance degradation over time and increases lifetime by 40%, positioning SK hynix as a leader in AI memory space.

SK hynix Inc. reported impressive 1Q24 financial results with revenues reaching 12.43 trillion won, operating profit at 2.886 trillion won, and net profit at 1.917 trillion won. The company saw a significant increase in sales of AI server products, leading to a 734% jump in operating profit. The NAND business also experienced a turnaround with rising eSSD sales and product prices. SK hynix plans to strengthen its position in the memory market by focusing on AI memory technology, introducing new products, and expanding production capacities.

SK hynix and TSMC have signed an MOU to collaborate on HBM4 development and next-generation packaging technology. This partnership aims to enhance memory performance for AI applications through trilateral collaboration in product design, foundry, and memory. The focus is on improving the base die in the HBM package by adopting TSMC's advanced logic process for HBM4. The goal is to create customized HBM solutions that meet customer demands for performance and power efficiency. The collaboration also includes optimizing the integration of SK hynix's HBM with TSMC's CoWoS technology, paving the way for open collaboration with customers and strengthening market leadership in the AI memory space.

SK hynix Inc. to invest $3.87 billion in an advanced packaging facility for AI products in Indiana, collaborating with Purdue University. The project aims to drive innovation in the AI supply chain, create over a thousand jobs, and strengthen the semiconductor industry in the U.S.