SK HYNIX INC S/GDR 144A - HXSCL STOCK NEWS

SK hynix Inc. reported impressive 1Q24 financial results with revenues reaching 12.43 trillion won, operating profit at 2.886 trillion won, and net profit at 1.917 trillion won. The company saw a significant increase in sales of AI server products, leading to a 734% jump in operating profit. The NAND business also experienced a turnaround with rising eSSD sales and product prices. SK hynix plans to strengthen its position in the memory market by focusing on AI memory technology, introducing new products, and expanding production capacities.

SK hynix and TSMC have signed an MOU to collaborate on HBM4 development and next-generation packaging technology. This partnership aims to enhance memory performance for AI applications through trilateral collaboration in product design, foundry, and memory. The focus is on improving the base die in the HBM package by adopting TSMC's advanced logic process for HBM4. The goal is to create customized HBM solutions that meet customer demands for performance and power efficiency. The collaboration also includes optimizing the integration of SK hynix's HBM with TSMC's CoWoS technology, paving the way for open collaboration with customers and strengthening market leadership in the AI memory space.

SK hynix Inc. to invest $3.87 billion in an advanced packaging facility for AI products in Indiana, collaborating with Purdue University. The project aims to drive innovation in the AI supply chain, create over a thousand jobs, and strengthen the semiconductor industry in the U.S.

SK hynix announces mass production of HBM3E, marking industry first and enhancing AI capabilities. The product offers best-in-class performance and heat control, positioning the company as a global leader in AI memory technology.

SK hynix Inc. and Gauss Labs collaborate on AI-based metrology technology, presenting two papers at SPIE AL 2024. The technology improves process control in semiconductor manufacturing, with significant results in process variability reduction and metrology equipment productivity enhancement.

SK hynix Inc. has announced a roadmap to increase the use of recycled and renewable materials in its production process, aiming to achieve a circular economy and contribute to global sustainability. The company plans to raise the proportion of recycled materials to 25% by 2025 and over 30% by 2030, with a focus on essential metals used in semiconductor production. SK hynix also intends to replace plastic packaging with recycled plastic and has established an implementation system for its goals. The company aims to work with all stakeholders in the semiconductor supply chain to achieve practical results.

SK hynix Inc. reports first quarterly profit in a year, backed by demand recovery and industry rebound. Revenues for 2023 at 32.77 trillion won, operating loss at 7.73 trillion won. Aims to grow into 'total AI memory provider' of optimal memory solutions.

SK hynix Inc. (HXSCL) to Showcase Ultra-High Performance Memory Products at CES 2024, Highlighting Role of Memory Chips in AI Era

SK hynix Inc. (www.skhynix.com) has begun supplying 16 GB LPDDR5T mobile DRAM packages, the fastest in the market, to global smartphone makers. The company's LPDDR5T will be used in the latest smartphones along with MediaTek's application processor 'Dimensity 9300'. SK hynix aims to bring 'On-Device AI' technology to smartphones by developing high-performance DRAM products.