SK HYNIX INC S/GDR 144A - HXSCL STOCK NEWS

SK hynix has unveiled GDDR7, the industry's best-performing graphics memory product. Key features include:

1. 60% speed improvement (32Gbps, up to 40Gbps) over previous generation
2. 50% better power efficiency
3. Ability to process 1.5TB per second (300 Full-HD movies) when used in high-end graphics cards
4. 74% reduction in thermal resistance through new packaging technology
5. Mass production to start in Q3 2024

GDDR7 is expected to be adopted in 3D graphics, AI, high-performance computing, and autonomous driving. This development strengthens SK hynix's position as a leading AI memory solution provider.

SK hynix has announced the development of PCB01, a cutting-edge SSD optimized for on-device AI PCs. This fifth-generation 8-channel PCIe technology SSD offers unparalleled sequential read and write speeds of 14GB and 12GB per second, respectively. The product also boasts a 30% improvement in power efficiency and incorporates SLC caching for faster AI and conventional computing performance. Security is enhanced with a built-in Root of Trust (RoT) solution. SK hynix plans to mass produce and ship PCB01 within the year, available in 512GB, 1TB, and 2TB capacities.

SK hynix Inc. announced the development of ZUFS 4.0, a mobile NAND solution optimized for on-device AI applications, set to begin mass production in the third quarter. The product improves performance degradation over time and increases lifetime by 40%, positioning SK hynix as a leader in AI memory space.

SK hynix Inc. reported impressive 1Q24 financial results with revenues reaching 12.43 trillion won, operating profit at 2.886 trillion won, and net profit at 1.917 trillion won. The company saw a significant increase in sales of AI server products, leading to a 734% jump in operating profit. The NAND business also experienced a turnaround with rising eSSD sales and product prices. SK hynix plans to strengthen its position in the memory market by focusing on AI memory technology, introducing new products, and expanding production capacities.

SK hynix and TSMC have signed an MOU to collaborate on HBM4 development and next-generation packaging technology. This partnership aims to enhance memory performance for AI applications through trilateral collaboration in product design, foundry, and memory. The focus is on improving the base die in the HBM package by adopting TSMC's advanced logic process for HBM4. The goal is to create customized HBM solutions that meet customer demands for performance and power efficiency. The collaboration also includes optimizing the integration of SK hynix's HBM with TSMC's CoWoS technology, paving the way for open collaboration with customers and strengthening market leadership in the AI memory space.

SK hynix Inc. to invest $3.87 billion in an advanced packaging facility for AI products in Indiana, collaborating with Purdue University. The project aims to drive innovation in the AI supply chain, create over a thousand jobs, and strengthen the semiconductor industry in the U.S.

SK hynix announces mass production of HBM3E, marking industry first and enhancing AI capabilities. The product offers best-in-class performance and heat control, positioning the company as a global leader in AI memory technology.

SK hynix Inc. and Gauss Labs collaborate on AI-based metrology technology, presenting two papers at SPIE AL 2024. The technology improves process control in semiconductor manufacturing, with significant results in process variability reduction and metrology equipment productivity enhancement.

SK hynix Inc. has announced a roadmap to increase the use of recycled and renewable materials in its production process, aiming to achieve a circular economy and contribute to global sustainability. The company plans to raise the proportion of recycled materials to 25% by 2025 and over 30% by 2030, with a focus on essential metals used in semiconductor production. SK hynix also intends to replace plastic packaging with recycled plastic and has established an implementation system for its goals. The company aims to work with all stakeholders in the semiconductor supply chain to achieve practical results.