SK hynix Ships World's First 12-Layer HBM4 Samples to Customers
SK hynix has achieved a significant milestone by becoming the first company to ship samples of 12-layer HBM4, a next-generation DRAM for AI applications, to major customers ahead of schedule. The company plans to begin mass production in the second half of 2025.
The new HBM4 product showcases industry-leading specifications, featuring:
- Bandwidth exceeding 2TB per second, capable of processing over 400 full-HD movies (5GB each) in one second
- Performance 60% faster than the previous HBM3E generation
- Industry-highest capacity of 36GB using Advanced MR-MUF process
This development follows SK hynix's successful track record as the first mass producer of HBM3 in 2022 and 8- and 12-high HBM3E in 2024, reinforcing their leadership in the AI memory market.
SK hynix ha raggiunto un traguardo significativo diventando la prima azienda a spedire campioni di HBM4 a 12 strati, una DRAM di nuova generazione per applicazioni AI, ai principali clienti con largo anticipo rispetto ai tempi previsti. L'azienda prevede di avviare la produzione di massa nella seconda metà del 2025.
Il nuovo prodotto HBM4 presenta specifiche di livello industriale, con:
- Larghezza di banda superiore a 2TB al secondo, in grado di elaborare oltre 400 film in full-HD (5GB ciascuno) in un secondo
- Prestazioni superiori del 60% rispetto alla precedente generazione HBM3E
- Capacità più alta del settore di 36GB utilizzando il processo avanzato MR-MUF
Questo sviluppo segue il successo di SK hynix come primo produttore di massa di HBM3 nel 2022 e di HBM3E a 8 e 12 strati nel 2024, rafforzando la loro leadership nel mercato della memoria AI.
SK hynix ha alcanzado un hito significativo al convertirse en la primera empresa en enviar muestras de HBM4 de 12 capas, una DRAM de próxima generación para aplicaciones de IA, a importantes clientes antes de lo previsto. La compañía planea comenzar la producción en masa en la segunda mitad de 2025.
El nuevo producto HBM4 presenta especificaciones líderes en la industria, que incluyen:
- Ancho de banda que supera los 2TB por segundo, capaz de procesar más de 400 películas en full-HD (5GB cada una) en un segundo
- Rendimiento un 60% más rápido que la generación anterior HBM3E
- Capacidad más alta de la industria de 36GB utilizando el proceso avanzado MR-MUF
Este desarrollo sigue el exitoso historial de SK hynix como el primer productor en masa de HBM3 en 2022 y de HBM3E de 8 y 12 capas en 2024, reforzando su liderazgo en el mercado de memoria para IA.
SK hynix는 주요 고객에게 12층 HBM4 샘플을 예정보다 앞서 배송함으로써 AI 응용 프로그램을 위한 차세대 DRAM에서 첫 번째 회사가 되는 중요한 이정표를 달성했습니다. 이 회사는 2025년 하반기에 대량 생산을 시작할 계획입니다.
새로운 HBM4 제품은 업계 최고의 사양을 자랑하며:
- 초당 2TB 이상의 대역폭을 제공하여 1초에 400편 이상의 풀 HD 영화(각 5GB)를 처리할 수 있습니다.
- 이전 HBM3E 세대보다 60% 더 빠른 성능
- 고급 MR-MUF 공정을 사용하여 업계 최고 용량인 36GB
이 개발은 2022년 HBM3의 첫 번째 대량 생산업체로 성공적인 기록을 세운 SK hynix의 후속 조치이며, 2024년에는 8층 및 12층 HBM3E를 생산하여 AI 메모리 시장에서의 리더십을 강화하고 있습니다.
SK hynix a atteint un jalon significatif en devenant la première entreprise à expédier des échantillons de HBM4 à 12 couches, une DRAM de nouvelle génération pour les applications d'IA, à des clients majeurs avant la date prévue. L'entreprise prévoit de commencer la production de masse dans la seconde moitié de 2025.
Le nouveau produit HBM4 présente des spécifications de pointe dans l'industrie, comprenant:
- Une bande passante dépassant 2 To par seconde, capable de traiter plus de 400 films en full HD (5 Go chacun) en une seconde
- Des performances 60% plus rapides que la génération précédente HBM3E
- Une capacité la plus élevée de l'industrie de 36 Go utilisant le processus avancé MR-MUF
Ce développement fait suite au parcours réussi de SK hynix en tant que premier producteur de masse de HBM3 en 2022 et de HBM3E à 8 et 12 couches en 2024, renforçant ainsi leur leadership sur le marché de la mémoire pour l'IA.
SK hynix hat einen bedeutenden Meilenstein erreicht, indem es das erste Unternehmen wurde, das Muster von 12-Schicht HBM4, einem DRAM der nächsten Generation für KI-Anwendungen, vorzeitig an wichtige Kunden versendet hat. Das Unternehmen plant, in der zweiten Hälfte des Jahres 2025 mit der Massenproduktion zu beginnen.
Das neue HBM4-Produkt bietet branchenführende Spezifikationen, darunter:
- Eine Bandbreite von über 2TB pro Sekunde, die in der Lage ist, über 400 Full-HD-Filme (jeweils 5GB) in einer Sekunde zu verarbeiten
- Eine Leistung, die 60% schneller ist als die vorherige HBM3E-Generation
- Die branchenweit höchste Kapazität von 36GB mit dem fortschrittlichen MR-MUF-Prozess
Diese Entwicklung folgt auf die erfolgreiche Geschichte von SK hynix als erster Massenproduzent von HBM3 im Jahr 2022 und 8- sowie 12-Schicht HBM3E im Jahr 2024, was ihre Führungsposition im KI-Speichermarkt weiter festigt.
- First-to-market advantage with 12-layer HBM4 samples
- Industry-leading bandwidth exceeding 2TB/second, 60% faster than previous generation
- Highest capacity (36GB) among 12-layer HBM products
- Early delivery strengthens market leadership in AI memory segment
- Mass production not starting until 2H 2025
- Still requires customer certification process completion
- Provision of 12-layer HBM4 samples, a new DRAM product with ultra-high performance for AI, to major customers comes earlier than scheduled
- Mass production of products with best-in-class bandwidth and capacity to start in 2H 2025 following certification process
- Enhancement of position as front-runner in AI ecosystem follows years of efforts to overcome technological limitations
The samples were delivered ahead of schedule based on SK hynix's technological edge and production experience that have led the HBM market, and the company is to start the certification process for the customers. SK hynix aims to complete preparations for mass production of 12-layer HBM4 products within the second half of the year, strengthening its position in the next-generation AI memory market.
The 12-layer HBM4 provided as samples this time feature the industry's best capacity and speed which are essential for AI memory products.
The product has implemented bandwidth1 capable of processing more than 2TB (terabytes) of data per second for the first time. This translates to processing data equivalent to more than 400 full-HD movies (5GB each) in a second, which is more than 60 percent faster than the previous generation, HBM3E.
*Bandwidth1: In HBM products, bandwidth refers to the total data capacity that one HBM package can process per second.
SK hynix also adopted the Advanced MR-MUF process to achieve the capacity of 36GB, which is the highest among 12-layer HBM products. The process, of which competitiveness has been proved through a successful production of the previous generation, helps prevent chip warpage, while maximizing product stability by improving heat dissipation.
Following its achievement as the industry's first provider to mass produce HBM3 in 2022, and 8- and 12-high HBM3E in 2024, SK hynix has been leading the AI memory market by developing and supplying HBM products in a timely manner.
"We have enhanced our position as a front-runner in the AI ecosystem following years of consistent efforts to overcome technological challenges in accordance with customer demands," said Justin Kim, President & Head of AI Infra at SK hynix. "We are now ready to smoothly proceed with the performance certification and preparatory works for mass production, taking advantage of the experience we have built as the industry's largest HBM provider."
About SK hynix Inc.
SK hynix Inc., headquartered in
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SOURCE SK hynix Inc.
FAQ
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