SK hynix Showcases Industry-Leading Memory Technology at GTC 2025
SK hynix is showcasing its cutting-edge memory technology at GTC 2025 in San Jose, California from March 17-21. The company's booth, titled 'Memory, Powering AI and Tomorrow', features advanced memory solutions including 12-high HBM3E and SOCAMM, a new low-power DRAM-based memory module for AI servers.
Key executives, including CEO Kwak Noh-Jung and President Justin Kim, will engage with global AI industry leaders to strengthen partnerships. Following their successful mass production of 12-high HBM3E, SK hynix plans to initiate large-scale production of 12-high HBM4 in the second half, with a model on display at the conference. The company is positioning itself as a Full Stack AI Memory Provider, focusing on solutions for AI data centers, on-device applications, and automotive businesses.
SK hynix sta presentando la sua tecnologia di memoria all'avanguardia al GTC 2025 a San Jose, California, dal 17 al 21 marzo. Lo stand dell'azienda, intitolato 'Memoria, Alimentando l'IA e il Domani', presenta soluzioni di memoria avanzate tra cui 12-high HBM3E e SOCAMM, un nuovo modulo di memoria a bassa potenza basato su DRAM per server AI.
Dirigenti chiave, tra cui il CEO Kwak Noh-Jung e il Presidente Justin Kim, interagiranno con leader globali dell'industria dell'IA per rafforzare le partnership. Dopo il successo nella produzione di massa del 12-high HBM3E, SK hynix prevede di avviare la produzione su larga scala del 12-high HBM4 nella seconda metà dell'anno, con un modello in esposizione alla conferenza. L'azienda si sta posizionando come fornitore completo di memoria per l'IA, concentrandosi su soluzioni per centri dati AI, applicazioni su dispositivo e settori automotive.
SK hynix está presentando su tecnología de memoria de vanguardia en el GTC 2025 en San José, California, del 17 al 21 de marzo. El stand de la compañía, titulado 'Memoria, Potenciando la IA y el Mañana', exhibe soluciones de memoria avanzadas, incluyendo 12-high HBM3E y SOCAMM, un nuevo módulo de memoria DRAM de bajo consumo para servidores de IA.
Ejecutivos clave, incluyendo al CEO Kwak Noh-Jung y al Presidente Justin Kim, se reunirán con líderes de la industria global de IA para fortalecer asociaciones. Tras su exitosa producción en masa del 12-high HBM3E, SK hynix planea iniciar la producción a gran escala del 12-high HBM4 en la segunda mitad del año, con un modelo en exhibición en la conferencia. La compañía se está posicionando como un Proveedor de Memoria de IA de Pila Completa, enfocándose en soluciones para centros de datos de IA, aplicaciones en dispositivos y negocios automotrices.
SK hynix는 3월 17일부터 21일까지 캘리포니아 샌호세에서 열리는 GTC 2025에서 최첨단 메모리 기술을 선보이고 있습니다. '메모리, AI와 내일을 지원하다'라는 제목의 부스에서는 12-high HBM3E와 AI 서버용 저전력 DRAM 기반 메모리 모듈인 SOCAMM을 포함한 고급 메모리 솔루션이 전시됩니다.
CEO 곽노정과 사장 저스틴 킴을 포함한 주요 경영진이 글로벌 AI 산업 리더들과 소통하여 파트너십을 강화할 예정입니다. 12-high HBM3E의 성공적인 대량 생산에 이어, SK hynix는 하반기 중 12-high HBM4의 대규모 생산을 시작할 계획이며, 컨퍼런스에서 모델을 전시할 예정입니다. 이 회사는 AI 데이터 센터, 디바이스 애플리케이션 및 자동차 비즈니스를 위한 솔루션에 집중하여 풀 스택 AI 메모리 공급업체로 자리매김하고 있습니다.
SK hynix présente sa technologie de mémoire de pointe au GTC 2025 à San Jose, Californie, du 17 au 21 mars. Le stand de l'entreprise, intitulé 'Mémoire, alimentant l'IA et demain', met en avant des solutions de mémoire avancées, y compris 12-high HBM3E et SOCAMM, un nouveau module de mémoire DRAM à faible consommation pour serveurs d'IA.
Des dirigeants clés, dont le PDG Kwak Noh-Jung et le Président Justin Kim, interagiront avec des leaders mondiaux de l'industrie de l'IA pour renforcer les partenariats. Suite à leur production de masse réussie du 12-high HBM3E, SK hynix prévoit de lancer la production à grande échelle du 12-high HBM4 dans la seconde moitié de l'année, avec un modèle exposé lors de la conférence. L'entreprise se positionne comme un fournisseur de mémoire AI Full Stack, en se concentrant sur des solutions pour les centres de données AI, les applications sur appareil et les secteurs automobiles.
SK hynix präsentiert seine hochmoderne Speichertechnologie auf dem GTC 2025 in San Jose, Kalifornien, vom 17. bis 21. März. Der Stand des Unternehmens mit dem Titel 'Speicher, der KI und Morgen antreibt' zeigt fortschrittliche Speicherlösungen, darunter 12-high HBM3E und SOCAMM, ein neues energieeffizientes DRAM-basiertes Speichermodul für KI-Server.
Wichtige Führungskräfte, darunter CEO Kwak Noh-Jung und Präsident Justin Kim, werden mit globalen Führungspersönlichkeiten der KI-Branche interagieren, um Partnerschaften zu stärken. Nach der erfolgreichen Massenproduktion von 12-high HBM3E plant SK hynix, in der zweiten Jahreshälfte mit der Großproduktion von 12-high HBM4 zu beginnen, mit einem Modell, das auf der Konferenz ausgestellt wird. Das Unternehmen positioniert sich als Anbieter von Full Stack AI-Speicher und konzentriert sich auf Lösungen für KI-Datenzentren, On-Device-Anwendungen und die Automobilindustrie.
- First-to-market with mass production of 12-high HBM3E
- Planned production launch of next-gen 12-high HBM4 in H2 2025
- Expansion into AI server market with new SOCAMM memory standard
- None.
- Various memory products for AI data centers, on-device, automotive businesses on display
The company will present HBM and other memory products for AI data centers and on-device* and memory solutions for automotive business essential for AI era.
*On-device: a technology that implements certain functions on the device itself, instead of going through computation by a physically separated server. As for the on-device AI, a smart device's direct collection and computation of information allows fast reactions of the AI performance, while promising an improved customized AI service
Among the industry-leading AI memory technology to be displayed at the show are 12-high HBM3E and SOCAMM**, a new memory standard for AI servers.
**SOCAMM(Small Outline Compression Attached Memory Module): a low-power DRAM-based memory module for AI server
At the event, top company executives led by Chief Executive Officer Kwak Noh-Jung, President, Head of AI Infra and Chief Marketing Officer Juseon (Justin) Kim and Head of Global S&M Lee Sangrak will meet with the leaders of the global AI industry to enhance collaboration.
Following the industry's first mass production and supply of the 12-high HBM3E, SK hynix is now planning to complete the preparatory works for large-scale production of the 12-high HBM4 within the second half for immediate start of supply to order. At GTC 2025, a model of the 12-high HBM4, which is under development, will also be displayed.
"We are proud to present our line-up of industry-leading products at GTC 2025," President & Head of AI Infra Juseon (Justin) Kim said. "With a differentiated competitiveness in the AI memory space, we are on track to bring our future as the Full Stack AI Memory Provider*** forward."
*** Full Stack AI Memory Provider: SK hynix's vision to be a provider of a full-range of AI memory products and technologies
About SK hynix Inc.
SK hynix Inc., headquartered in
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SOURCE SK hynix Inc.
FAQ
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