Welcome to our dedicated page for Sk Hynix news (Ticker: HXSCL), a resource for investors and traders seeking the latest updates and insights on Sk Hynix stock.
SK hynix (HXSCL) is a global leader in semiconductor technology, specializing in high-performance memory solutions including DRAM, NAND flash, and AI-optimized high-bandwidth memory (HBM). This dedicated news hub provides investors and industry professionals with timely access to official press releases, financial updates, and strategic announcements.
Our curated collection serves as a comprehensive resource for tracking technological breakthroughs, manufacturing milestones, and corporate developments. Find verified information on earnings reports, product launches, and partnership agreements essential for understanding SK hynix's market position.
Updates cover key operational areas including AI memory innovations for data centers, advanced packaging techniques, and global expansion efforts. All content is sourced from company communications to ensure accuracy and regulatory compliance.
Bookmark this page for centralized access to SK hynix's latest developments in memory technology. Return regularly for insights into how their HBM advancements and semiconductor expertise shape next-generation computing solutions.
SK hynix reported record-breaking Q3 2024 financial results with revenues of 17.5731 trillion won, operating profit of 7.03 trillion won (40% margin), and net profit of 5.7534 trillion won (33% margin). The company's success was driven by strong AI memory demand, with HBM sales increasing over 70% QoQ and 330% YoY. HBM represented 30% of DRAM revenues in Q3 and is expected to reach 40% in Q4. Both DRAM and NAND average selling prices rose in the mid-10% range compared to the previous quarter.
SK hynix has begun mass production of the world's first 12-layer HBM3E product with 36GB capacity, the largest in existing HBM. The company plans to supply these products to customers by the end of the year. This achievement comes six months after delivering the 8-layer HBM3E product in March.
Key features of the 12-layer HBM3E include:
- 50% increased capacity at the same thickness as the previous 8-layer product
- DRAM chips made 40% thinner
- Memory operation speed of 9.6 Gbps
- 10% higher heat dissipation performance
SK hynix aims to maintain its leadership in the AI memory market with this product, addressing the growing needs of AI companies.
SK hynix has announced that key features of its Heterogeneous Memory Software Development Kit (HMSDK) are now available on Linux, the world's largest open source operating system. HMSDK is SK hynix's proprietary software for optimizing the operation of Compute Express Link (CXL), a next-generation AI memory technology. The integration with Linux marks a significant milestone for SK hynix, highlighting its competitiveness in software.
HMSDK enhances memory package's bandwidth by over 30% and improves performance by more than 12% through optimization. SK hynix is currently validating CXL 2.0 memory in 96 GB and 128 GB capacities with customers and plans to begin mass production by the end of the year. The company aims to improve its status as a total AI memory solutions provider by innovating technologies and expanding the ecosystem in this field.
SK hynix has developed PEB110 E1.S, a high-performance SSD for data centers, addressing the growing demand for NAND solutions in the AI era. The new SSD, applying PCIe Gen5 specifications, offers twice the performance and over 30% greater power efficiency than its predecessor. Key features include:
- Data transfer rates up to 32 GT/s
- SPDM technology for enhanced security
- Available in 2TB, 4TB, and 8TB capacities
- OCP version 2.5 compatibility
SK hynix plans to begin mass production in Q2 2025, pending customer qualification. This development aims to strengthen SK hynix's position as the leading global AI memory provider in the expanding data center SSD market.
SK hynix has developed the industry's first 16Gb DDR5 using its 1c node, the sixth generation of the 10nm process. This breakthrough marks the beginning of extreme scaling closer to 10nm in memory process technology. The company achieved this by extending the platform of its industry-leading 1b technology.
Key improvements include:
- Enhanced cost competitiveness through new material adoption and EUV process optimization
- 11% improvement in operating speed to 8Gbps
- 9% improvement in power efficiency
- Potential 30% reduction in data center electricity costs
SK hynix plans to begin mass production within the year, with volume shipment expected in 2025. The company aims to apply this technology to next-generation products like HBM, LPDDR6, and GDDR7.
Gauss Labs has released Panoptes VM 2.0, an upgraded AI-based virtual metrology solution for semiconductor manufacturing. This new version introduces Multi-Step Modeling, Operation-Group Modeling, and Automatic Model Selection features, significantly improving prediction accuracy and usability. SK hynix, which has been using Panoptes VM 1.0 since December 2022, plans to expand its application to include the etching process in addition to thin film deposition. The solution has already helped SK hynix improve process variability by approximately 29% and enhance yield rates. Gauss Labs, founded in 2020 and headquartered in Silicon Valley, aims to revolutionize manufacturing with AI and expand its presence in the global industrial AI market.
SK hynix Inc. announced its participation in FMS 2024, a global semiconductor memory event in Santa Clara, California, from August 6-8. The company will showcase advancements in memory technologies and present its future visions in the AI space. Key highlights include:
1. A keynote speech on "AI Memory & Storage Solution Leadership and Vision for AI Era"
2. Display of next-generation AI memory products, including 12-layer HBM3E and 321-high NAND
3. Demonstration of customer systems featuring SK hynix's flagship products
4. Sponsorship of the FMS Super Women Conference to promote diversity in the industry
SK hynix aims to promote its leadership in AI memory solutions and showcase its technological competitiveness in the global market.
SK hynix has unveiled GDDR7, the industry's best-performing graphics memory product. Key features include:
1. 60% speed improvement (32Gbps, up to 40Gbps) over previous generation
2. 50% better power efficiency
3. Ability to process 1.5TB per second (300 Full-HD movies) when used in high-end graphics cards
4. 74% reduction in thermal resistance through new packaging technology
5. Mass production to start in Q3 2024
GDDR7 is expected to be adopted in 3D graphics, AI, high-performance computing, and autonomous driving. This development strengthens SK hynix's position as a leading AI memory solution provider.
SK hynix has announced the development of PCB01, a cutting-edge SSD optimized for on-device AI PCs. This fifth-generation 8-channel PCIe technology SSD offers unparalleled sequential read and write speeds of 14GB and 12GB per second, respectively. The product also boasts a 30% improvement in power efficiency and incorporates SLC caching for faster AI and conventional computing performance. Security is enhanced with a built-in Root of Trust (RoT) solution. SK hynix plans to mass produce and ship PCB01 within the year, available in 512GB, 1TB, and 2TB capacities.
SK hynix Inc. announced the development of ZUFS 4.0, a mobile NAND solution optimized for on-device AI applications, set to begin mass production in the third quarter. The product improves performance degradation over time and increases lifetime by 40%, positioning SK hynix as a leader in AI memory space.
