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MediaTek Inc. (MDTKF) drives global semiconductor innovation through advanced system-on-chip solutions powering smartphones, IoT devices, automotive systems, and connected technologies. This dedicated news hub provides investors and industry professionals with essential updates on the company's technological advancements and market position.
Comprehensive Coverage: Track official announcements including quarterly earnings, product launches (Dimensity mobile platforms, Pentonic smart TV chips), strategic partnerships (NVIDIA AI collaborations), and industry recognition. Our curated feed consolidates press releases, regulatory filings, and market analyses related to MediaTek's leadership in 5G, AI integration, and energy-efficient semiconductor design.
Key Focus Areas: Stay informed about developments in mobile computing architectures, smart home ecosystems, automotive infotainment systems, and next-generation connectivity standards. Monitor progress in MediaTek's core growth sectors including AI-accelerated chipsets, Wi-Fi 7 adoption, and satellite communication technologies.
Investor Resources: Access timestamped updates on financial performance, R&D investments, and supply chain developments impacting MediaTek's position in the global semiconductor market. All content is sourced from verified corporate communications and reputable financial news outlets.
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MediaTek has unveiled its latest flagship chipset, the Dimensity 9400+, featuring enhanced AI capabilities and performance improvements. The SoC incorporates an All Big Core design with one Arm Cortex-X925 core at 3.73GHz, alongside 3x Cortex-X4 and 4x Cortex-A720 cores.
The chip includes the MediaTek NPU 890, supporting various Large Language Models with features like Mixture-of-Experts, Multi-Head Latent Attention, and 20% faster agentic AI performance. The integrated 12-core Arm Immortalis-G925 GPU brings PC-level gaming features and improved power efficiency.
Key improvements include:
- Extended Bluetooth range up to 10km (6.6x further than previous model)
- 33% faster BeiDou satellite connection
- Wi-Fi 7 tri-band support
- Enhanced Wi-Fi coverage up to 30m with Xtra Range 3.0
- 5G/4G Dual SIM Dual Active capabilities
MediaTek has unveiled the Kompanio Ultra, its most advanced processor for Chromebook Plus devices, built on 3nm process technology. The chip features 50 TOPS of AI processing power and an Arm Cortex-X925 processor reaching speeds up to 3.62GHz.
Key features include on-device generative AI capabilities powered by MediaTek's 8th-generation NPU, support for up to two external 4K displays, Wi-Fi 7 connectivity, and advanced power management for extended battery life. The processor enables local AI processing without internet connection, offering enhanced security and efficiency.
The new platform, developed in collaboration with Google, will power Chromebooks launching in the coming months, promising superior computing performance and power efficiency for tasks like video editing, content creation, and high-resolution gaming.
MediaTek has unveiled two new IoT platforms - the Genio 720 and Genio 520 - at Embedded World in Nuremberg. These platforms are designed for generative AI applications in smart home, retail, industrial, and commercial IoT devices.
Built on a 6nm process, both platforms feature an octa-core CPU and deliver up to 10 TOPS performance with MediaTek's 8th-generation Neural Processing Unit. They support up to 16GB of LPDDR5 memory for edge-optimized large language models like Llama, Gemini, Phi, and DeepSeek.
Key features include:
- Support for 4K/5K ultrawide display or dual 2.5K displays
- 4K H.264/H.265 video capabilities
- Dual ISP support up to 16+16/32MP@30fps
- Pre-integrated Wi-Fi 6/6E solutions
- Android, Yocto Linux, and Ubuntu OS options
MediaTek unveiled several groundbreaking technologies at Mobile World Congress 2025, showcasing advancements in 6G, AI, and connectivity solutions. The company demonstrated its Hybrid Computing innovation for 6G standardization, featuring device cloud + RAN integration as an edge cloud.
Key announcements include the M90 5G-Advanced modem delivering speeds up to 12Gbps with 18% lower power consumption, and Envelope Assisted RFFE System increasing power amplifier efficiency by 25%. The company also showcased successful field trials of Ku-band NR-NTN satellite connectivity, developments in Dimensity Auto for automotive applications, and 224G SerDes technology for AI and data center infrastructure.
Notable innovations include Smart AI Antenna technology, Generative AI Gateway systems, and Sub-Band Full Duplex (SBFD) technology for improved spectrum efficiency in 5G-Advanced and 6G applications.
MediaTek has unveiled its new M90 5G-Advanced modem at Mobile World Congress 2025, featuring breakthrough connectivity capabilities and AI integration. The modem delivers up to 12Gbps downlink speeds and 20% improved uplink performance with 3GPP Release 17 compliance.
The M90 introduces MediaTek Modem AI (MMAI) technology, which optimizes power consumption and enhances connectivity through AI models. Its Smart Antenna technology achieves 99.5% accuracy in environment identification and increases data throughput by 24%.
Key features include dual 5G SIM support, satellite connectivity (NTN), and MediaTek UltraSave technology reducing power consumption by 18%. The modem has demonstrated impressive performance in trials, achieving 11.6Gbps with Keysight, 5.5Gbps with Verizon and Samsung, and nearly 10Gbps with Telstra and Ericsson. Engineering samples will be available in H2 2025.
MediaTek has launched three new ultra-efficient chipsets: the Dimensity 7400, Dimensity 7400X, and Dimensity 6400. These additions to the Dimensity family are designed to enhance gaming, AI, and connectivity for both high-tech and mainstream mobile devices.
The Dimensity 7400 and 7400X feature an octa-core CPU with 4X Arm Cortex-A78 cores up to 2.6GHz and 4X Arm Cortex-A55 cores up to 2.0GHz, plus an Arm Mali-G615 MC2 GPU. Built on TSMC's 4nm process node, these chipsets use 14% to 36% less power during gaming compared to competitors. They also support MediaTek Advanced Gaming Technology (MAGT) 3.0, AI optimizations, and reduced input lag.
For AI applications, these chipsets integrate MediaTek's NPU 6.0, offering a 15% performance boost over the Dimensity 7300. They also support advanced AI camera features, Google Ultra HDR, and dual display flip phones (7400X). The 5G R16 modem with 3CC carrier aggregation and Tri-band Wi-Fi 6E support ensures fast, reliable connectivity.
The Dimensity 6400 is built on TSMC's 6nm process node and features an octa-core CPU with 2X Arm Cortex-A76 cores up to 2.5GHz and 6X Arm Cortex-A55 cores up to 2.0GHz, plus an Arm Mali-G57 MC2 GPU. It uses up to 19% less power during gaming compared to competitors. Key features include MediaTek Bluetooth Wi-Fi HyperCoex Technology, Release 16 Sub-6 5G Modem, and support for 108MP camera sensors.
The Dimensity 6400 is currently available, while the first smartphones powered by the Dimensity 7400 and 7400X will be available in Q1 2025.
MediaTek announced its collaboration with NVIDIA on the design of the NVIDIA GB10 Grace Blackwell Superchip for Project DIGITS, a personal AI supercomputer. As the world's leading chip supplier for smartphones and smart devices, MediaTek brings its expertise in Arm-based SoC performance and power efficiency to this groundbreaking project.
The collaboration aims to make advanced AI technology more accessible, combining MediaTek's CPU performance and power efficiency with NVIDIA's accelerated computing technologies. This partnership builds on previous joint ventures, including MediaTek's Dimensity Auto Cockpit chips integration with NVIDIA's GPU-accelerated AI computing and RTX graphics.
Additionally, MediaTek has integrated NVIDIA TAO, an AI model training toolkit, with its NeuroPilot SDK to enhance edge AI capabilities for IoT applications. This aligns with MediaTek's vision of bringing AI capabilities across its entire portfolio, including Dimensity, Genio, Pentonic, Kompanio, and Dimensity Auto platforms.
MediaTek announced the winners of its second-annual 'Expect Incredible Awards', recognizing the best MediaTek-powered devices across various categories. The Samsung Galaxy Tab S10 Ultra dominated multiple categories, winning Best Overall, Best in AI, and Best in Computing. The Vivo X100 Pro secured Best in Mobile, while the Archer BE550 won Best in Connectivity and IoT. Amazon Echo Spot claimed Best in Smart Home. Winners were selected by industry analysts and creators, including Counterpoint Research and 91 Mobiles, based on design, performance, and innovation. MediaTek currently powers more than 2 billion devices annually.
MediaTek is set to unveil new products and technologies at COMPUTEX 2024, focusing on AI, Smart TVs, Chromebooks, and IoT. Key highlights include the introduction of two new chipsets: the Kompanio 838 SoC for premium Chromebooks and the Pentonic 800 SoC for 4K smart TVs. These chipsets feature advanced AI processing capabilities for enhanced user experience. Vice Chairman and CEO Dr. Rick Tsai will deliver a keynote on June 4, discussing the role of AI in various sectors. The Kompanio 838 offers improved performance, multitasking, and power efficiency, while the Pentonic 800 enhances video, audio quality, and gaming experience. Both chipsets support the latest connectivity standards, ensuring robust performance for end-users.
MediaTek announced its new Dimensity 7300 and Dimensity 7300X chipsets, designed for high-tech smartphones and foldable devices. These 4nm chips feature octa-core CPUs with Arm Cortex-A78 and Cortex-A55 cores, achieving up to 25% lower power consumption compared to the Dimensity 7050. Enhanced with the Arm Mali-G615 GPU and MediaTek HyperEngine, they offer 20% faster FPS and 20% improved energy efficiency. The 7300X supports dual displays for foldables. They also provide upgraded photography capabilities with the MediaTek Imagiq 950, supporting 200MP cameras, 4K HDR video, and AI-enhanced computing. Key features include 5G UltraSave 3.0+ technology, tri-band Wi-Fi 6E, and dual 5G SIM support.
