MediaTek Expands Cloud-to-Edge Leadership with Next-Generation Connectivity and AI at MWC 2025
MediaTek unveiled several groundbreaking technologies at Mobile World Congress 2025, showcasing advancements in 6G, AI, and connectivity solutions. The company demonstrated its Hybrid Computing innovation for 6G standardization, featuring device cloud + RAN integration as an edge cloud.
Key announcements include the M90 5G-Advanced modem delivering speeds up to 12Gbps with 18% lower power consumption, and Envelope Assisted RFFE System increasing power amplifier efficiency by 25%. The company also showcased successful field trials of Ku-band NR-NTN satellite connectivity, developments in Dimensity Auto for automotive applications, and 224G SerDes technology for AI and data center infrastructure.
Notable innovations include Smart AI Antenna technology, Generative AI Gateway systems, and Sub-Band Full Duplex (SBFD) technology for improved spectrum efficiency in 5G-Advanced and 6G applications.
MediaTek ha svelato diverse tecnologie innovative al Mobile World Congress 2025, mostrando progressi nel 6G, nell'IA e nelle soluzioni di connettività. L'azienda ha presentato la sua innovazione nel calcolo ibrido per la standardizzazione del 6G, caratterizzata dall'integrazione del cloud dei dispositivi e del RAN come cloud edge.
Tra gli annunci principali c'è il modem M90 5G-Advanced, che offre velocità fino a 12Gbps con un consumo energetico inferiore del 18%, e il sistema Envelope Assisted RFFE che aumenta l'efficienza dell'amplificatore di potenza del 25%. L'azienda ha anche mostrato prove di successo della connettività satellitare Ku-band NR-NTN, sviluppi in Dimensity Auto per applicazioni automobilistiche e tecnologia SerDes 224G per infrastrutture di IA e data center.
Tra le innovazioni degne di nota ci sono la tecnologia Smart AI Antenna, i sistemi Generative AI Gateway e la tecnologia Sub-Band Full Duplex (SBFD) per migliorare l'efficienza spettrale nelle applicazioni 5G-Advanced e 6G.
MediaTek presentó varias tecnologías innovadoras en el Mobile World Congress 2025, mostrando avances en 6G, IA y soluciones de conectividad. La compañía demostró su innovación en computación híbrida para la estandarización del 6G, que incluye la integración de la nube de dispositivos y RAN como una nube de borde.
Los anuncios clave incluyen el módem M90 5G-Advanced, que ofrece velocidades de hasta 12Gbps con un consumo de energía un 18% menor, y el sistema Envelope Assisted RFFE que aumenta la eficiencia del amplificador de potencia en un 25%. La compañía también mostró pruebas de campo exitosas de conectividad satelital Ku-band NR-NTN, desarrollos en Dimensity Auto para aplicaciones automotrices y tecnología SerDes 224G para infraestructura de IA y centros de datos.
Las innovaciones notables incluyen la tecnología Smart AI Antenna, los sistemas Generative AI Gateway y la tecnología Sub-Band Full Duplex (SBFD) para mejorar la eficiencia espectral en aplicaciones 5G-Advanced y 6G.
MediaTek는 Mobile World Congress 2025에서 6G, AI 및 연결 솔루션의 발전을 선보이며 여러 혁신 기술을 공개했습니다. 이 회사는 장치 클라우드와 RAN 통합을 엣지 클라우드로 특징짓는 하이브리드 컴퓨팅 혁신을 6G 표준화에 대해 시연했습니다.
주요 발표 사항으로는 최대 12Gbps의 속도를 제공하며 전력 소비를 18% 줄인 M90 5G-Advanced 모뎀과 전력 증폭기 효율성을 25% 증가시키는 Envelope Assisted RFFE 시스템이 있습니다. 이 회사는 또한 Ku-band NR-NTN 위성 연결의 성공적인 현장 시험과 자동차 애플리케이션을 위한 Dimensity Auto 개발 및 AI 및 데이터 센터 인프라를 위한 224G SerDes 기술을 선보였습니다.
주목할 만한 혁신으로는 Smart AI 안테나 기술, Generative AI Gateway 시스템 및 5G-Advanced 및 6G 애플리케이션의 스펙트럼 효율성을 향상시키기 위한 Sub-Band Full Duplex (SBFD) 기술이 포함됩니다.
MediaTek a dévoilé plusieurs technologies révolutionnaires lors du Mobile World Congress 2025, mettant en avant des avancées dans le 6G, l'IA et les solutions de connectivité. L'entreprise a présenté son innovation en informatique hybride pour la standardisation du 6G, intégrant le cloud des appareils et le RAN comme un cloud de périphérie.
Les annonces clés incluent le modem M90 5G-Advanced offrant des vitesses allant jusqu'à 12Gbps avec une consommation d'énergie inférieure de 18%, ainsi que le système Envelope Assisted RFFE augmentant l'efficacité de l'amplificateur de puissance de 25%. L'entreprise a également présenté des essais sur le terrain réussis de connectivité satellitaire Ku-band NR-NTN, des développements dans Dimensity Auto pour des applications automobiles et la technologie SerDes 224G pour l'infrastructure IA et les centres de données.
Parmi les innovations notables, on trouve la technologie Smart AI Antenna, les systèmes Generative AI Gateway et la technologie Sub-Band Full Duplex (SBFD) pour améliorer l'efficacité spectrale dans les applications 5G-Advanced et 6G.
MediaTek stellte auf dem Mobile World Congress 2025 mehrere bahnbrechende Technologien vor und präsentierte Fortschritte in den Bereichen 6G, KI und Konnektivitätslösungen. Das Unternehmen demonstrierte seine Hybrid-Computing-Innovation zur Standardisierung von 6G, die die Integration von Geräte-Cloud und RAN als Edge-Cloud umfasst.
Zu den wichtigsten Ankündigungen gehört das M90 5G-Advanced-Modem, das Geschwindigkeiten von bis zu 12Gbps mit einem um 18% niedrigeren Energieverbrauch liefert, sowie das Envelope Assisted RFFE-System, das die Effizienz des Leistungsverstärkers um 25% steigert. Das Unternehmen präsentierte außerdem erfolgreiche Feldversuche zur Ku-Band NR-NTN-Satellitenkonnektivität, Entwicklungen in Dimensity Auto für Automobilanwendungen und 224G SerDes-Technologie für KI- und Rechenzentrumsinfrastrukturen.
Bemerkenswerte Innovationen umfassen die Smart AI Antenna-Technologie, Generative AI Gateway-Systeme und die Sub-Band Full Duplex (SBFD)-Technologie zur Verbesserung der Spektrumeffizienz in 5G-Advanced- und 6G-Anwendungen.
- M90 5G modem achieves 12Gbps speeds with 18% power reduction
- Envelope Assisted RFFE improves power efficiency by 25%
- Successful field trial of Ku-band NR-NTN satellite connectivity
- 224G SerDes technology advancement for AI and data center markets
- None.
Showcasing 6G Hybrid Computing Technologies, 5G-Advanced Modem, NR-NTN and Generative AI Gateways
"We're pushing forward industry-leading connectivity and AI applications through high-quality products and global standardization, which create significant new opportunities to enrich everyday living for more people around the world," said Joe Chen, President of MediaTek. "This is exemplified by our most recent developments in leading-edge 6G-era technologies, generative AI hybrid computing, and 5G-Advanced solutions, which will be on display this week."
Enabling 6G with Integrated Communications & Computing
MediaTek is demonstrating its Hybrid Computing innovation (Integrated Communication & Computing) that brings together a device cloud + RAN as an 'edge cloud', a key technology component proposed for upcoming 6G standardization, that extends ambient computing from device to RAN, achieving low latency in activities such as Generative AI (Gen-AI), carrier-grade privacy & personal data governance, and dynamic computing resource scheduling. The implementations are exhibited in collaboration with NVIDIA, Intel and HTC G REIGNS, respectively.
Ultra Power-Efficient Envelope Assisted RFFE positioned for next-generation wireless products
MediaTek's Envelope Assisted RFFE System increases power amplifier efficiency by
Sub-Band Full Duplex for efficient use of 6G spectrum
Sub-Band Full Duplex (SBFD), a key physical layer technology applicable to 5G-Advanced and 6G, will feature unprecedented improvements in unpaired TDD spectrum, significantly boosting uplink coverage and reducing latency. Both factors are key enablers of new services. In cooperation with Keysight, MediaTek is demonstrating a major technological breakthrough: Mitigating self-interference of SBFD, which is particularly problematic in small devices such as smartphones because of the proximity of the transmitting and receiving antennas.
MediaTek M90 5G Advanced Modem
The upcoming M90 5G-Advanced modem will deliver speeds of up to 12Gbps, support for 3GPP-standard Release 17 and the forthcoming Release 18 specifications, simultaneous FR1+FR2 connectivity, and a novel Smart Antenna technology that leverages AI to enable user scenario identification and significantly boosts data throughput. The M90 utilizes MediaTek UltraSave technology, which reduces average power consumption by up to
Smart AI Antenna
The M90 modem supports Smart AI Antenna, which provides native body proximity sensing without requiring external sensors. The feedback response and intelligent signal analysis can detect how the device is held, as well as its network environment, and it will actively tune the antenna and uplink power to ensure that signal quality is maintained. MediaTek will demonstrate Smart AI Antenna in collaboration with Anritsu at MWC 2025.
Intelligent CPE: Generative AI Gateway
MediaTek is exhibiting its Generative AI infrastructure, consisting of a Gateway and Context Synchronization system. This decentralizes Gen-AI capabilities beyond smartphones and smart home devices, providing Gen-AI functionality to all connected devices. It enhances device capabilities while fostering wider adoption and new service opportunities, all without compromising data privacy and security.
The latest MediaTek-powered CPE devices and modules are also on display from partners. Unique technologies on display include a 1.9x uplink performance boost achieved through three transmission antennas (3TX), applicable across 5G NR band combinations, as well as Low-Latency, Low-Loss, and Scalable throughput (L4S), which reduces network latency by over 20x and minimizes packet loss. These advancements greatly enhance the user experience compared to legacy designs.
Next Generation Satellite (NTN) Connectivity
At the show, MediaTek will present its continuing industry leadership in 5G-Advanced Non-Terrestrial Network (NTN) technology. This next generation of satellite connectivity – Ku-band NR-NTN – will bring a future of ubiquitous broadband connectivity to 5G devices. This follows a recent successful field trial of Ku-band NR-NTN over commercial OneWeb sLow Earth Orbit (LEO) satellite. The field trial was conducted with Eutelsat infrastructure, AIRBUS in-orbit satellites connecting to a MediaTek Ku-band NR-NTN test chip, ITRI NR NTN test gNB, and Sharp array with support by Rodhe & Schwartz testing equipment.
MediaTek Dimensity Auto
With rapid progress in automotive, MediaTek's Dimensity Auto development platform will be at the show, highlighting its leading capabilities in multimedia, 3D graphics, and AI processing capabilities across multiple virtual machines (VMs) on a hypervisor. The innovative eCockpit features an 8K display, and is developed in collaboration with strategic partners, illustrating what people can expect from next-generation in-vehicle experiences.
MediaTek Dimensity 9400
Various smartphones powered by the flagship Dimensity 9400 5G chip will be showcased, demonstrating their leading-edge Generative and Agentic AI applications and services. The showcase will also include the latest advancements in photography and videography, such as AI Audio Focus, AI Telephoto, Best Snapshot capabilities, AI Depth Engine for video playback, and the newest feature rich games with ray-traced graphics.
224G SerDes for ASIC
MediaTek's 224G SerDes represents a significant advancement in technology leadership, offering exceptional performance, reliability, and efficiency. This solution is designed to meet the rigorous interconnect demands of AI, hyperscale computing, data centers, and networking infrastructure. Our SerDes expertise is integral to our ASIC offerings, driving the next generation of AI acceleration and many other interconnect applications. MediaTek SerDes solutions empower ASIC customers with advanced process technology that enhances performance and bandwidth density, making them both power-friendly and cost-effective.
These 224G SerDes solutions are silicon-proven, and development of the next-generation SerDes is already underway. MediaTek collaborates with major foundries on the most advanced process nodes, chip-to-chip interconnect, high-speed I/O, on-package memory, and ultra-large package design. This effort also enables MediaTek to optimize performance, power, and area (PPA) through Design Technology Co-Optimization (DTCO) to best fit customers' domain specific requirements.
To learn more about MediaTek at MWC 2025, please stop by our booth #3D10 or visit: https://www.mediatek.com
About MediaTek Inc.
MediaTek Incorporated (TWSE: 2454) is a global fabless semiconductor company that enables nearly 2 billion connected devices a year. We are a market leader in developing innovative systems-on-chip (SoC) for mobile, home entertainment, connectivity and IoT products. Our dedication to innovation has positioned us as a driving market force in several key technology areas, including highly power-efficient mobile technologies, automotive solutions and a broad range of advanced multimedia products such as smartphones, tablets, digital televisions, 5G, Voice Assistant Devices (VAD) and wearables. MediaTek empowers and inspires people to expand their horizons and achieve their goals through smart technology, more easily and efficiently than ever before. We work with the brands you love to make great technology accessible to everyone, and it drives everything we do. Visit www.mediatek.com for more information.
Media Contact
Kevin Keating
pr@mediatek.com
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SOURCE MediaTek Inc.
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