MediaTek Enhances Flagship AI Performance with Dimensity 9400+ Mobile Platform
MediaTek has unveiled its latest flagship chipset, the Dimensity 9400+, featuring enhanced AI capabilities and performance improvements. The SoC incorporates an All Big Core design with one Arm Cortex-X925 core at 3.73GHz, alongside 3x Cortex-X4 and 4x Cortex-A720 cores.
The chip includes the MediaTek NPU 890, supporting various Large Language Models with features like Mixture-of-Experts, Multi-Head Latent Attention, and 20% faster agentic AI performance. The integrated 12-core Arm Immortalis-G925 GPU brings PC-level gaming features and improved power efficiency.
Key improvements include:
- Extended Bluetooth range up to 10km (6.6x further than previous model)
- 33% faster BeiDou satellite connection
- Wi-Fi 7 tri-band support
- Enhanced Wi-Fi coverage up to 30m with Xtra Range 3.0
- 5G/4G Dual SIM Dual Active capabilities
MediaTek ha svelato il suo ultimo chipset di punta, il Dimensity 9400+, che presenta capacità AI migliorate e miglioramenti delle prestazioni. Il SoC incorpora un design All Big Core con un core Arm Cortex-X925 a 3,73GHz, affiancato da 3 core Cortex-X4 e 4 core Cortex-A720.
Il chip include il MediaTek NPU 890, che supporta vari modelli di linguaggio di grandi dimensioni con funzionalità come Mixture-of-Experts, Multi-Head Latent Attention e prestazioni AI agentiche più veloci del 20%. La GPU Arm Immortalis-G925 integrata a 12 core offre funzionalità di gioco a livello PC e una maggiore efficienza energetica.
I principali miglioramenti includono:
- Portata Bluetooth estesa fino a 10 km (6,6 volte superiore rispetto al modello precedente)
- Connessione satellite BeiDou più veloce del 33%
- Supporto Wi-Fi 7 tri-band
- Copertura Wi-Fi migliorata fino a 30 m con Xtra Range 3.0
- Capacità Dual SIM Dual Active 5G/4G
MediaTek ha presentado su último chipset insignia, el Dimensity 9400+, que cuenta con capacidades de IA mejoradas y mejoras en el rendimiento. El SoC incorpora un diseño All Big Core con un núcleo Arm Cortex-X925 a 3.73GHz, junto con 3 núcleos Cortex-X4 y 4 núcleos Cortex-A720.
El chip incluye el MediaTek NPU 890, que admite varios Modelos de Lenguaje Grande con características como Mixture-of-Experts, Multi-Head Latent Attention y un rendimiento de IA agentica un 20% más rápido. La GPU Arm Immortalis-G925 integrada de 12 núcleos ofrece características de juego a nivel de PC y una mayor eficiencia energética.
Las mejoras clave incluyen:
- Rango de Bluetooth extendido hasta 10 km (6.6 veces más que el modelo anterior)
- Conexión satelital BeiDou un 33% más rápida
- Soporte para Wi-Fi 7 tri-banda
- Mejor cobertura Wi-Fi de hasta 30 m con Xtra Range 3.0
- Capacidades Dual SIM Dual Active 5G/4G
MediaTek는 최신 플래그십 칩셋인 Dimensity 9400+를 공개했습니다. 이 칩셋은 향상된 AI 기능과 성능 개선을 특징으로 합니다. SoC는 3.73GHz에서 작동하는 Arm Cortex-X925 코어와 3개의 Cortex-X4 코어 및 4개의 Cortex-A720 코어를 포함하는 All Big Core 디자인을 채택하고 있습니다.
이 칩에는 다양한 대형 언어 모델을 지원하는 MediaTek NPU 890가 포함되어 있으며, Mixture-of-Experts, Multi-Head Latent Attention과 같은 기능과 20% 더 빠른 에이전틱 AI 성능을 제공합니다. 통합된 12코어 Arm Immortalis-G925 GPU는 PC 수준의 게임 기능과 개선된 전력 효율성을 제공합니다.
주요 개선 사항은 다음과 같습니다:
- 블루투스 범위가 최대 10km로 확장됨 (이전 모델보다 6.6배 더 멀리)
- BeiDou 위성 연결이 33% 더 빨라짐
- Wi-Fi 7 트라이밴드 지원
- Xtra Range 3.0으로 Wi-Fi 범위가 30m까지 향상됨
- 5G/4G 듀얼 SIM 듀얼 액티브 기능
MediaTek a dévoilé son dernier chipset phare, le Dimensity 9400+, qui offre des capacités d'IA améliorées et des améliorations de performance. Le SoC intègre un design All Big Core avec un cœur Arm Cortex-X925 à 3,73GHz, accompagné de 3 cœurs Cortex-X4 et de 4 cœurs Cortex-A720.
Le chip comprend le MediaTek NPU 890, qui prend en charge divers grands modèles de langage avec des fonctionnalités telles que Mixture-of-Experts, Multi-Head Latent Attention et des performances d'IA agentiques 20% plus rapides. Le GPU Arm Immortalis-G925 intégré à 12 cœurs offre des fonctionnalités de jeu de niveau PC et une efficacité énergétique améliorée.
Les principales améliorations comprennent:
- Portée Bluetooth étendue jusqu'à 10 km (6,6 fois plus loin que le modèle précédent)
- Connexion satellite BeiDou 33% plus rapide
- Support tri-bande Wi-Fi 7
- Couverture Wi-Fi améliorée jusqu'à 30 m avec Xtra Range 3.0
- Fonctionnalités Dual SIM Dual Active 5G/4G
MediaTek hat seinen neuesten Flaggschiff-Chipsatz, den Dimensity 9400+, vorgestellt, der verbesserte KI-Fähigkeiten und Leistungsverbesserungen bietet. Der SoC verfügt über ein All Big Core-Design mit einem Arm Cortex-X925-Kern bei 3,73GHz, sowie 3 Cortex-X4-Kernen und 4 Cortex-A720-Kernen.
Der Chip enthält das MediaTek NPU 890, das verschiedene große Sprachmodelle unterstützt, mit Funktionen wie Mixture-of-Experts, Multi-Head Latent Attention und einer um 20% schnelleren agentischen KI-Leistung. Die integrierte 12-Kern Arm Immortalis-G925 GPU bietet PC-ähnliche Gaming-Funktionen und verbesserte Energieeffizienz.
Wichtige Verbesserungen umfassen:
- Erweiterter Bluetooth-Bereich von bis zu 10 km (6,6-mal weiter als das vorherige Modell)
- 33% schnellere BeiDou-Satellitenverbindung
- Wi-Fi 7 Tri-Band-Unterstützung
- Verbesserte Wi-Fi-Abdeckung von bis zu 30 m mit Xtra Range 3.0
- 5G/4G Dual SIM Dual Active-Funktionen
- 20% faster agentic AI performance with enhanced NPU capabilities
- 6.6x extended Bluetooth range (10km) compared to previous model
- 40% improved power efficiency in gaming with MFRC 2.0+
- 33% faster satellite connection speed
- Enhanced Wi-Fi coverage with tri-band support
- None.
Offers impressive on-device Gen-AI and agentic AI capabilities in a power-efficient design
HSINCHU, April 10, 2025 /PRNewswire/ -- MediaTek today announced the Dimensity 9400+ SoC, the latest addition to MediaTek's Dimensity flagship chipset family. Providing exceptional Generative and agentic AI capabilities as well as other performance enhancements, the Dimensity 9400+ supports the latest Large Language Models (LLM) while sustaining a super power-efficient design.
The Dimensity 9400+ features an All Big Core design, integrating one Arm Cortex-X925 core operating up to 3.73GHz, combined with 3x Cortex-X4 and 4x Cortex-A720 cores. This powerful configuration accelerates single and multithreaded performance for top-tier Android UX experiences.
"The MediaTek Dimensity 9400+ will make it easier to deliver innovative, personalized AI experiences on-device, combined with enhanced overall performance to ensure your device can handle all tasks with ease," said JC Hsu, Corporate Senior Vice President at MediaTek. "We are working closely with developers and manufacturers to continue building a robust ecosystem of AI applications and other features that will bring a number of speed and privacy benefits to consumers."
Equipped with the MediaTek NPU 890, the Dimensity 9400+ supports a wide range of LLMs across many regions around the world. The chipset supports Mixture-of-Experts (MoE), Multi-Head Latent Attention (MLA), Multi-Token Prediction (MTP), and FP8 inferencing with faster reasoning speeds. It also offers
The Dimensity 9400+ integrates a 12-core Arm Immortalis-G925 GPU, which enhances gaming visual experiences by bringing PC-level features to smartphones with opacity micromap (OMM) support for realistic effects. This makes video game elements—such as vegetation, hair or feathers—look more realistic and dimensional without impacting performance. The chipset's powerful GPU also sustains peak gameplay speeds, allowing users to game longer without lag. Additionally, the Dimensity 9400+ includes a new frame rate converter 2.0+ (MFRC 2.0+), which was developed in coordination with game developers to double effective FPS and enhances power efficiency by up to
The MediaTek Imagiq 1090 enables HDR video recording across the entire zoom range, allowing users to capture the perfect shot from long distances. MediaTek's Smooth Zoom technology provides seamless capture of moving subjects while allowing users to isolate the image and audio they want in each scene.
Additional features of the Dimensity 9400+ include:
- Expands phone-to-phone direct Bluetooth connections to 10km, extending 6.6 times further than the Dimensity 9400.
- Support for a BeiDou satellite connection, offering
33% faster TTFF (Time to first fix), even without cellular connectivity. - Wi-Fi 7 tri-band concurrency with five streams.
- MediaTek Xtra RangeTM 3.0, which delivers up to 30m greater Wi-Fi coverage.
- 5G/4G Dual SIM Dual Active, Dual Data capabilities to give users more flexibility.
The first smartphones powered by the MediaTek Dimensity 9400+ will be available in the market this month. To learn more about MediaTek's Dimensity portfolio, please visit: https://i.mediatek.com/mediatek-5g.
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About MediaTek Inc.
MediaTek Incorporated (TWSE: 2454) is a global fabless semiconductor company that enables nearly 2 billion connected devices a year. We are a market leader in developing innovative systems-on-chip (SoC) for mobile, home entertainment, connectivity and IoT products. Our dedication to innovation has positioned us as a driving market force in several key technology areas, including highly power-efficient mobile technologies, automotive solutions and a broad range of advanced multimedia products such as smartphones, tablets, digital televisions, 5G, Voice Assistant Devices (VAD) and wearables. MediaTek empowers and inspires people to expand their horizons and achieve their goals through smart technology, more easily and efficiently than ever before. We work with the brands you love to make great technology accessible to everyone, and it drives everything we do. Visit www.mediatek.com for more information.
PR Contact: Kevin Keating, pr@mediatek.com
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SOURCE MediaTek Inc.
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