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MediaTek (MDTKF) is a fabless semiconductor company enabling over 2 billion connected devices yearly.

Specializing in SoC for mobile, home entertainment, and IoT products, MediaTek is at the forefront of innovative and power-efficient mobile technologies.

The company's recent flagship chipset, Dimensity 9300, features an All Big Core design, providing unmatched performance and efficiency for gaming, video capture, and generative AI processing.

By integrating cutting-edge technology like the MediaTek NPU 650 and AI-powered display enhancements, MediaTek continues to push the boundaries of user experience in various markets, including Chromebooks, smart TVs, and more.

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MediaTek's Vice Chairman and CEO Dr. Rick Tsai has been awarded the 2023 Dr. Morris Chang Exemplary Leadership Award by the Global Semiconductor Alliance (GSA). This prestigious recognition highlights Dr. Tsai's remarkable business acumen and influential contributions to the semiconductor industry. Under his leadership, MediaTek has achieved record revenue and expansion in various market segments. Dr. Tsai is also committed to investing in key technologies such as edge AI and automotive.
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MediaTek successfully develops its first chip using TSMC's 3nm technology, with volume production expected next year. TSMC's 3nm process offers up to 18% speed improvement or 32% power reduction compared to its N5 process. MediaTek's flagship Dimensity SoC built with TSMC's 3nm process will empower various devices starting in H2 2024.
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MediaTek partners with Meta to build an edge computing ecosystem for AI application development. MediaTek's use of Llama 2 models enables generative AI applications to run directly on-device, providing advantages such as seamless performance, greater privacy, and lower latency. MediaTek's next-generation flagship chipset will feature optimized software to run Llama 2 and upgraded APU for enhanced performance. Llama 2-based AI applications expected to be available by the end of the year.
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MediaTek has launched its new Dimensity 6000 series along with the Dimensity 6100+ chipset, designed to enhance mainstream 5G devices. The chipset offers premium features and improved power efficiency at an accessible price point. It integrates an enhanced 5G modem, supports AI-powered cameras and 10-bit displays, and reduces power consumption. The first smartphones with the chipset will be available in Q3 2023.
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MediaTek announces partnership with NVIDIA to deliver in-vehicle AI cabin solutions for software-defined vehicles. Collaboration aims to provide advanced AI, connectivity, and computing capabilities for next-generation smart cabins.
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MediaTek showcased its cutting-edge technology at MWC 2023 in Barcelona, emphasizing innovations in 5G and satellite connectivity. Key demonstrations included its 5G Non-Terrestrial Network (NTN) solution for two-way satellite communications and advanced Access Traffic Steering technology, developed in collaboration with Deutsche Telekom. The Dimensity 9200 chipset was highlighted for flagship smartphones, along with new entries in the Dimensity 7000 series. The event underscored MediaTek's leadership in various technology sectors, from IoT to smart home devices, while also showing off its solutions for reliable connectivity across multiple platforms.

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MediaTek has launched the Dimensity 7200, its first chipset in the Dimensity 7000 series, aimed at enhancing mobile gaming and photography. Built on a 4nm process, this octa-core chipset features advanced AI imaging, gaming optimizations, and efficient power management. It supports 200MP cameras, 4K HDR video, and Dual SIM capability with 5G speeds up to 4.7Gbps. The new chipset is set to be available in Q1 2023, marking a significant addition to MediaTek's offerings in connected devices.

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MediaTek has introduced the Genio 700, an octa-core IoT chipset tailored for smart home, retail, and industrial applications, ahead of CES 2023. Built on a 6nm process, it features two ARM A78 cores at 2.2GHz and six ARM A55 cores at 2.0GHz, offering 4.0 TOPs AI acceleration. The Genio 700 supports FHD60+4K60 displays and is designed for scalability with an SDK allowing customization using Yocto Linux, Ubuntu, and Android. Commercial availability is set for Q2 2023.

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MediaTek has successfully completed interoperability testing for Automated Frequency Coordination (AFC) on its Filogic Wi-Fi 7 and Wi-Fi 6E chipsets, in collaboration with Federated Wireless. This testing allows standard power operation for unlicensed devices in the 6 GHz band, enhancing connectivity and range. The tests included both positive and negative assessments to ensure reliability and security. This milestone enables clients to utilize Federated Wireless’ AFC system, pending full FCC approval, paving the way for new Wi-Fi product launches.

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FAQ

What type of devices does MediaTek specialize in?

MediaTek specializes in systems-on-chip (SoC) for mobile, home entertainment, and IoT products.

What is the key feature of MediaTek's Dimensity 9300 chipset?

The Dimensity 9300 features an All Big Core design, providing extreme performance and power efficiency for gaming, video capture, and generative AI processing.

What AI enhancements are present in MediaTek's chipsets?

MediaTek chipsets include advanced AI processors like the NPU 650, enabling interactive multimedia experiences with unparalleled efficiency.

What are some of the AI-powered display technologies offered by MediaTek?

MediaTek provides AI-Super Resolution 3.0, AI-Contrast 2.0, AI-Picture Quality Scene Recognition 2.0+, and AI-Picture Quality Object Recognition 2.5+ to enhance picture quality and streaming performance.

What connectivity solutions does MediaTek offer for its chipsets?

MediaTek provides Filogic Wi-Fi and Bluetooth solutions for reliable high-speed connectivity with low latency in various devices.

Where can I learn more about MediaTek's product portfolio?

Visit MediaTek's official website to explore their innovative SoC products for Chromebooks, smart TVs, smartphones, and other connected devices.

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