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MediaTek (MDTKF) is a fabless semiconductor company enabling over 2 billion connected devices yearly.
Specializing in SoC for mobile, home entertainment, and IoT products, MediaTek is at the forefront of innovative and power-efficient mobile technologies.
The company's recent flagship chipset, Dimensity 9300, features an All Big Core design, providing unmatched performance and efficiency for gaming, video capture, and generative AI processing.
By integrating cutting-edge technology like the MediaTek NPU 650 and AI-powered display enhancements, MediaTek continues to push the boundaries of user experience in various markets, including Chromebooks, smart TVs, and more.
MediaTek showcased a comprehensive ecosystem of Wi-Fi 7 devices at CES 2023, marking a significant step in wireless technology. This includes residential gateways, routers, TVs, and more, all designed for reliable connectivity. Key features include 320MHz channel bandwidth and Multi-Link Operation to enhance user experience. The Filogic 880 chipset, which won a CES 2023 Innovation Award, powers many devices, boasting reduced power consumption and lower latency. Collaborations with major brands like AMD and Lenovo highlight MediaTek's commitment to advancing connectivity.
MediaTek has launched the Dimensity 8200, a premium 5G smartphone chipset, designed for enhanced connectivity, gaming, and multimedia experiences. Built on a power-efficient 4nm process, it features an octa-core CPU and a Mali-G610 graphics engine for superior performance. Key highlights include support for 320MP photos, 14-bit HDR video, and advanced gaming technologies. The chipset will power devices starting December 2022, making flagship features more accessible.
MediaTek has launched the new T800 chipset, designed for super-fast 5G connectivity in sub-6GHz and mmWave networks. This power-efficient solution provides download speeds up to 7.9Gbps and supports dual SIM functionality. The T800 utilizes an advanced 4nm process and integrates various technologies to enhance battery life and reduce development costs. MediaTek aims to expand 5G technology across multiple applications, including Industrial IoT and always-connected PCs.
MediaTek has launched the Dimensity 9200, a next-generation 5G chipset aimed at enhancing flagship smartphones. This SoC features an Arm Cortex X3 with speeds exceeding 3GHz and an Immortalis-G715 GPU that supports hardware-based ray tracing. It highlights 30% power savings with AI-NR and 45% savings with AI-SR. Additionally, it is the first Wi-Fi 7-ready smartphone platform, offering up to 6.5 Gbps data rates. Devices using this chipset are expected to hit the market by the end of 2022, promising improved gaming, imaging, and connectivity experiences.
MediaTek has unveiled the Pentonic 700 chipset, designed for premium 120Hz 4K TVs. This advanced smart TV SoC features an AI processing engine for enhanced picture quality and gaming optimizations. Notable functionalities include Dolby Vision IQ, variable refresh rates up to 144Hz, and support for various video decoding standards. The Pentonic 700 promises to improve user experiences in both home and office environments, facilitating multitasking and immersive viewing. Mainstream 4K smart TVs powered by this chipset are expected to launch in Q4 2022.
MediaTek has unveiled its T830 platform designed for 5G fixed wireless access (FWA) routers and mobile hotspot customer-premise equipment (CPE). This advanced platform integrates the M80 modem supporting Release 16 capabilities for sub-6GHz operations, enabling speeds up to 7Gbps. With an emphasis on energy efficiency and compact design, the T830 reduces development costs and installation complexities for users. Collaboration with Tier-1 operators worldwide aims to enhance connectivity options, leveraging MediaTek's extensive know-how in wireless communications.
MediaTek has unveiled the Dimensity 9000+, an advanced 5G smartphone chipset enhancing performance for flagship devices. This chipset features a 4nm octa-core architecture, boosting CPU performance by over 5% and GPU by more than 10%. It supports 144Hz WQHD+ displays and integrates a leading 3GPP Release-16 5G modem, enabling downlink speeds up to 7Gbps. Enhanced AI and imaging capabilities, alongside improved power efficiency with MediaTek's UltraSave suite, make it a significant upgrade. Smartphones utilizing the Dimensity 9000+ are expected to launch in Q3 2022.
MediaTek has launched the Filogic 880 and Filogic 380, pioneering Wi-Fi 7 platforms targeting high-bandwidth applications.
These chips are set to enhance connectivity in various sectors, including operator, retail, and consumer electronics markets. The Filogic 880 boasts advanced features with speeds reaching 36Gbps, while the Filogic 380 optimizes connectivity for devices like smartphones and TVs. Both platforms support cutting-edge technologies, anticipated to drive Wi-Fi 7 adoption across new markets. MediaTek's commitment to innovation positions it as a leader in the semiconductor industry.
MediaTek has launched its Genio platform aimed at accelerating the development of AIoT devices, featuring the new Genio 1200 chip. Designed for premium applications, the platform offers a complete stack with efficient chipsets and customizable SDKs, facilitating quicker market access for device manufacturers. The Genio 1200 supports 4K displays and advanced imaging features while ensuring high performance with power efficiency. It will be available in H2 2022, aiming to cater to various market demands and enhance the user experience with intelligent autonomous capabilities.
MediaTek has launched the Filogic connectivity family, introducing the Filogic 830 Wi-Fi 6/6E SoC and Filogic 630 NIC solutions. These new chipsets promise high performance with low latency and enhanced connectivity for broadband routers and enterprise access points. The Filogic 830 features a power-efficient 12nm design with dual 4x4 Wi-Fi 6/6E, while the Filogic 630 offers dual-band support with improved range. MediaTek continues to lead in Wi-Fi technology, powering millions of devices and supporting modern applications requiring robust connectivity.
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