MediaTek Launches Dimensity 7200 to Amplify Gaming and Photography Smartphone Experiences
MediaTek has launched the Dimensity 7200, its first chipset in the Dimensity 7000 series, aimed at enhancing mobile gaming and photography. Built on a 4nm process, this octa-core chipset features advanced AI imaging, gaming optimizations, and efficient power management. It supports 200MP cameras, 4K HDR video, and Dual SIM capability with 5G speeds up to 4.7Gbps. The new chipset is set to be available in Q1 2023, marking a significant addition to MediaTek's offerings in connected devices.
- Launch of Dimensity 7200 chipset enhances mobile gaming and photography.
- Utilizes 4nm technology for improved efficiency and performance.
- Supports up to 200MP main cameras and 4K HDR video recording.
- Integrated 5G modem allows speeds up to 4.7Gbps.
- Optimized for power savings, appealing to gamers and photography enthusiasts.
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4nm chipset introduces new Dimensity 7000 series expanding
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The Dimensity 7200 delivers the same TSMC 4nm second-generation process found in the Dimensity 9200, and is ideal for ultra-slim designs in a variety of form factors. The octa-core CPU integrates two Arm Cortex-A715 cores, featuring operating speeds of up to 2.8GHz, with six Cortex-A510 cores, so users can effortlessly multitask and take advantage of peak performance in every app. To further optimize power and performance,
"The MediaTek Dimensity 7000 series will be vital for mobile gamers and photography enthusiasts who are looking for an affordable way to squeeze the most battery life out of their phones without skimping on performance," said CH Chen, Deputy General Manager of
For gamers, the MediaTek HyperEngine 5.0 technology delivers AI-based Variable Rate Shading (VRS) for power savings, CPU and GPU smart resource optimization for better battery life, and other upgrades for smooth gameplay. The chipset also integrates a powerful Arm Mali G610 GPU that supports fast response times and sustains high frame rates.
Utilizing
Dimensity 7200 has a 3GPP Release-16 standard Sub-6GHz 5G modem with up to 4.7Gbps downlink, and supports triband Wi-Fi 6E connectivity and next-gen Bluetooth 5.3. The fully integrated 5G modem and
Additional features of the Dimensity 7200 include:
- Up to 6400Mbps memory frequency and UFS 3.1 for maximum storage.
- MediaTek MiraVision Display with HDR supports the latest standards including HDR10+, CUVA HDR and Dolby HDR.
- Up to Full HD+ and 144Hz for brilliant displays.
- AI SDR-to-HDR video playback for enhanced multimedia experiences.
- Bluetooth LE Audio technology and Dual-Link True Wireless Stereo Audio for wireless earbud support.
Dimensity 7200 will power 5G devices launching in the global market in Q1 2023. To learn more about
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