Welcome to our dedicated page for Acm Research news (Ticker: ACMR), a resource for investors and traders seeking the latest updates and insights on Acm Research stock.
ACM Research, Inc. (ACMR) provides critical semiconductor manufacturing solutions through advanced wafer cleaning and packaging technologies. This page aggregates official announcements and verified news about the company's innovations, partnerships, and market developments.
Investors and industry professionals will find comprehensive coverage of ACMR's progress in developing equipment that addresses key challenges in chip fabrication. Track updates spanning product launches, financial results, and technological breakthroughs that influence semiconductor production efficiency.
Our curated collection includes press releases on single-wafer cleaning systems, advanced packaging solutions, and strategic collaborations within the global semiconductor supply chain. All content is verified for accuracy and relevance to support informed decision-making.
Bookmark this page for streamlined access to ACM Research's latest developments in semiconductor process technology. Check regularly for updates that may impact manufacturing capabilities across logic, memory, and foundry applications.
ACM Research (NASDAQ: ACMR) has received orders for four wafer-level packaging tools from U.S.-based entities. Two tools were ordered by a U.S. customer and two by a U.S. R&D center. These tools support advanced packaging processes like coating, developing, wet etching, and scrubbing. Delivery is scheduled for the first half of 2025. The customer's orders are for first tools subject to technical qualification, potentially leading to follow-on production orders. The R&D center's orders aim to advance wafer-level packaging research and showcase ACM's capabilities to prospective customers. Dr. David Wang, ACM's CEO, views these orders as demonstrating the company's broad range of advanced tools and growing traction with U.S.-based customers.
ACM Research (NASDAQ: ACMR) has launched the Ultra C bev-p panel bevel etching tool for fan-out panel-level packaging (FOPLP) applications. This innovative system is designed for double-sided bevel etching and cleaning in copper-related processes, enhancing efficiency and reliability. The tool can handle panel sizes from 510 mm x 515 mm to 600 mm x 600 mm, with thicknesses of 0.5 mm to 3 mm and warpages up to 10 mm.
Key features include advanced panel handling, efficient copper removal using diluted sulfuric acid and peroxide, and high throughput of 40 panels per hour. The Ultra C bev-p offers bevel control accuracy of ±0.2 mm and an exclusive control range of 0-20 mm. With a mean time between failures of 500 hours and 95% uptime, it ensures exceptional reliability and consistent performance for high-volume production.
ACM Research (NASDAQ: ACMR) reported strong Q2 2024 results, with record revenue of $202.5 million, up 40% year-over-year. The company achieved a gross margin of 47.8% and diluted EPS of $0.35. ACM introduced new products, including a Panel Electrochemical Plating tool for fan-out panel-level packaging. The company raised its 2024 revenue outlook to $695-$735 million and increased its long-term revenue target to $3 billion. ACM also announced plans to purchase a R&D facility with a clean room in Oregon to expand its U.S. footprint.
ACM Research (NASDAQ: ACMR) has launched the Ultra ECP ap-p tool for fan-out panel-level packaging (FOPLP). This innovative system employs horizontal plating for exceptional uniformity across panels, supporting sizes up to 600mm x 600mm. The tool is designed for advanced packaging with sub-micron features, particularly suitable for GPUs and high-density high bandwidth memory (HBM).
Key features include:
- Compatibility with organic and glass substrates
- Capabilities for Cu via filling, Cu pillar, Ni, SnAg plating, and solder bumping
- Proprietary technology for consistent plating across panels
- Advanced automation for efficiency and quality control
ACM believes FOPLP offers substantial growth prospects in meeting demands for low latency, high bandwidth, and cost-efficiency in semiconductor chips.
ACM Research, Inc. (NASDAQ: ACMR) has appointed Howard Chen as General Counsel and Vice President of Corporate Strategy, effective July 1, 2024. Chen, a leading high-tech legal practitioner with over 25 years of experience, brings valuable legal knowledge and industry insight to ACM. Previously, he served as Co-Chair of the China Practice at Greenberg Traurig and has represented numerous global technology companies with significant operations in Asia.
ACM's CEO, Dr. David Wang, expressed confidence that Chen's leadership will enhance the company's legal strategies and IP portfolio, supporting its mission to become a key supplier in the global semiconductor industry. Chen's career began with an engineering role at AMD, and he has since made significant contributions to technology firms globally. His accolades include being named one of the 'Best Lawyers in America' and 'IP Stars'.
ACM Research (NASDAQ: ACMR) has introduced the Ultra C vac-p flux cleaning tool for fan-out panel-level packaging (FOPLP), marking its entry into this growing market. The tool uses vacuum technology and IPA drying to efficiently remove flux residues from chiplet structures, addressing critical cleaning challenges in advanced packaging processes.
ACM has already received and shipped a purchase order from a major Chinese semiconductor manufacturer. The FOPLP market is expected to grow from 2% in 2022 to 8% in 2028, driven by potential cost savings and increased efficiency. The Ultra C vac-p tool's innovative approach ensures thorough cleaning of small bump pitches and large chip sizes, overcoming limitations of traditional methods.
ACM Research (NASDAQ:ACMR) has announced the release date for its second quarter 2024 financial results. The company will unveil its earnings before the U.S. market opens on Wednesday, August 7, 2024. Following the release, ACM will host a conference call at 8:00 a.m. U.S. Eastern Time (8:00 p.m. China Time) to discuss the results.
Participants can join the call via telephone by pre-registering through an online link, which will provide dial-in information and a PIN for access. Alternatively, interested parties can join the webcast directly through ACM's investor relations website. Both live and archived versions of the webcast will be available on the company's website at www.acmrcsh.com.
ACM Research (NASDAQ: ACMR), a leader in wafer processing solutions for semiconductor and advanced wafer-level packaging, announced its upcoming participation in two investor conferences.
On May 29, 2024, ACM Research will attend the Craig-Hallum 21st Annual Institutional Investor Conference in Minneapolis.
On June 26, 2024, the company will participate in the ROTH 10th Annual London Conference at the Four Seasons Park Lane in London.
Management will be available for meetings with institutional investors at both events. Interested parties can request meetings through their institutional sales representatives at the sponsoring banks.
ACM Research reported robust financial results for the first quarter of 2024, showcasing impressive revenue growth of 105% driven by mature node spending, new products, and market share gains. The company's President and CEO, Dr. David Wang, expressed satisfaction with the record shipments and strong profitability. ACM anticipates further growth in 2024 due to its expanding product portfolio and global footprint. The company maintained its revenue guidance range of $650 million to $725 million for fiscal year 2024. ACM also highlighted key operating highlights, including increased shipments, introduction of new products like Frame Wafer Cleaning Tool, and strong financial performance.
ACM Research, a supplier of wafer processing solutions, appointed David Kim as CEO of ACM Research Korea. Kim brings over thirty years of semiconductor experience to the role, with a background at Hyundai Electronics and SK Hynix. His expertise will enhance technology adoption and business growth in Korea, benefiting relationships with local semiconductor manufacturers and supporting global customers.
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