Welcome to our dedicated page for Acm Research news (Ticker: ACMR), a resource for investors and traders seeking the latest updates and insights on Acm Research stock.
ACM Research, Inc. (ACMR) provides critical semiconductor manufacturing solutions through advanced wafer cleaning and packaging technologies. This page aggregates official announcements and verified news about the company's innovations, partnerships, and market developments.
Investors and industry professionals will find comprehensive coverage of ACMR's progress in developing equipment that addresses key challenges in chip fabrication. Track updates spanning product launches, financial results, and technological breakthroughs that influence semiconductor production efficiency.
Our curated collection includes press releases on single-wafer cleaning systems, advanced packaging solutions, and strategic collaborations within the global semiconductor supply chain. All content is verified for accuracy and relevance to support informed decision-making.
Bookmark this page for streamlined access to ACM Research's latest developments in semiconductor process technology. Check regularly for updates that may impact manufacturing capabilities across logic, memory, and foundry applications.
ACM Research (NASDAQ: ACMR), a leading supplier of wafer processing solutions, announced its participation in the 13th Annual NYC Summit 2024. The event will take place on Tuesday, December 17, 2024, at Mastro’s Steakhouse New York. The presentation materials used by ACM will be available on the events page of ACM’s website.
ACM Research (NASDAQ: ACMR) reported strong Q3 2024 results with record revenue of $204 million, up 21% year-over-year. The company achieved a gross margin of 51.4% and diluted EPS of $0.45. Total shipments reached $261 million, up 23% from Q3 2023. ACM has raised its fiscal year 2024 revenue guidance to $725-745 million from the previous $695-735 million range. The company's Ultra C Tahoe cleaning tool achieved a major breakthrough, now matching single-wafer cleaning tool performance while reducing chemical consumption by up to 75%. ACM also expanded its U.S. presence with a new Oregon facility purchase and opened a new R&D facility in Lingang, China.
ACM Research announced significant improvements to its Ultra C Tahoe Cleaning tool for semiconductor manufacturing. The enhanced system combines batch wafer processing and single wafer cleaning chambers, achieving performance comparable to standalone tools while reducing chemical consumption by up to 75%. The upgrade delivers cost savings up to $500,000 annually from sulfuric acid alone. The tool now features a 25-slot bench module and nine single-wafer chambers, achieving throughput exceeding 200 wafers per hour. Currently in production at several facilities in mainland China, the system achieves average particle counts below 6 at 26nm, meeting advanced node manufacturing requirements.
ACM Research (NASDAQ: ACMR) released preliminary unaudited Q3 2024 results, projecting revenue between $200 million to $203 million, representing a 19-20% year-over-year growth. Total shipments are expected to range from $245 million to $255 million, showing a 15-19% year-over-year increase. The company owns 82.0% of ACM Shanghai, which contributes the majority of consolidated revenue and net income. Full financial results will be discussed during the earnings call on November 7, 2024.
ACM Research (NASDAQ: ACMR) has announced its schedule for releasing third quarter 2024 financial results. The company will disclose its preliminary revenue range on October 30, 2024, before the U.S. market opens, coinciding with the reporting obligations of its subsidiary, ACM Research (Shanghai), to the Shanghai Stock Exchange. Full financial results will be released on November 7, 2024, also before the U.S. market opens.
A conference call to discuss the results is scheduled for 8:00 a.m. U.S. Eastern Time (9:00 p.m. China Time) on November 7. Participants can join via telephone by pre-registering through an online link, which will provide dial-in information and a PIN for access. Alternatively, a live webcast will be available on the Investors section of ACM's website.
ACM Research, Inc. (NASDAQ: ACMR) announced that its subsidiary ACM Research (Shanghai) posted backlog figures on the Shanghai Stock Exchange website. As of September 30, 2024, ACM Shanghai's total backlog was RMB 6,764.6 million (USD $964.8 million), compared to RMB 6,795.8 million on September 27, 2023, representing a slight year-over-year decrease of 0.46%.
The backlog includes orders for shipped tools not yet recognized as revenue under Chinese GAAP and orders for future shipments. ACM Shanghai will release its full financial results for the nine months ended September 30, 2024, on October 30, 2024, while ACM will report preliminary results on the same day. Full Q3 2024 financial results and a conference call are scheduled for early November 2024.
ACM Research (NASDAQ: ACMR) has received orders for four wafer-level packaging tools from U.S.-based entities. Two tools were ordered by a U.S. customer and two by a U.S. R&D center. These tools support advanced packaging processes like coating, developing, wet etching, and scrubbing. Delivery is scheduled for the first half of 2025. The customer's orders are for first tools subject to technical qualification, potentially leading to follow-on production orders. The R&D center's orders aim to advance wafer-level packaging research and showcase ACM's capabilities to prospective customers. Dr. David Wang, ACM's CEO, views these orders as demonstrating the company's broad range of advanced tools and growing traction with U.S.-based customers.
ACM Research (NASDAQ: ACMR) has launched the Ultra C bev-p panel bevel etching tool for fan-out panel-level packaging (FOPLP) applications. This innovative system is designed for double-sided bevel etching and cleaning in copper-related processes, enhancing efficiency and reliability. The tool can handle panel sizes from 510 mm x 515 mm to 600 mm x 600 mm, with thicknesses of 0.5 mm to 3 mm and warpages up to 10 mm.
Key features include advanced panel handling, efficient copper removal using diluted sulfuric acid and peroxide, and high throughput of 40 panels per hour. The Ultra C bev-p offers bevel control accuracy of ±0.2 mm and an exclusive control range of 0-20 mm. With a mean time between failures of 500 hours and 95% uptime, it ensures exceptional reliability and consistent performance for high-volume production.
ACM Research (NASDAQ: ACMR) reported strong Q2 2024 results, with record revenue of $202.5 million, up 40% year-over-year. The company achieved a gross margin of 47.8% and diluted EPS of $0.35. ACM introduced new products, including a Panel Electrochemical Plating tool for fan-out panel-level packaging. The company raised its 2024 revenue outlook to $695-$735 million and increased its long-term revenue target to $3 billion. ACM also announced plans to purchase a R&D facility with a clean room in Oregon to expand its U.S. footprint.
ACM Research (NASDAQ: ACMR) has launched the Ultra ECP ap-p tool for fan-out panel-level packaging (FOPLP). This innovative system employs horizontal plating for exceptional uniformity across panels, supporting sizes up to 600mm x 600mm. The tool is designed for advanced packaging with sub-micron features, particularly suitable for GPUs and high-density high bandwidth memory (HBM).
Key features include:
- Compatibility with organic and glass substrates
- Capabilities for Cu via filling, Cu pillar, Ni, SnAg plating, and solder bumping
- Proprietary technology for consistent plating across panels
- Advanced automation for efficiency and quality control
ACM believes FOPLP offers substantial growth prospects in meeting demands for low latency, high bandwidth, and cost-efficiency in semiconductor chips.
