Welcome to our dedicated page for Acm Research news (Ticker: ACMR), a resource for investors and traders seeking the latest updates and insights on Acm Research stock.
Overview
ACM Research, Inc. is a pioneering company specializing in the design, manufacture, and sale of advanced semiconductor process equipment. Established in 1998 and headquartered in Fremont, California, ACM Research has built a robust reputation in developing innovative single-wafer wet cleaning equipment, as well as advanced packaging systems that are critical to modern chip fabrication.
Industry and Market Position
Operating in the highly competitive semiconductor equipment industry, ACM Research addresses the critical need for precision cleaning and packaging in the production of integrated circuits. Their products are engineered to enhance manufacturing yields and ensure process reliability for a variety of semiconductor devices including logic, foundry, and memory chips. By leveraging cutting-edge technologies such as megasonic cleaning and advanced etching solutions, the company meets the rigorous demands of fabricators striving for higher integration density and cost-effectiveness.
Business Model and Operations
The company generates revenue primarily through the sale of its high-performance cleaning and packaging tools, marketed under the Ultra C brand name. Its products are sold both directly via its own sales force and indirectly through third-party representatives, ensuring a wide market reach across different geographic regions. ACM Research’s solutions are distinctly designed for single-wafer as well as batch processing, featuring capabilities that extend from front-end cleaning operations to back-end assembly and packaging processes.
Technology and Innovation
At the heart of ACM Research’s offerings is its commitment to technological excellence and innovation. The firm’s single-wafer wet cleaning systems employ space alternated phase of megasonic waves to deliver uniform cleaning on both flat and patterned wafer surfaces at a microscopic level. This novel approach not only improves product yields but also ensures process consistency across a range of advanced nodes. Furthermore, their advanced equipment for bevel etching and copper residue removal plays a pivotal role in maintaining the integrity of semiconductor devices during the packaging stage.
Product Applications and Customer Impact
ACM Research’s equipment is essential for multiple steps in semiconductor manufacturing. Fabricators use its solutions to optimize cleaning, perform precise etching, and enhance electrochemical plating processes. This versatility positions ACM Research as a critical partner to chip manufacturers looking to meet the stringent quality demands of modern semiconductor fabrication. Customers in industries ranging from dynamic random-access memory (DRAM) to 3D NAND-flash memory chips benefit from its high-performance tools that are engineered for both efficiency and reliability.
Competitive Differentiation
What sets ACM Research apart in the semiconductor process equipment space is its focus on customized, process-specific solutions that address the unique challenges of wafer-level manufacturing. Its patented technologies and innovative design approaches ensure high cleaning accuracy, reduced contamination risks, and enhanced process yield across various applications. This technical edge, combined with a global direct sales network and robust after-sales support, has cemented its position among established players in the market.
Commitment to Quality and Process Optimization
ACM Research maintains a steadfast commitment to delivering cost-effective and efficient process solutions. Their equipment not only enhances the overall productivity and yield of semiconductor manufacturing but also supports the industry's continuous drive for higher precision and integration density. Through rigorous R&D and quality assurance programs, ACM Research has consistently demonstrated its expertise and trustworthiness as a technology provider.
Conclusion
In summary, ACM Research, Inc. is a key contributor to the semiconductor manufacturing ecosystem through its advanced wafer cleaning, etching, and packaging solutions. Its focus on technological innovation, combined with a well-established operational model, makes it a vital partner for manufacturers aiming to improve efficiency and product yield in an increasingly demanding industry landscape.
ACM Research announced significant improvements to its Ultra C Tahoe Cleaning tool for semiconductor manufacturing. The enhanced system combines batch wafer processing and single wafer cleaning chambers, achieving performance comparable to standalone tools while reducing chemical consumption by up to 75%. The upgrade delivers cost savings up to $500,000 annually from sulfuric acid alone. The tool now features a 25-slot bench module and nine single-wafer chambers, achieving throughput exceeding 200 wafers per hour. Currently in production at several facilities in mainland China, the system achieves average particle counts below 6 at 26nm, meeting advanced node manufacturing requirements.
ACM Research (NASDAQ: ACMR) released preliminary unaudited Q3 2024 results, projecting revenue between $200 million to $203 million, representing a 19-20% year-over-year growth. Total shipments are expected to range from $245 million to $255 million, showing a 15-19% year-over-year increase. The company owns 82.0% of ACM Shanghai, which contributes the majority of consolidated revenue and net income. Full financial results will be discussed during the earnings call on November 7, 2024.
ACM Research (NASDAQ: ACMR) has announced its schedule for releasing third quarter 2024 financial results. The company will disclose its preliminary revenue range on October 30, 2024, before the U.S. market opens, coinciding with the reporting obligations of its subsidiary, ACM Research (Shanghai), to the Shanghai Stock Exchange. Full financial results will be released on November 7, 2024, also before the U.S. market opens.
A conference call to discuss the results is scheduled for 8:00 a.m. U.S. Eastern Time (9:00 p.m. China Time) on November 7. Participants can join via telephone by pre-registering through an online link, which will provide dial-in information and a PIN for access. Alternatively, a live webcast will be available on the Investors section of ACM's website.
ACM Research, Inc. (NASDAQ: ACMR) announced that its subsidiary ACM Research (Shanghai) posted backlog figures on the Shanghai Stock Exchange website. As of September 30, 2024, ACM Shanghai's total backlog was RMB 6,764.6 million (USD $964.8 million), compared to RMB 6,795.8 million on September 27, 2023, representing a slight year-over-year decrease of 0.46%.
The backlog includes orders for shipped tools not yet recognized as revenue under Chinese GAAP and orders for future shipments. ACM Shanghai will release its full financial results for the nine months ended September 30, 2024, on October 30, 2024, while ACM will report preliminary results on the same day. Full Q3 2024 financial results and a conference call are scheduled for early November 2024.
ACM Research (NASDAQ: ACMR) has received orders for four wafer-level packaging tools from U.S.-based entities. Two tools were ordered by a U.S. customer and two by a U.S. R&D center. These tools support advanced packaging processes like coating, developing, wet etching, and scrubbing. Delivery is scheduled for the first half of 2025. The customer's orders are for first tools subject to technical qualification, potentially leading to follow-on production orders. The R&D center's orders aim to advance wafer-level packaging research and showcase ACM's capabilities to prospective customers. Dr. David Wang, ACM's CEO, views these orders as demonstrating the company's broad range of advanced tools and growing traction with U.S.-based customers.
ACM Research (NASDAQ: ACMR) has launched the Ultra C bev-p panel bevel etching tool for fan-out panel-level packaging (FOPLP) applications. This innovative system is designed for double-sided bevel etching and cleaning in copper-related processes, enhancing efficiency and reliability. The tool can handle panel sizes from 510 mm x 515 mm to 600 mm x 600 mm, with thicknesses of 0.5 mm to 3 mm and warpages up to 10 mm.
Key features include advanced panel handling, efficient copper removal using diluted sulfuric acid and peroxide, and high throughput of 40 panels per hour. The Ultra C bev-p offers bevel control accuracy of ±0.2 mm and an exclusive control range of 0-20 mm. With a mean time between failures of 500 hours and 95% uptime, it ensures exceptional reliability and consistent performance for high-volume production.
ACM Research (NASDAQ: ACMR) reported strong Q2 2024 results, with record revenue of $202.5 million, up 40% year-over-year. The company achieved a gross margin of 47.8% and diluted EPS of $0.35. ACM introduced new products, including a Panel Electrochemical Plating tool for fan-out panel-level packaging. The company raised its 2024 revenue outlook to $695-$735 million and increased its long-term revenue target to $3 billion. ACM also announced plans to purchase a R&D facility with a clean room in Oregon to expand its U.S. footprint.
ACM Research (NASDAQ: ACMR) has launched the Ultra ECP ap-p tool for fan-out panel-level packaging (FOPLP). This innovative system employs horizontal plating for exceptional uniformity across panels, supporting sizes up to 600mm x 600mm. The tool is designed for advanced packaging with sub-micron features, particularly suitable for GPUs and high-density high bandwidth memory (HBM).
Key features include:
- Compatibility with organic and glass substrates
- Capabilities for Cu via filling, Cu pillar, Ni, SnAg plating, and solder bumping
- Proprietary technology for consistent plating across panels
- Advanced automation for efficiency and quality control
ACM believes FOPLP offers substantial growth prospects in meeting demands for low latency, high bandwidth, and cost-efficiency in semiconductor chips.
ACM Research, Inc. (NASDAQ: ACMR) has appointed Howard Chen as General Counsel and Vice President of Corporate Strategy, effective July 1, 2024. Chen, a leading high-tech legal practitioner with over 25 years of experience, brings valuable legal knowledge and industry insight to ACM. Previously, he served as Co-Chair of the China Practice at Greenberg Traurig and has represented numerous global technology companies with significant operations in Asia.
ACM's CEO, Dr. David Wang, expressed confidence that Chen's leadership will enhance the company's legal strategies and IP portfolio, supporting its mission to become a key supplier in the global semiconductor industry. Chen's career began with an engineering role at AMD, and he has since made significant contributions to technology firms globally. His accolades include being named one of the 'Best Lawyers in America' and 'IP Stars'.
ACM Research (NASDAQ: ACMR) has introduced the Ultra C vac-p flux cleaning tool for fan-out panel-level packaging (FOPLP), marking its entry into this growing market. The tool uses vacuum technology and IPA drying to efficiently remove flux residues from chiplet structures, addressing critical cleaning challenges in advanced packaging processes.
ACM has already received and shipped a purchase order from a major Chinese semiconductor manufacturer. The FOPLP market is expected to grow from 2% in 2022 to 8% in 2028, driven by potential cost savings and increased efficiency. The Ultra C vac-p tool's innovative approach ensures thorough cleaning of small bump pitches and large chip sizes, overcoming limitations of traditional methods.
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