ACM Research Strengthens its Fan-Out Panel Level Packaging Portfolio with Launch of Ultra ECP ap-p Tool
ACM Research (NASDAQ: ACMR) has launched the Ultra ECP ap-p tool for fan-out panel-level packaging (FOPLP). This innovative system employs horizontal plating for exceptional uniformity across panels, supporting sizes up to 600mm x 600mm. The tool is designed for advanced packaging with sub-micron features, particularly suitable for GPUs and high-density high bandwidth memory (HBM).
Key features include:
- Compatibility with organic and glass substrates
- Capabilities for Cu via filling, Cu pillar, Ni, SnAg plating, and solder bumping
- Proprietary technology for consistent plating across panels
- Advanced automation for efficiency and quality control
ACM believes FOPLP offers substantial growth prospects in meeting demands for low latency, high bandwidth, and cost-efficiency in semiconductor chips.
ACM Research (NASDAQ: ACMR) ha lanciato lo strumento Ultra ECP ap-p per il packaging a livello di pannello fan-out (FOPLP). Questo sistema innovativo utilizza placcatura orizzontale per una straordinaria uniformità tra i pannelli, supportando dimensioni fino a 600mm x 600mm. Lo strumento è progettato per pacchetti avanzati con caratteristiche sottomicroniche, particolarmente adatto per GPU e memoria ad alta densità e alta larghezza di banda (HBM).
Le caratteristiche principali includono:
- Compatibilità con substrati organici e in vetro
- Capacità di riempimento via Cu, pilastri in Cu, placcatura Ni, SnAg, e bumping di saldatura
- Tecnologia proprietaria per una placcatura consistente tra i pannelli
- Automazione avanzata per efficienza e controllo della qualità
ACM crede che il FOPLP offra significative prospettive di crescita per soddisfare le esigenze di bassa latenza, alta larghezza di banda e efficienza dei costi nei chip semiconduttori.
ACM Research (NASDAQ: ACMR) ha lanzado la herramienta Ultra ECP ap-p para el empaquetado a nivel de panel fan-out (FOPLP). Este sistema innovador emplea platado horizontal para una excepcional uniformidad a través de los paneles, soportando tamaños de hasta 600mm x 600mm. La herramienta está diseñada para empaquetados avanzados con características submicrónicas, particularmente adecuada para GPU y memoria de alta densidad y alta ancho de banda (HBM).
Las características clave incluyen:
- Compatibilidad con sustratos orgánicos y de vidrio
- Capacidades de relleno de vía Cu, pilar Cu, platinado Ni, SnAg, y bumping de soldadura
- Tecnología propietaria para un platinado consistente en los paneles
- Automatización avanzada para eficiencia y control de calidad
ACM cree que el FOPLP ofrece perspectivas de crecimiento sustanciales para satisfacer las demandas de baja latencia, alta ancho de banda y eficiencia de costos en los chips semiconductores.
ACM 리서치(NASDAQ: ACMR)는 팬 아웃 패널 레벨 패키징(FOPLP)을 위한 Ultra ECP ap-p 도구를 출시했습니다. 이 혁신적인 시스템은 패널 전반에 걸쳐 뛰어난 균일성을 지원하는 수평 도금을 사용하며, 최대 600mm x 600mm 크기를 지원합니다. 이 도구는 서브 마이크론 기능으로 첨단 패키징을 위해 설계되었으며, GPU 및 고밀도 고대역폭 메모리(HBM)에 특히 적합합니다.
주요 기능은 다음과 같습니다:
- 유기 및 유리 기판과의 호환성
- Cu 비아 충전, Cu 파일러, Ni, SnAg 도금 및 솔더 범핑 기능
- 패널 간 일관된 도금을 위한 독점 기술
- 효율성 및 품질 관리를 위한 고급 자동화
ACM은 FOPLP가 반도체 칩의 저지연, 고대역폭 및 비용 효율성 요구를 충족하는 데 상당한 성장 가능성을 제공한다고 믿고 있습니다.
ACM Research (NASDAQ: ACMR) a lancé l'outil Ultra ECP ap-p pour l'emballage à niveau de panneau en sortie de ventilateur (FOPLP). Ce système innovant utilise le plaquage horizontal pour une uniformité exceptionnelle à travers les panneaux, supportant des tailles allant jusqu'à 600 mm x 600 mm. L'outil est conçu pour un emballage avancé avec des caractéristiques submicrométriques, particulièrement adapté aux GPU et à la mémoire à haute densité et à haute bande passante (HBM).
Les caractéristiques clés incluent :
- Compatibilité avec les substrats organiques et en verre
- Capacités de remplissage de via en Cu, pilier en Cu, plaquage Ni, SnAg, et bumping de soudure
- Technologie propriétaire pour un plaquage constant à travers les panneaux
- Automatisation avancée pour l'efficacité et le contrôle de qualité
ACM pense que le FOPLP offre des perspectives de croissance substantielles pour répondre aux demandes de faible latence, de haute bande passante et d'efficacité des coûts dans les puces semi-conductrices.
ACM Research (NASDAQ: ACMR) hat das Ultra ECP ap-p Werkzeug für das Fan-Out-Paketieren auf Panel-Ebene (FOPLP) eingeführt. Dieses innovative System nutzt horizontale Galvanik für eine außergewöhnliche Gleichmäßigkeit über die Panels, die Größene bis zu 600mm x 600mm unterstützt. Das Werkzeug ist für fortschrittliches Verpacken mit submikronischen Merkmalen konzipiert und besonders geeignet für GPUs sowie hochdichte Hochbandbreiten-Speicher (HBM).
Zu den Hauptmerkmalen gehören:
- Kompatibilität mit organischen und Glas-Substraten
- Fähigkeiten zur Cu-Via-Füllung, Cu-Säulen, Ni-, SnAg-Galvanik und Löt-Bumping
- Eigene Technologie für gleichmäßige Galvanik über die Panels
- Fortschrittliche Automatisierung für Effizienz und Qualitätskontrolle
ACM ist der Überzeugung, dass das FOPLP beträchtliche Wachstumsmöglichkeiten bietet, um den Anforderungen an geringe Latenz, hohe Bandbreite und Kosteneffizienz bei Halbleiterchips gerecht zu werden.
- Launch of new Ultra ECP ap-p tool for fan-out panel-level packaging
- Tool supports large panel sizes up to 600mm x 600mm
- Horizontal plating approach achieves exceptional uniformity and precision
- Compatible with both organic and glass substrates
- Advanced automation features enhance efficiency and quality control
- None.
Insights
ACM Research's launch of the Ultra ECP ap-p tool for fan-out panel-level packaging (FOPLP) is a significant development in the advanced packaging sector. This tool's horizontal plating approach for large panels (515mm x 510mm, expandable to 600mm x 600mm) addresses the growing demand for high-density, high-bandwidth chip connections, particularly relevant for GPUs and high-bandwidth memory (HBM).
The tool's compatibility with both organic and glass substrates, along with its capabilities for various plating processes (Cu, Ni, SnAg, Au), positions ACM well in the high-density fan-out (HDFO) market. The proprietary technology for optimizing electrical fields and the horizontal configuration could provide ACM with a competitive edge in producing large panels with sub-micron redistribution layers and micro-pillars.
While this launch strengthens ACM's portfolio, its market impact will depend on adoption rates and performance in real-world applications. Investors should monitor customer traction and revenue contribution in upcoming quarters to gauge the tool's success.
The introduction of the Ultra ECP ap-p tool could potentially boost ACM Research's revenue streams in the growing advanced packaging market. With the global chip packaging market expected to reach
However, investors should note that the financial impact may not be immediate. The tool's success will depend on customer adoption rates and the speed at which it can be integrated into existing manufacturing processes. Additionally, the semiconductor equipment market is highly competitive and ACM will need to demonstrate clear performance advantages to gain significant traction.
While this launch is promising, it's important to assess its contribution to ACM's overall revenue mix in future earnings reports. The company's ability to scale production and maintain margins on this new product line will be key factors to watch.
System delivers exceptional uniformity, enabling performance and cost efficiencies for next generation chip packaging
FREMONT, Calif., Aug. 07, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced its new Panel Electrochemical Plating (Ultra ECP ap-p) tool designed for fan-out panel-level packaging (FOPLP). This new tool employs a horizontal plating approach achieving exceptional uniformity and precision across the entire panel.
“As demands for low latency, high bandwidth and cost-efficiency in semiconductor chips intensify, advanced packaging technologies like FOPLP are becoming increasingly critical,” said Dr. David Wang, ACM’s President and Chief Executive Officer. “We believe FOPLP, with its capability to facilitate high-density, high bandwidth chip-to-chip connections, offers substantial growth prospects. We believe the Ultra ECP ap-p tool is amongst the first to employ horizontal plating for panel applications, drawing upon ACM’s deep-rooted expertise in wafer plating and copper processes. We believe the tool will strengthen the market, enabling advanced packaging with sub-micron features on large panels, which are especially applicable to GPUs and high-density high bandwidth memory (HBM).”
The Ultra ECP ap-p tool supports 515mm x 510mm panel sizes, with an option to expand to 600mm x 600mm. It is compatible with both organic and glass substrates and includes capabilities for copper (Cu) via filling, Cu pillar, nickel (Ni), tin-silver (SnAg) plating, and solder bumping. It accommodates high-density fan-out (HDFO) products requiring Cu, Ni, SnAg and gold plating.
ACM’s proprietary technology optimizes the management of electrical fields, ensuring consistent and uniform plating across the panel. The horizontal configuration of the tool reduces the risk of cross-contamination between baths, enhancing control and cleanliness, crucial for producing large panels with sub-micron redistribution layers (RDLs) and micro-pillars.
The Ultra ECP ap-p tool incorporates advanced automation features that enhance efficiency and quality control throughout the manufacturing process. This automation not only mirrors traditional wafer processing steps but also adapts them for larger and heavier panels, including critical operations like panel flipping for correct orientation and face-down plating.
Forward-Looking Statements
Certain statements contained in this press release are not historical facts and may be forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Words such as “plans,” “expects,” “believes,” “anticipates,” “designed,” and similar words are intended to identify forward-looking statements. Forward-looking statements are based on ACM management’s current expectations and beliefs, and involve a number of risks and uncertainties that are difficult to predict and that could cause actual results to differ materially from those stated or implied by the forward-looking statements. A description of certain of these risks, uncertainties and other matters can be found in filings ACM makes with the U.S. Securities and Exchange Commission, all of which are available at www.sec.gov. Because forward-looking statements involve risks and uncertainties, actual results and events may differ materially from results and events currently expected by ACM. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date hereof. ACM undertakes no obligation to publicly update these forward-looking statements to reflect events or circumstances that occur after the date hereof or to reflect any change in its expectations with regard to these forward-looking statements or the occurrence of unanticipated events.
About ACM Research, Inc.
ACM develops, manufactures and sells semiconductor process equipment for single-wafer or batch wet cleaning, electroplating, stress-free polishing, vertical furnace processes, Track and PECVD, which are critical to advanced semiconductor device manufacturing and wafer-level packaging. ACM is committed to delivering customized, high-performance, cost-effective process solutions that semiconductor manufacturers can use in numerous manufacturing steps to improve productivity and product yield. For more information, visit www.acmrcsh.com.
© ACM Research, Inc. The ACM Research logo is trademark of ACM Research, Inc. For convenience, these trademarks appear in this press release without ™ symbols, but that practice does not mean ACM will not assert, to the fullest extent under applicable law, its rights to such trademarks. All other trademarks are the property of their respective owners.
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FAQ
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