ACM Research Announces Qualification of High-Temperature SPM Tool for Customer in China
ACM Research (NASDAQ: ACMR) announced the qualification of its Single-Wafer High-Temperature Sulfuric Peroxide Mixture (SPM) tool by a major logic device manufacturer in China. The company has delivered SPM tools to thirteen customers, featuring a proprietary nozzle design that prevents acid mist splatter and improves system performance.
The tool supports wet etching and wafer cleaning for both front- and back-end processes at 28-nanometer and below technology nodes. It operates at various temperature ranges, from 90°C for sulfuric acid cleaning to 190°C for metal lift-off processes. Key features include a multi-level heating method maintaining temperatures above 230℃ and superior particle control with fewer than 10 particles at 26nm.
The system includes an inline chemical mixing system and can be integrated with ACM's SAPS and TEBO megasonic technologies for enhanced organic contaminant removal.
ACM Research (NASDAQ: ACMR) ha annunciato la qualificazione del suo strumento per miscele di perossido di zolfo ad alta temperatura per wafer singoli (SPM) da parte di un importante produttore di dispositivi logici in Cina. L'azienda ha consegnato strumenti SPM a tredici clienti, caratterizzati da un design di ugello proprietario che previene gli spruzzi di nebbia acida e migliora le prestazioni del sistema.
Lo strumento supporta l'incisione umida e la pulizia dei wafer per i processi sia di front-end che di back-end a 28 nanometri e oltre. Funziona a diverse temperature, da 90°C per la pulizia con acido solforico a 190°C per i processi di sollevamento dei metalli. Tra le caratteristiche principali vi sono un metodo di riscaldamento multi-livello che mantiene temperature superiori a 230℃ e un controllo delle particelle superiore con meno di 10 particelle a 26nm.
Il sistema include un sistema di miscelazione chimica inline e può essere integrato con le tecnologie megasoniche SAPS e TEBO di ACM per una rimozione migliorata dei contaminanti organici.
ACM Research (NASDAQ: ACMR) anunció la calificación de su herramienta de mezcla de peróxido de azufre a alta temperatura para wafers individuales (SPM) por parte de un importante fabricante de dispositivos lógicos en China. La empresa ha entregado herramientas SPM a trece clientes, con un diseño de boquilla propietario que evita las salpicaduras de neblina ácida y mejora el rendimiento del sistema.
La herramienta admite grabado húmedo y limpieza de wafers para procesos de front-end y back-end a 28 nanómetros y por debajo. Funciona en varios rangos de temperatura, desde 90°C para la limpieza con ácido sulfúrico hasta 190°C para procesos de despegue de metales. Las características clave incluyen un método de calefacción de múltiples niveles que mantiene temperaturas superiores a 230℃ y un control superior de partículas con menos de 10 partículas a 26nm.
El sistema incluye un sistema de mezcla química en línea y puede integrarse con las tecnologías megasonicas SAPS y TEBO de ACM para una mejor eliminación de contaminantes orgánicos.
ACM Research (NASDAQ: ACMR)는 중국의 주요 로직 장치 제조업체에 의해 단일 웨이퍼 고온 황산 과산화물 혼합물(SPM) 도구의 자격을 발표했습니다. 이 회사는 산 mist 튀는 것을 방지하고 시스템 성능을 향상시키는 독점 노즐 디자인을 특징으로 하는 SPM 도구를 13명의 고객에게 전달했습니다.
이 도구는 28나노미터 이하 기술 노드의 전후 공정 모두에 대해 습식 에칭 및 웨이퍼 세정을 지원합니다. 이 도구는 황산 세정을 위한 90°C에서 금속 리프트 오프 공정을 위한 190°C까지 다양한 온도 범위에서 작동합니다. 주요 기능으로는 230℃ 이상의 온도를 유지하는 다단계 가열 방식과 26nm에서 10개 미만의 입자를 가진 우수한 입자 제어가 포함됩니다.
이 시스템은 인라인 화학 혼합 시스템을 포함하며, 유기 오염물 제거를 향상시키기 위해 ACM의 SAPS 및 TEBO 메가소닉 기술과 통합될 수 있습니다.
ACM Research (NASDAQ: ACMR) a annoncé la qualification de son outil de mélange de peroxyde de soufre à haute température pour wafer unique (SPM) par un important fabricant de dispositifs logiques en Chine. L'entreprise a livré des outils SPM à treize clients, avec un design de buse propriétaire qui empêche les éclaboussures de brouillard acide et améliore les performances du système.
L'outil prend en charge la gravure humide et le nettoyage des wafers pour les processus de front-end et de back-end à 28 nanomètres et moins. Il fonctionne à différentes plages de température, de 90°C pour le nettoyage à l'acide sulfurique à 190°C pour les processus de décollage des métaux. Parmi les caractéristiques clés, on trouve une méthode de chauffage multi-niveaux maintenant des températures supérieures à 230℃ et un contrôle supérieur des particules avec moins de 10 particules à 26nm.
Le système comprend un système de mélange chimique en ligne et peut être intégré aux technologies megasoniques SAPS et TEBO d'ACM pour une meilleure élimination des contaminants organiques.
ACM Research (NASDAQ: ACMR) gab die Qualifizierung seines Einzel-Wafer-Hochtemperatur-Schwefelsäure-Peroxid-Gemisch (SPM)-Werkzeugs durch einen großen Logikgerätehersteller in China bekannt. Das Unternehmen hat SPM-Werkzeuge an dreizehn Kunden geliefert, die über ein proprietäres Düsendesign verfügen, das Spritzer von Säurenebel verhindert und die Systemleistung verbessert.
Das Werkzeug unterstützt das Nassätzen und die Waferreinigung sowohl für Front- als auch für Back-End-Prozesse bei 28-Nanometer und darunter. Es arbeitet in verschiedenen Temperaturbereichen, von 90°C für die Reinigung mit Schwefelsäure bis 190°C für Metallabhebungsprozesse. Zu den Hauptmerkmalen gehören ein mehrstufiges Heizverfahren, das Temperaturen über 230℃ aufrechterhält, und eine überlegene Partikelkontrolle mit weniger als 10 Partikeln bei 26nm.
Das System umfasst ein Inline-Chemikalienmischsystem und kann mit den megasonischen Technologien SAPS und TEBO von ACM zur verbesserten Entfernung organischer Verunreinigungen integriert werden.
- Qualification achieved with major logic device manufacturer in China
- 13 customers already received SPM tool deliveries
- Proprietary nozzle design improves particle performance and system uptime
- Advanced temperature control exceeding 230℃
- Superior particle control (<10 particles at 26nm)
- None.
Insights
ACM Research's qualification of its High-Temperature SPM tool by a key logic manufacturer in China represents a significant technological milestone. The company has already delivered this tool to thirteen customers, suggesting strong initial market acceptance. Their proprietary nozzle design effectively addresses several critical challenges in advanced node manufacturing by preventing acid mist splatter—directly improving particle performance, reducing maintenance requirements, and enhancing system uptime.
This tool serves both front-end and back-end processes at 28nm and below technology nodes, positioning ACM in the advanced semiconductor manufacturing space. The multi-level heating method that maintains temperatures above 230°C and their particle control system (averaging fewer than 10 particles at 26nm) represent meaningful technical advantages as process requirements become more stringent.
Particularly noteworthy is how this product addresses the increasing demand for single-wafer high-temperature sulfuric acid processing as semiconductor nodes advance. The integration capabilities with ACM's patented SAPS and TEBO megasonic technologies create a more comprehensive offering that enhances organic contaminant removal and improves wafer surface preparation—critical factors for yield at advanced nodes.
This qualification represents a tangible commercial breakthrough for ACM in the high-growth wet process equipment segment. Securing qualification from a key logic manufacturer in China not only validates their technology but also strengthens their competitive position in a market where process tool qualification is a significant barrier to entry.
The announcement of thirteen customer deliveries indicates meaningful market penetration, with additional evaluation customers in the pipeline suggesting further growth potential. This product addresses the higher-value segments of the cleaning market, as high-temperature SPM tools are increasingly critical for advanced node manufacturing where margins tend to be stronger.
From a competitive standpoint, ACM's proprietary technologies provide differentiation in a market dominated by larger players. The company is successfully leveraging its innovative design to solve specific manufacturing challenges that become more pronounced at advanced nodes. Their focus on the mainland China market is strategically sound given China's aggressive semiconductor capacity expansion and the geopolitical dynamics limiting some Western equipment vendors' access to this market.
This qualification should translate to improved financial performance as these tools transition from qualification to high-volume manufacturing deployment, potentially expanding ACM's addressable market within their existing customer base.
Strong Pipeline of Additional Evaluation Customers
FREMONT, Calif., March 03, 2025 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced packaging applications, today announced its Single-Wafer High-Temperature Sulfuric Peroxide Mixture (SPM) tool has been qualified by a key logic device manufacturer in mainland China. To date, ACM has delivered its SPM tools to thirteen customers. The system features ACM’s proprietary nozzle design, which prevents acid mist splatter during the SPM process, improving particle performance, reducing chamber preventive maintenance cleaning frequency, and enhancing system uptime. It supports wet etching and wafer cleaning for both front- and back-end processes at 28-nanometer (nm) and below technology nodes.
“The Single-Wafer Moderate/High-Temperature SPM tool is a prime example of ACM’s commitment to innovation in solving customers’ challenges in high-volume 300mm semiconductor manufacturing. We’re already seeing great interest across our global customer base in this tool,” said Dr. David Wang, ACM’s President and Chief Executive Officer. “The Moderate/High-Temperature SPM represents a growing portion of the wafer-cleaning equipment market, especially High-Temperature SPM tool, which plays a critical role in manufacturing next-generation semiconductor devices.”
ACM’s Single-Wafer Moderate/High-Temperature SPM tool is suitable for a variety of front- and back-end wet etching and cleaning processes, including low-to-medium temperature sulfuric acid cleaning at 90 degrees Celsius (°C), high-temperature sulfuric acid photoresist stripping at 170°C, and ultra-high temperature sulfuric acid metal lift-off at 190°C. As semiconductor process nodes advance, the demand for single-wafer high-temperature sulfuric acid processing is increasing significantly. This trend brings increasingly stringent requirements for particle control, chamber environment management, and sulfuric acid temperature stability. In response to these challenges, ACM has introduced an innovative design for its Single-Wafer Moderate/High-Temperature SPM tool, positioning it as a ready-to-deploy solution to meet the evolving needs of the industry. ACM’s proprietary technologies integrated into the tool include:
- A multi-level heating method that ensures the highest mixed temperature exceeds 230℃ and is steadily controlled.
- An SPM nozzle design that prevents high-temperature SPM from splashing outside the chamber; it achieves better particle control with an average particle count of fewer than 10 at 26nm.
The Single-Wafer Moderate/High-Temperature SPM tool is equipped with an inline chemical mixing system and a configurable process chamber that accommodates various chemical solutions. It can also be seamlessly integrated with ACM's patented SAPS and TEBO megasonic technologies to enhance organic contaminant removal and improve wafer surface preparation.
About the ACM Single-Wafer Moderate/ High-Temperature SPM Tool
ACM’s Single-Wafer Moderate/High-Temperature SPM tool is designed for various wet-etching processes and both single- and double-sided cleaning. It is compatible with a wide range of chemicals and cleaning processes. By effectively removing organic defects while minimizing film loss, it outperforms most post-cleaning and photoresist wet stripping processes. Supporting wafer sizes from 150mm to 300mm, the system features four load ports, a configurable setup of 8 to 12 chambers, a multifunctional chemical distribution system, and a self-cleaning chamber.
Forward-Looking Statements
Certain statements contained in this press release are not historical facts and may be forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Words such as “plans,” “expects,” “believes,” “anticipates,” “designed,” and similar words are intended to identify forward-looking statements. Forward-looking statements are based on ACM management’s current expectations and beliefs and involve a number of risks and uncertainties that are difficult to predict and that could cause actual results to differ materially from those stated or implied by the forward-looking statements. A description of certain of these risks, uncertainties and other matters can be found in filings ACM makes with the U.S. Securities and Exchange Commission, all of which are available at www.sec.gov. Because forward-looking statements involve risks and uncertainties, actual results and events may differ materially from results and events currently expected by ACM. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date hereof. ACM undertakes no obligation to publicly update these forward-looking statements to reflect events or circumstances that occur after the date hereof or to reflect any change in its expectations with regard to these forward-looking statements or the occurrence of unanticipated events.
About ACM Research, Inc.
ACM develops, manufactures and sells semiconductor process equipment spanning cleaning, electroplating, stress-free polishing, vertical furnace processes, track, PECVD, and wafer- and panel-level packaging tools, enabling advanced and semi-critical semiconductor device manufacturing. ACM is committed to delivering customized, high-performance, cost-effective process solutions that semiconductor manufacturers can use in numerous manufacturing steps to improve productivity and product yield. For more information, visit www.acmr.com.
© ACM Research, Inc. ULTRA C, SAPS, TEBO and the ACM Research logo are trademarks of ACM Research, Inc. For convenience, these trademarks appear in this press release without ™ symbols, but that practice does not mean ACM will not assert, to the fullest extent under applicable law, its rights to such trademarks. All other trademarks are the property of their respective owners.
| Media Contact: | Company Contacts: |
| Alyssa Lundeen | USA |
| Kiterocket | Robert Metter |
| +1 218.398.0776 | +1 503.367.9753 |
| alundeen@kiterocket.com | |
| China | |
| Xi Wang | |
| ACM Research (Shanghai), Inc. | |
| +86 21 50808868 | |
| Korea | |
| David Kim | |
| ACM Research (Korea), Inc. | |
| +82 1041415171 | |
| Taiwan | |
| David Chang | |
| +886 921999884 | |
| Singapore | |
| Adrian Ong | |
| +65 8813-1107 |
FAQ
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