ACM Research Receives 2025 3D InCites Technology Enablement Award
ACM Research (NASDAQ: ACMR) has won the 2025 3D InCites Award in the Technology Enablement category for its Ultra ECP ap-p tool, a groundbreaking solution for fan-out panel-level packaging (FOPLP). The system is the first commercially-available high-volume copper deposition system for the large panel market.
The tool supports panel sizes of 515 mm x 510 mm and 600 mm x 600 mm, utilizing a horizontal plating approach for superior uniformity and precision. It can be used for various plating processes including pillar, bump and redistribution layer. The award recognizes ACM's contribution to solving critical challenges in heterogeneous integration.
ACM's FOPLP portfolio includes:
- Ultra ECP ap-p for copper deposition
- Ultra C vac-p for flux cleaning
- Ultra C bev-p for bevel etching and cleaning
ACM Research (NASDAQ: ACMR) ha vinto il premio 3D InCites 2025 nella categoria Abilitazione Tecnologica per il suo Ultra ECP ap-p tool, una soluzione innovativa per il packaging a livello di pannello con fan-out (FOPLP). Il sistema è il primo sistema di deposizione di rame ad alta capacità commerciale per il mercato dei grandi pannelli.
Lo strumento supporta dimensioni dei pannelli di 515 mm x 510 mm e 600 mm x 600 mm, utilizzando un approccio di placcatura orizzontale per una superiore uniformità e precisione. Può essere utilizzato per vari processi di placcatura, inclusi pilastri, bump e strati di ridistribuzione. Il premio riconosce il contributo di ACM nella risoluzione di sfide critiche nell'integrazione eterogenea.
Il portafoglio FOPLP di ACM include:
- Ultra ECP ap-p per la deposizione di rame
- Ultra C vac-p per la pulizia con flussante
- Ultra C bev-p per incisione e pulizia a bisello
ACM Research (NASDAQ: ACMR) ha ganado el premio 3D InCites 2025 en la categoría de Habilitación Tecnológica por su Ultra ECP ap-p tool, una solución innovadora para el empaque a nivel de panel con fan-out (FOPLP). El sistema es el primer sistema de deposición de cobre de alta capacidad disponible comercialmente para el mercado de grandes paneles.
La herramienta admite tamaños de panel de 515 mm x 510 mm y 600 mm x 600 mm, utilizando un enfoque de platinado horizontal para una superior uniformidad y precisión. Se puede utilizar para varios procesos de platinado, incluidos pilares, bump y capa de redistribución. El premio reconoce la contribución de ACM para resolver desafíos críticos en la integración heterogénea.
El portafolio FOPLP de ACM incluye:
- Ultra ECP ap-p para deposición de cobre
- Ultra C vac-p para limpieza con flux
- Ultra C bev-p para grabado y limpieza de bisel
ACM Research (NASDAQ: ACMR)는 Ultra ECP ap-p tool로 기술 지원 부문에서 2025 3D InCites Award를 수상했습니다. 이는 팬 아웃 패널 레벨 패키징(FOPLP)을 위한 혁신적인 솔루션입니다. 이 시스템은 대형 패널 시장을 위한 최초의 상업적으로 이용 가능한 고용량 구리 증착 시스템입니다.
이 도구는 515 mm x 510 mm 및 600 mm x 600 mm의 패널 크기를 지원하며, 수평 도금 방식을 사용하여 우수한 균일성과 정밀도를 제공합니다. 기둥, 범프 및 재배치 레이어를 포함한 다양한 도금 프로세스에 사용할 수 있습니다. 이 상은 이종 통합의 중요한 과제를 해결하는 ACM의 기여를 인정합니다.
ACM의 FOPLP 포트폴리오에는:
- 구리 증착을 위한 Ultra ECP ap-p
- 플럭스 세척을 위한 Ultra C vac-p
- 베벨 에칭 및 세척을 위한 Ultra C bev-p
ACM Research (NASDAQ: ACMR) a remporté le prix 3D InCites 2025 dans la catégorie Activation Technologique pour son Ultra ECP ap-p tool, une solution révolutionnaire pour l'emballage de niveau panneau avec fan-out (FOPLP). Ce système est le premier système de dépôt de cuivre à haut volume disponible commercialement pour le marché des grands panneaux.
L'outil prend en charge des tailles de panneaux de 515 mm x 510 mm et 600 mm x 600 mm, utilisant une approche de plaquage horizontal pour une uniformité et une précision supérieures. Il peut être utilisé pour divers processus de plaquage, y compris les piliers, les bumps et les couches de redistribution. Ce prix reconnaît la contribution d'ACM à la résolution de défis critiques dans l'intégration hétérogène.
Le portefeuille FOPLP d'ACM comprend:
- Ultra ECP ap-p pour le dépôt de cuivre
- Ultra C vac-p pour le nettoyage à l'aide de flux
- Ultra C bev-p pour le gravage et le nettoyage en biseau
ACM Research (NASDAQ: ACMR) hat den 3D InCites Award 2025 in der Kategorie Technologieförderung für sein Ultra ECP ap-p tool gewonnen, eine bahnbrechende Lösung für das Fan-Out-Paketieren auf Panel-Ebene (FOPLP). Das System ist das erste kommerziell verfügbare Hochvolumen-Kupferabscheidungssystem für den Großpanelmarkt.
Das Werkzeug unterstützt Panelgrößen von 515 mm x 510 mm und 600 mm x 600 mm und nutzt einen horizontalen Beschichtungsansatz für überlegene Gleichmäßigkeit und Präzision. Es kann für verschiedene Beschichtungsprozesse verwendet werden, einschließlich Säulen, Bumps und Umverteilungsebenen. Der Preis würdigt den Beitrag von ACM zur Lösung kritischer Herausforderungen in der heterogenen Integration.
Das FOPLP-Portfolio von ACM umfasst:
- Ultra ECP ap-p für Kupferabscheidung
- Ultra C vac-p zur Flussreinigung
- Ultra C bev-p für Fasenätzen und -reinigung
- First commercially-available high-volume copper deposition system for large panel market
- Award recognition validates technology leadership in panel-level packaging
- Strategic positioning in growing market for chiplets and high-performance GPU manufacturing
- None.
Recognized for Innovation in High-Volume Fan-Out Panel-Level Packaging Solutions
FREMONT, Calif., April 10, 2025 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging applications, today announced that its Ultra ECP ap-p tool has won the 2025 3D InCites Award in the Technology Enablement category. This award honors companies that have identified and solved critical challenges in the advancement of the heterogeneous integration roadmap, driving the industry forward through cutting-edge solutions and advancements.
ACM’s Ultra ECP ap-p system, designed for fan-out panel-level packaging (FOPLP), is the first commercially-available high-volume copper deposition system for the large panel market. By using a horizontal plating approach, it achieves exceptional uniformity and precision across the entire panel. The tool supports 515 mm x 510 mm and 600 mm x 600 mm panel sizes and can be used for plating steps in a variety of processes including pillar, bump and redistribution layer.
“I believe this award recognition from 3D InCites validates ACM’s dedication to innovation in addressing customers’ challenges in panel-level packaging (PLP),” said Dr. David Wang, ACM’s President and Chief Executive Officer. “As the demand for large chiplets, high-performance graphics processing units and high-density high-bandwidth memory continues to grow, PLP has emerged as a key solution for reducing cost and improving efficiency. The Ultra ECP ap-p system is a vital addition to ACM’s expanding FOPLP portfolio, reinforcing our commitment to advancing high-volume manufacturing solutions.”
ACM’s FOPLP portfolio includes:
- Ultra ECP ap-p for copper deposition
- Ultra C vac-p for flux cleaning
- Ultra C bev-p for bevel etching and cleaning
Announced at the IMAPS Device Packaging Conference, 3D InCites award winners were selected based on their significant contributions to the advancement of the heterogeneous integration roadmap.
Forward-Looking Statements
Certain statements contained in this press release are not historical facts and may be forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Words such as “plans,” “expects,” “believes,” “anticipates,” “designed,” and similar words are intended to identify forward-looking statements. Forward-looking statements are based on ACM management’s current expectations and beliefs and involve a number of risks and uncertainties that are difficult to predict and that could cause actual results to differ materially from those stated or implied by the forward-looking statements. A description of certain of these risks, uncertainties and other matters can be found in filings ACM makes with the U.S. Securities and Exchange Commission, all of which are available at www.sec.gov. Because forward-looking statements involve risks and uncertainties, actual results and events may differ materially from results and events currently expected by ACM. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date hereof. ACM undertakes no obligation to publicly update these forward-looking statements to reflect events or circumstances that occur after the date hereof or to reflect any change in its expectations with regard to these forward-looking statements or the occurrence of unanticipated events.
About ACM Research, Inc.
ACM develops, manufactures and sells semiconductor process equipment spanning cleaning, electroplating, stress-free polishing, vertical furnace processes, track, PECVD, and wafer- and panel-level packaging tools, enabling advanced and semi-critical semiconductor device manufacturing. ACM is committed to delivering customized, high-performance, cost-effective process solutions that semiconductor manufacturers can use in numerous manufacturing steps to improve productivity and product yield. For more information, visit www.acmr.com.
© ACM Research, Inc. ULTRA C, ULTRA ECP ap and the ACM Research logo are trademarks of ACM Research, Inc. For convenience, these trademarks appear in this press release without ™ symbols, but that practice does not mean ACM will not assert, to the fullest extent under applicable law, its rights to such trademarks. All other trademarks are the property of their respective owners.
| Media Contact: | Company Contacts: |
| Alyssa Lundeen | USA |
| Kiterocket | Robert Metter |
| +1 218.398.0776 | +1 503.367.9753 |
| alundeen@kiterocket.com | |
| China | |
| Xi Wang | |
| ACM Research (Shanghai), Inc. | |
| +86 21 50808868 | |
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| ACM Research (Korea), Inc. | |
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| Taiwan | |
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| Adrian Ong | |
| +65 8813-1107 |
FAQ
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