ACM Research Announces Major Performance Breakthrough for Ultra C Tahoe Cleaning Tool for Front-End Semiconductor Manufacturing
ACM Research announced significant improvements to its Ultra C Tahoe Cleaning tool for semiconductor manufacturing. The enhanced system combines batch wafer processing and single wafer cleaning chambers, achieving performance comparable to standalone tools while reducing chemical consumption by up to 75%. The upgrade delivers cost savings up to $500,000 annually from sulfuric acid alone. The tool now features a 25-slot bench module and nine single-wafer chambers, achieving throughput exceeding 200 wafers per hour. Currently in production at several facilities in mainland China, the system achieves average particle counts below 6 at 26nm, meeting advanced node manufacturing requirements.
ACM Research ha annunciato significativi miglioramenti al suo strumento di pulizia Ultra C Tahoe per la produzione di semiconduttori. Il sistema migliorato combina il trattamento di wafer in batch con camere di pulizia per singoli wafer, raggiungendo prestazioni paragonabili a strumenti autonomi, riducendo nel contempo il consumo chimico fino al 75%. L'aggiornamento offre risparmi sui costi fino a 500.000 dollari all'anno solo dall'acido solforico. Lo strumento presenta ora un modulo da banco a 25 slot e nove camere per singoli wafer, raggiungendo una capacità superiore a 200 wafer all'ora. Attualmente in produzione in diverse strutture nella Cina continentale, il sistema raggiunge conteggi medi di particelle inferiori a 6 a 26nm, soddisfacendo i requisiti di produzione per i nodi avanzati.
ACM Research anunció mejoras significativas en su herramienta de limpieza Ultra C Tahoe para la fabricación de semiconductores. El sistema mejorado combina el procesamiento de wafers en lotes y cámaras de limpieza para wafers individuales, logrando un rendimiento comparable a herramientas independientes, al mismo tiempo que reduce el consumo de productos químicos en hasta un 75%. La actualización proporciona ahorros de costos de hasta 500,000 dólares anuales solo en ácido sulfúrico. La herramienta ahora cuenta con un módulo de banco de 25 ranuras y nueve cámaras de un solo wafer, alcanzando un rendimiento que supera 200 wafers por hora. Actualmente en producción en varias instalaciones en China continental, el sistema logra recuentos promedio de partículas por debajo de 6 a 26nm, cumpliendo con los requisitos avanzados de fabricación de nodos.
ACM Research는 반도체 제조를 위한 Ultra C Tahoe 청소 도구의 중요한 개선 사항을 발표했습니다. 향상된 시스템은 배치 웨이퍼 처리와 단일 웨이퍼 청소 챔버를 결합하여 독립형 도구와 유사한 성능을 달성하면서 화학 물질 소비를 최대 75%까지 줄입니다. 이 업그레이드는 황산만으로 연간 최대 500,000달러의 비용 절감 효과를 제공합니다. 이 도구는 이제 25 슬롯의 벤치 모듈과 9개의 단일 웨이퍼 챔버를 갖추고 있으며, 시간당 200개 이상의 웨이퍼 처리량을 자랑합니다. 현재 중국 본토의 여러 시설에서 생산 중이며, 이 시스템은 26nm에서 평균 입자 수가 6 미만으로 유지되어 최신 노드 제조 요구 사항을 충족합니다.
ACM Research a annoncé des améliorations significatives de son outil de nettoyage Ultra C Tahoe pour la fabrication de semi-conducteurs. Le système amélioré combine le traitement en lot de wafers et des chambres de nettoyage pour wafers individuels, atteignant des performances comparables à celles d'outils autonomes tout en réduisant la consommation de produits chimiques jusqu'à 75 %. La mise à niveau permet des économies de coûts allant jusqu'à 500 000 dollars par an rien qu'avec l'acide sulfurique. L'outil comprend désormais un module de banc de 25 emplacements et neuf chambres pour wafers uniques, atteignant un débit dépassant 200 wafers par heure. Actuellement en production dans plusieurs installations en Chine continentale, le système affiche des comptages moyens de particules inférieur à 6 à 26 nm, répondant aux exigences de fabrication avancées pour les nœuds.
ACM Research hat bedeutende Verbesserungen an seinem Ultra C Tahoe Reinigungssystem für die Halbleiterfertigung angekündigt. Das verbesserte System kombiniert die Chargenverarbeitung von Wafern mit Einzelwafer-Reinigungskammern und erreicht eine Leistung, die mit eigenständigen Werkzeugen vergleichbar ist, während der Chemikalienverbrauch um bis zu 75% gesenkt wird. Das Upgrade bietet Kosteneinsparungen von bis zu 500.000 US-Dollar jährlich allein durch Schwefelsäure. Das Werkzeug verfügt jetzt über ein 25-Slot-Bench-Modul und neun Einzelwafer-Kammern und erreicht einen Durchsatz von über 200 Wafern pro Stunde. Es wird derzeit in mehreren Einrichtungen im Festland-China produziert und erreicht durchschnittliche Partikelzahlen von unter 6 bei 26nm, wodurch es die Anforderungen der modernen Knotenfertigung erfüllt.
- Achieves up to 75% reduction in chemical consumption, saving $500,000 annually in sulfuric acid costs
- Increased throughput to over 200 wafers per hour with expanded 25-slot bench module
- Enhanced particle removal capabilities achieving <6 particles at 26nm
- Already in production at multiple high-volume facilities in China
- Qualified for more than 30 production layers
- current market penetration, with production units only in mainland China
Insights
The breakthrough in ACM Research's Ultra C Tahoe cleaning tool represents a significant technological advancement in semiconductor manufacturing. The hybrid architecture combining batch and single-wafer processing achieves up to 75% reduction in chemical consumption while maintaining high performance standards with particle counts below 6 at 26nm. The enhanced throughput of over 200 wafers per hour and potential cost savings of
The tool's qualification for 30+ production layers and expanded process capabilities, including advanced jet spray and proprietary SAPS/TEBO technologies, position it well for capturing market share in the SPM segment. The timing aligns perfectly with increasing AI chip production demands and environmental regulations. The successful deployment in high-volume facilities in China provides real-world validation of its capabilities.
Enhanced cleaning performance for advanced chip manufacturing; Significant chemical savings and environmental benefits
FREMONT, Calif., Nov. 07, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced a major performance breakthrough for its flagship Ultra C Tahoe Cleaning tool. The resulting enhancements are designed to meet demanding technical requirements of advanced nodes for foundry, logic and memory applications.
The Ultra C Tahoe now achieves the performance of standalone single-wafer cleaning tools on low-to-medium temperature sulfuric peroxide mix (SPM) processes. Tahoe’s patented hybrid architecture is among the first in the industry to combine batch wafer processing and single wafer cleaning chambers into the same SPM tool. The hybrid architecture delivers enhanced cleaning performance, high throughput, and process flexibility, with up to
“With the rise of AI to the forefront of consumers’ minds, we expect increased public attention on the environmental impact of semiconductor chip manufacturing. We believe ACM’s Ultra C Tahoe is well-positioned to help customers increase production of advanced AI chips, but with a reduced footprint on the environment,” said Dr. David Wang, ACM’s President and Chief Executive Officer.
“We believe the Ultra C Tahoe is another example of excellence from ACM’s innovative and world-class R&D team,” Dr. Wang added. “We believe the Tahoe platform is well-positioned to capture market share within the SPM market, particularly in middle and low-temperature applications, which believe represents an estimated
The upgraded Ultra C Tahoe is now in production at several high-volume customer facilities in mainland China. Additional logic and memory customers are evaluating the tool, and we expect to deliver additional production units through the end of 2024.
New Features and Benefits of the Upgraded Ultra C Tahoe Tool:
- Enhanced Particle Removal: The Tahoe platform’s advanced cleaning capabilities have achieved average particle counts of less than 6 particles at 26nm, meeting the stringent requirements for advanced node manufacturing. The tool is also capable of removing 1x nm particles for the most advanced logic and memory applications, with the addition of a smaller particle filtering system.
- Higher Throughput: The upgraded 25-slot bench module (previously 13 slots) and nine single-wafer chambers (upgraded from eight) now deliver throughput exceeding 200 wafers per hour, comparable to the capacity of a 12-chamber SPM system.
- Environmental and Cost Benefits: With a reduction of up to
75% in sulfuric acid consumption, the Ultra C Tahoe aligns with environmental regulations and sustainability goals, reducing costs for high-volume manufacturers. - Expanded Process Capabilities: Qualified for more than 30 production layers, including key loops such as lightly-doped drain (LDD) and source/drain (SD), with additional layers and applications currently in development.
- Advanced Flexibility in Single-Wafer Cleaning: Optional configurations include new jet spray technology, ACM’s patented SAPS/TEBO technologies, and HOT IPA drying technology, increasing the tool’s versatility across multiple process applications.
Visit ACM at SEMICON Europa
To learn more about the upgraded Ultra C Tahoe platform, please visit us at SEMICON Europa, booth C2265, from November 12-15, 2024, in Munich, Germany, or explore our website.
Forward-Looking Statements
Certain statements contained in this press release are not historical facts and may be forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Words such as “plans,” “expects,” “believes,” “anticipates,” “designed,” and similar words are intended to identify forward-looking statements. Forward-looking statements are based on ACM management’s current expectations and beliefs, and involve a number of risks and uncertainties that are difficult to predict and that could cause actual results to differ materially from those stated or implied by the forward-looking statements. A description of certain of these risks, uncertainties and other matters can be found in filings ACM makes with the U.S. Securities and Exchange Commission, all of which are available at www.sec.gov. Because forward-looking statements involve risks and uncertainties, actual results and events may differ materially from results and events currently expected by ACM. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date hereof. ACM undertakes no obligation to publicly update these forward-looking statements to reflect events or circumstances that occur after the date hereof or to reflect any change in its expectations with regard to these forward-looking statements or the occurrence of unanticipated events.
About ACM Research, Inc.
ACM develops, manufactures and sells semiconductor process equipment for single-wafer or batch wet cleaning, electroplating, stress-free polishing, vertical furnace processes, Track and PECVD, which are critical to advanced semiconductor device manufacturing and wafer-level packaging. ACM is committed to delivering customized, high-performance, cost-effective process solutions that semiconductor manufacturers can use in numerous manufacturing steps to improve productivity and product yield. For more information, visit www.acmr.com.
© ACM Research, Inc. ULTRA C, SAPS, TEBO and the ACM Research logo are trademarks of ACM Research, Inc. For convenience, these trademarks appear in this press release without ™ symbols, but that practice does not mean ACM will not assert, to the fullest extent under applicable law, its rights to such trademarks. All other trademarks are the property of their respective owners.
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| Xi Wang | |
| ACM Research (Shanghai), Inc. | |
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| ACM Research (Korea), Inc. | |
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FAQ
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