ACM Research Receives Orders for Wafer-Level Packaging Tools from U.S. Customer and R&D Center
ACM Research (NASDAQ: ACMR) has received orders for four wafer-level packaging tools from U.S.-based entities. Two tools were ordered by a U.S. customer and two by a U.S. R&D center. These tools support advanced packaging processes like coating, developing, wet etching, and scrubbing. Delivery is scheduled for the first half of 2025. The customer's orders are for first tools subject to technical qualification, potentially leading to follow-on production orders. The R&D center's orders aim to advance wafer-level packaging research and showcase ACM's capabilities to prospective customers. Dr. David Wang, ACM's CEO, views these orders as demonstrating the company's broad range of advanced tools and growing traction with U.S.-based customers.
ACM Research (NASDAQ: ACMR) ha ricevuto ordini per quattro strumenti di packaging a livello wafer da entità statunitensi. Due strumenti sono stati ordinati da un cliente statunitense e due da un centro di ricerca e sviluppo negli Stati Uniti. Questi strumenti supportano processi di packaging avanzati come rivestimento, sviluppo, incisione umida e pulizia. La consegna è prevista per la prima metà del 2025. Gli ordini del cliente riguardano i primi strumenti soggetti a qualificazione tecnica, che potrebbero portare a ordini di produzione successivi. Gli ordini del centro di R&D mirano a far progredire la ricerca sul packaging a livello wafer e a mostrare le capacità di ACM ai potenziali clienti. Il dott. David Wang, CEO di ACM, considera questi ordini come una dimostrazione della vasta gamma di strumenti avanzati dell'azienda e del crescente interesse da parte dei clienti statunitensi.
ACM Research (NASDAQ: ACMR) ha recibido pedidos de cuatro herramientas de empaquetado a nivel de oblea de entidades con sede en EE. UU. Dos herramientas fueron ordenadas por un cliente estadounidense y dos por un centro de I+D estadounidense. Estas herramientas apoyan procesos de empaquetado avanzados como recubrimiento, desarrollo, grabado en húmedo y limpieza. La entrega está programada para la primera mitad de 2025. Los pedidos del cliente son para las primeras herramientas sujetas a calificación técnica, lo que podría llevar a pedidos de producción consecutivos. Los pedidos del centro de I+D tienen como objetivo avanzar en la investigación del empaquetado a nivel de oblea y mostrar las capacidades de ACM a clientes potenciales. El Dr. David Wang, CEO de ACM, considera estos pedidos como una demostración de la amplia gama de herramientas avanzadas de la empresa y de la creciente tracción con los clientes estadounidenses.
ACM Research (NASDAQ: ACMR)는 미국에 본사를 둔 기관으로부터 4개의 웨이퍼 수준 패키징 도구에 대한 주문을 받았습니다. 두 개의 도구는 미국 고객에 의해 주문되었고, 두 개는 미국의 연구 개발 센터에 의해 주문되었습니다. 이 도구들은 코팅, 개발, 습식 화학식각 및 청소와 같은 고급 패키징 프로세스를 지원합니다. 납기는 2025년 상반기로 예정되어 있습니다. 고객의 주문은 기술적 자격을 요구하는 첫 도구를 위한 것으로, 잠재적으로 후속 생산 주문으로 이어질 수 있습니다. 연구 개발 센터의 주문은 웨이퍼 수준 패키징 연구를 발전시키고 ACM의 능력을 잠재 고객에게 보여주기 위한 것입니다. ACM의 CEO인 Dr. David Wang은 이러한 주문이 회사의 다양한 고급 도구와 미국 고객과의 증가하는 시장 점유율을 보여주고 있다고 생각합니다.
ACM Research (NASDAQ: ACMR) a reçu des commandes pour quatre outils d'emballage au niveau du wafer de la part d'entités basées aux États-Unis. Deux outils ont été commandés par un client américain et deux par un centre de recherche et développement américain. Ces outils soutiennent des processus d'emballage avancés tels que revêtement, développement, gravure humide et nettoyage. La livraison est prévue pour la première moitié de 2025. Les commandes du client concernent les premiers outils soumis à qualification technique, ce qui pourrait conduire à des commandes de production subséquentes. Les commandes du centre de R&D visent à faire progresser la recherche sur l'emballage au niveau du wafer et à mettre en valeur les capacités d'ACM auprès de clients potentiels. Dr. David Wang, PDG d'ACM, considère ces commandes comme une démonstration de la large gamme d'outils avancés de l'entreprise et de l'intérêt croissant des clients basés aux États-Unis.
ACM Research (NASDAQ: ACMR) hat Bestellungen für vier Wafer-Level-Packaging-Werkzeuge von in den USA ansässigen Unternehmen erhalten. Zwei Werkzeuge wurden von einem US-Kunden und zwei von einem US-F&E-Zentrum bestellt. Diese Werkzeuge unterstützen fortgeschrittene Verpackungsprozesse wie Beschichtung, Entwicklung, Nassätzen und Reinigung. Die Lieferung ist für die erste Hälfte von 2025 geplant. Die Bestellungen des Kunden beziehen sich auf die ersten Werkzeuge, die einer technischen Qualifizierung unterliegen und potenziell zu Nachfolgebestellungen führen könnten. Die Bestellungen des F&E-Zentrums zielen darauf ab, die Forschung im Bereich Wafer-Level-Packaging voranzutreiben und ACMs Fähigkeiten potenziellen Kunden zu demonstrieren. Dr. David Wang, CEO von ACM, sieht diese Bestellungen als Beleg für die breite Palette an fortschrittlichen Werkzeugen des Unternehmens und das wachsende Interesse seitens der in den USA ansässigen Kunden.
- Received orders for four wafer-level packaging tools from U.S.-based entities
- Potential for follow-on production orders from U.S. customer
- Opportunity to showcase technological capabilities to prospective customers through R&D center orders
- Demonstrates growing traction with U.S.-based customers
- Delivery of tools not scheduled until first half of 2025
- Customer orders subject to technical qualification
Insights
ACM Research's recent orders for wafer-level packaging tools are a positive development for the company. The orders from a U.S.-based customer and R&D center demonstrate market expansion and potential for future growth. While the
ACM's new orders highlight the company's technological prowess in advanced wafer-level packaging. The tools' versatility, covering processes like coating, developing, wet etching and scrubbing, showcases ACM's comprehensive solutions for the semiconductor industry. This is particularly significant as the industry moves towards more complex packaging technologies to overcome limitations in traditional node scaling. The involvement of a U.S.-based R&D center is crucial, as it could lead to cutting-edge innovations and potentially establish ACM as a thought leader in the field. However, the technical qualification hurdle for the customer orders presents both an opportunity and a risk. Success could open doors to volume production, while failure might hinder future growth prospects.
This news indicates ACM Research is making strategic inroads into the U.S. market, a significant move given the current geopolitical tensions and push for domestic semiconductor capabilities. The orders from both a commercial customer and an R&D center suggest a two-pronged approach to market penetration: immediate commercial opportunities and long-term research collaborations. This could potentially enhance ACM's brand reputation in the U.S., which is important for competing with established players. The advanced packaging market is projected to grow significantly, driven by demands in 5G, AI and IoT applications. ACM's focus on this sector aligns well with industry trends. However, investors should be cautious as the semiconductor equipment market is cyclical and sensitive to macroeconomic factors. The long lead time to delivery also introduces uncertainty.
FREMONT, Calif., Sept. 04, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced it has received purchase orders for four wafer-level packaging tools, including two from a U.S.-based customer and two from a U.S.-based research and development (R&D) center.
“We are pleased to receive these strategic orders from both a U.S.-based customer and a leading U.S.-based research center,” said Dr. David Wang, ACM’s President and Chief Executive Officer. “We believe these orders demonstrate the broad range of our advanced wafer level packaging tools, reaffirm ACM’s commitment to innovation in semiconductor manufacturing, and highlight growing traction with U.S.-based customers.”
The four tools support a range of advanced packaging processes, including coating, developing, wet etching and scrubbing, and are scheduled for delivery in the first half of 2025. The orders from the U.S.-based customer are for first tools subject to technical qualification, which we expect could lead to follow-on orders for volume production. The orders from the R&D center are intended to further advance wafer-level packaging research and development and serve as a demonstration platform to showcase ACM’s technological capabilities to other prospective customers.
Forward-Looking Statements
Certain statements contained in this press release are not historical facts and may be forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Words such as “plans,” “expects,” “believes,” “anticipates,” “designed,” and similar words are intended to identify forward-looking statements. Forward-looking statements are based on ACM management’s current expectations and beliefs, and involve a number of risks and uncertainties that are difficult to predict and that could cause actual results to differ materially from those stated or implied by the forward-looking statements. A description of certain of these risks, uncertainties and other matters can be found in filings ACM makes with the U.S. Securities and Exchange Commission, all of which are available at www.sec.gov. Because forward-looking statements involve risks and uncertainties, actual results and events may differ materially from results and events currently expected by ACM. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date hereof. ACM undertakes no obligation to publicly update these forward-looking statements to reflect events or circumstances that occur after the date hereof or to reflect any change in its expectations with regard to these forward-looking statements or the occurrence of unanticipated events.
About ACM Research, Inc.
ACM develops, manufactures and sells semiconductor process equipment for single-wafer or batch wet cleaning, electroplating, stress-free polishing, vertical furnace processes, Track and PECVD, which are critical to advanced semiconductor device manufacturing and wafer-level packaging. ACM is committed to delivering customized, high-performance, cost-effective process solutions that semiconductor manufacturers can use in numerous manufacturing steps to improve productivity and product yield. For more information, visit www.acmrcsh.com.
© ACM Research, Inc. The ACM Research logo is trademark of ACM Research, Inc. For convenience, these trademarks appear in this press release without ™ symbols, but that practice does not mean ACM will not assert, to the fullest extent under applicable law, its rights to such trademarks. All other trademarks are the property of their respective owners.
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FAQ
What new orders has ACM Research (ACMR) received for wafer-level packaging tools?
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