ACM Research Expands Fan-Out Panel-Level Packaging Portfolio with Launch of Ultra C bev-p Bevel Etching Tool
ACM Research (NASDAQ: ACMR) has launched the Ultra C bev-p panel bevel etching tool for fan-out panel-level packaging (FOPLP) applications. This innovative system is designed for double-sided bevel etching and cleaning in copper-related processes, enhancing efficiency and reliability. The tool can handle panel sizes from 510 mm x 515 mm to 600 mm x 600 mm, with thicknesses of 0.5 mm to 3 mm and warpages up to 10 mm.
Key features include advanced panel handling, efficient copper removal using diluted sulfuric acid and peroxide, and high throughput of 40 panels per hour. The Ultra C bev-p offers bevel control accuracy of ±0.2 mm and an exclusive control range of 0-20 mm. With a mean time between failures of 500 hours and 95% uptime, it ensures exceptional reliability and consistent performance for high-volume production.
ACM Research (NASDAQ: ACMR) ha lanciato il tool di incisone a bev-p Ultra C per applicazioni di packaging a livello pannello fan-out (FOPLP). Questo sistema innovativo è progettato per l'incisione e la pulizia del bevel su entrambi i lati nei processi relativi al rame, migliorando l'efficienza e l'affidabilità. Il tool può gestire pannelli di dimensioni da 510 mm x 515 mm a 600 mm x 600 mm, con spessori da 0,5 mm a 3 mm e deformazioni fino a 10 mm.
Le caratteristiche principali includono una gestione avanzata dei pannelli, un'efficiente rimozione del rame utilizzando acido solforico diluito e perossido, e un'alta produttività di 40 pannelli all'ora. L'Ultra C bev-p offre un'accuratezza di controllo del bevel di ±0,2 mm e un'ampia gamma di controllo esclusiva di 0-20 mm. Con un tempo medio tra guasti di 500 ore e un uptime del 95%, garantisce un'affidabilità eccezionale e prestazioni costanti per la produzione ad alto volume.
ACM Research (NASDAQ: ACMR) ha lanzado la herramienta de grabado en bisel Ultra C bev-p para aplicaciones de embalaje a nivel de panel fan-out (FOPLP). Este sistema innovador está diseñado para el grabado en bisel y la limpieza en ambos lados en procesos relacionados con el cobre, mejorando la eficiencia y la confiabilidad. La herramienta puede manejar tamaños de panel de 510 mm x 515 mm a 600 mm x 600 mm, con grosores de 0,5 mm a 3 mm y deformaciones de hasta 10 mm.
Las características clave incluyen manejo avanzado de paneles, eliminación eficiente de cobre utilizando ácido sulfúrico diluido y peróxido, y un alto rendimiento de 40 paneles por hora. El Ultra C bev-p ofrece una precisión de control de bisel de ±0,2 mm y un rango de control exclusivo de 0-20 mm. Con un tiempo medio entre fallos de 500 horas y un tiempo de actividad del 95%, garantiza una confiabilidad excepcional y un rendimiento constante para la producción de alto volumen.
ACM 리서치(NASDAQ: ACMR)가 팬 아웃 패널 레벨 패키징(FOPLP) 응용 프로그램을 위한 울트라 C bev-p 패널 비벨 에칭 도구를 출시했습니다. 이 혁신적인 시스템은 구리 관련 공정에서 양면 비벨 에칭 및 청소를 위해 설계되어 효율성과 신뢰성을 향상시킵니다. 이 도구는 510 mm x 515 mm에서 600 mm x 600 mm 크기의 패널을 처리할 수 있으며, 두께는 0.5 mm에서 3 mm, 변형은 최대 10 mm까지 가능합니다.
주요 특징으로는 고급 패널 처리, 희석된 황산 및 과산화물을 사용한 효율적인 구리 제거, 그리고 시간당 40패널의 높은 처리량이 있습니다. 울트라 C bev-p는 ±0.2 mm의 비벨 제어 정확도와 0-20 mm의 독점 제어 범위를 제공합니다. 평균 고장 간격이 500시간, 가동 시간이 95%인 이 장치는 높은 볼륨 생산을 위한 뛰어난 신뢰성과 일관된 성능을 보장합니다.
ACM Research (NASDAQ: ACMR) a lancé l'outil de gravure en biseau Ultra C bev-p pour des applications d'emballage au niveau du panneau fan-out (FOPLP). Ce système innovant est conçu pour la gravure et le nettoyage du biseau des deux côtés dans les processus liés au cuivre, améliorant l'efficacité et la fiabilité. L'outil peut traiter des tailles de panneaux de 510 mm x 515 mm à 600 mm x 600 mm, avec des épaisseurs de 0,5 mm à 3 mm et des déformations allant jusqu'à 10 mm.
Les principales caractéristiques incluent une gestion avancée des panneaux, un retrait efficace du cuivre utilisant de l'acide sulfurique dilué et du peroxyde, ainsi qu'un niveau de productivité élevé de 40 panneaux par heure. L'Ultra C bev-p offre une précision de contrôle du biseau de ±0,2 mm et une plage de contrôle exclusive de 0-20 mm. Avec un temps moyen entre pannes de 500 heures et un temps de disponibilité de 95%, il garantit une fiabilité exceptionnelle et une performance constante pour la production en grande quantité.
ACM Research (NASDAQ: ACMR) hat das Ultra C bev-p Panel-Bisewerkzeug für Anwendungen im Bereich Fan-Out-Panell-Packaging (FOPLP) eingeführt. Dieses innovative System ist für beidseitiges Biselätzen und Reinigen in kupferbezogenen Prozessen ausgelegt und verbessert die Effizienz und Zuverlässigkeit. Das Werkzeug kann Panelgrößen von 510 mm x 515 mm bis 600 mm x 600 mm mit Dicken von 0,5 mm bis 3 mm und Verformungen von bis zu 10 mm verarbeiten.
Zu den wichtigsten Merkmalen gehören eine fortschrittliche Handhabung der Panels, eine effiziente Kupferentfernung mittels verdünnter Schwefelsäure und Peroxid sowie eine hohe Durchsatzrate von 40 Panels pro Stunde. Das Ultra C bev-p bietet eine Biselkontrollgenauigkeit von ±0,2 mm und einen exklusiven Kontrollbereich von 0-20 mm. Mit einer mittleren Zeit zwischen Ausfällen von 500 Stunden und einer Betriebszeit von 95 % gewährleistet es außergewöhnliche Zuverlässigkeit und konsistente Leistung für die Großproduktion.
- Launch of new Ultra C bev-p tool for FOPLP applications, expanding ACM's product portfolio
- Capability to handle both front and back sides of panel bevel etching in a single system
- High throughput of 40 panels per hour with up to six processing chambers
- Advanced features including ±0.2 mm bevel control accuracy and 0-20 mm exclusive control range
- 95% uptime and 500 hours mean time between failures, ensuring operational efficiency
- None.
Insights
The launch of ACM Research's Ultra C bev-p panel bevel etching tool marks a significant advancement in fan-out panel-level packaging (FOPLP) technology. This innovation addresses critical challenges in the semiconductor industry, particularly in copper-related processes. The tool's ability to handle double-sided bevel etching within a single system is a game-changer for process efficiency and product reliability.
The market impact could be substantial, as FOPLP is poised to become increasingly important in meeting the demands of modern electronic applications. The tool's compatibility with various panel substrates and its ability to handle warped panels up to 10 mm demonstrate ACM's commitment to addressing real-world manufacturing challenges. With a throughput of
While this launch strengthens ACM's position in the advanced packaging market, investors should monitor how quickly semiconductor manufacturers adopt this technology and its impact on ACM's revenue stream in the coming quarters.
The Ultra C bev-p tool's innovative design tackles a important pain point in panel-level packaging: precise bevel etching on square substrates. This is a notable technical achievement, as square panels present unique challenges compared to traditional round wafers. The tool's ability to maintain accuracy even with warped panels is particularly impressive, addressing a common issue in large panel processing.
Key technical specifications that stand out include:
- Bevel control accuracy of ±0.2 mm
- Exclusive control range of 0-20 mm
- Compatibility with panel sizes up to 600 mm x 600 mm
- Ability to handle panel thicknesses from 0.5 mm to 3 mm
These features, combined with the use of diluted sulfuric acid and peroxide (DSP) for copper removal, indicate a well-thought-out design that balances precision, flexibility and efficiency. The mean time between failures (MTBF) of 500 hours is also noteworthy, suggesting robust reliability which is important for maintaining production continuity in high-volume manufacturing environments.
New double-sided bevel etching system enhances process efficiency and reliability in copper-related applications, supporting high-precision features on large panels
FREMONT, Calif., Sept. 03, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced the launch of its Ultra C bev-p panel bevel etching tool for fan-out panel-level packaging (FOPLP) applications. The new tool is specifically designed for bevel etching and cleaning in copper-related processes and is capable of handling both the front and back sides of panel bevel etching within a single system. This capability enhances process efficiency and product reliability.
“We believe FOPLP will gain prominence as it meets the evolving demands of modern electronic applications, offering advantages in integration density, cost efficiency and design flexibility,” said Dr. David Wang, ACM’s president and chief executive officer. “Our new Ultra C bev-p tool leverages ACM's deep expertise in wet processing to deliver what we consider to be advanced performance, and we believe it is one of the first tools to employ double-sided bevel etching for horizontal panel applications. We expect the Ultra C bev-p, alongside our recently announced Ultra ECP ap-p for horizontal panel electrochemical plating and Ultra C vac-p flux cleaning tools, to bolster the FOPLP market by facilitating advanced packaging on large panels with high-precision features.”
The Ultra C bev-p tool is a key enabler for FOPLP processes, utilizing a wet etching technique designed specifically for bevel etching and copper residue removal. This process is crucial for preventing electrical shorts, minimizing contamination risks, and maintaining the integrity of subsequent processing steps, ensuring the long-term reliability of devices. At the core of the tool’s effectiveness is ACM’s patented technology that addresses the unique challenges posed by square panel substrates.
Unlike traditional round wafers, ACM’s innovative design ensures a precise bevel removal process that remains confined to the bevel region, even on warped panels. This advancement is vital for maintaining the integrity of the etching process and achieving the high performance and reliability required by advanced semiconductor technologies.
Key Features
The Ultra C bev-p tool is designed specifically for panel substrates, offering compatibility with organic, glass, and bonding panels. It efficiently manages both the front and back sides of panels, accommodating sizes from 510 mm x 515 mm to 600 mm x 600 mm, with thicknesses ranging from 0.5 mm to 3 mm. The tool can handle warpages up to 10 mm, ensuring optimal processing conditions.
- Advanced Panel Handling: Equipped with a single robot for secure and precise panel handling and transfer.
- Efficient Copper Removal: Utilizes diluted sulfuric acid and peroxide (DSP) — a mixture of deionized (DI) water, sulfuric acid, and hydrogen peroxide — for effective copper removal. It also includes DI water for rinsing and N2 for final drying, ensuring a clean and dry surface.
- High Throughput: Capable of operating up to six processing chambers, the Ultra C bev-p achieves a throughput of 40 panels per hour (PPH), making it highly efficient for high-volume production.
The system offers bevel control accuracy of ±0.2 mm and an exclusive control range of 0-20 mm. It is designed with a mean time between failures (MTBF) of 500 hours and an uptime of
Forward-Looking Statements
Certain statements contained in this press release are not historical facts and may be forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Words such as “plans,” “expects,” “believes,” “anticipates,” “designed,” and similar words are intended to identify forward-looking statements. Forward-looking statements are based on ACM management’s current expectations and beliefs, and involve a number of risks and uncertainties that are difficult to predict and that could cause actual results to differ materially from those stated or implied by the forward-looking statements. A description of certain of these risks, uncertainties and other matters can be found in filings ACM makes with the U.S. Securities and Exchange Commission, all of which are available at www.sec.gov. Because forward-looking statements involve risks and uncertainties, actual results and events may differ materially from results and events currently expected by ACM. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date hereof. ACM undertakes no obligation to publicly update these forward-looking statements to reflect events or circumstances that occur after the date hereof or to reflect any change in its expectations with regard to these forward-looking statements or the occurrence of unanticipated events.
About ACM Research, Inc.
ACM develops, manufactures and sells semiconductor process equipment for single-wafer or batch wet cleaning, electroplating, stress-free polishing, vertical furnace processes, Track and PECVD, which are critical to advanced semiconductor device manufacturing and wafer-level packaging. ACM is committed to delivering customized, high-performance, cost-effective process solutions that semiconductor manufacturers can use in numerous manufacturing steps to improve productivity and product yield. For more information, visit www.acmrcsh.com.
© ACM Research, Inc. ULTRA C and the ACM Research logo are trademarks of ACM Research, Inc. For convenience, these trademarks appear in this press release without ™ symbols, but that practice does not mean ACM will not assert, to the fullest extent under applicable law, its rights to such trademarks. All other trademarks are the property of their respective owners.
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