ACRONAME LAUNCHES USB3.2 SWITCH EXTENSION SOLUTION WITH ADVANCED POWER DELIVERY
Acroname, a Valens Semiconductor company, has launched the USBExt3c, a 3-port switchable hub featuring USB3 and USB2 extension with advanced PoE and USB-C power delivery. The product combines Valens' HDBaseT and Acroname's BrainStem technologies to solve power delivery and negotiation challenges in USB-extended systems.
The solution enables extended USB connectivity beyond standard cable limitations, particularly beneficial for high-bandwidth devices like high-end cameras and storage devices. The product utilizes Acroname's BrainStem control platform and Valens VS6320 chipset, making USB a more professional-grade technology.
The USBExt3c will debut at Integrated Systems Europe (ISE) 2025 from February 4-7, 2025, at the HDBaseT Alliance booth #2M500. The product is compatible with AVI-SPL's Symphony platform and Sennheiser's TeamConnect Bar products.
Acroname, un'azienda di Valens Semiconductor, ha lanciato il USBExt3c, un hub switchable a 3 porte che offre estensione USB3 e USB2 con avanzata alimentazione PoE e erogazione di potenza USB-C. Il prodotto combina la tecnologia HDBaseT di Valens e la tecnologia BrainStem di Acroname per affrontare le sfide di alimentazione e negoziazione nei sistemi USB estesi.
La soluzione consente una connettività USB estesa oltre le limitazioni dei cavi standard, risultando particolarmente utile per dispositivi ad alta larghezza di banda come telecamere professionali e dispositivi di archiviazione. Il prodotto utilizza la piattaforma di controllo BrainStem di Acroname e il chipset VS6320 di Valens, rendendo l'USB una tecnologia di grado professionale.
Il USBExt3c debutterà all'Integrated Systems Europe (ISE) 2025 dal 4 al 7 febbraio 2025, presso lo stand dell'HDBaseT Alliance #2M500. Il prodotto è compatibile con la piattaforma Symphony di AVI-SPL e i prodotti TeamConnect Bar di Sennheiser.
Acroname, una empresa de Valens Semiconductor, ha lanzado el USBExt3c, un hub conmutado de 3 puertos que ofrece extensión USB3 y USB2 con avanzada alimentación PoE y entrega de potencia USB-C. El producto combina la tecnología HDBaseT de Valens y las tecnologías BrainStem de Acroname para resolver los desafíos de entrega y negociación de potencia en sistemas extendidos por USB.
La solución permite una conectividad USB extendida más allá de las limitaciones de los cables estándar, siendo particularmente beneficiosa para dispositivos de alta capacidad de ancho de banda como cámaras de gama alta y dispositivos de almacenamiento. El producto utiliza la plataforma de control BrainStem de Acroname y el chipset VS6320 de Valens, haciendo que USB sea una tecnología de grado profesional.
El USBExt3c se presentará en Integrated Systems Europe (ISE) 2025 del 4 al 7 de febrero de 2025, en el stand de la Alianza HDBaseT #2M500. El producto es compatible con la plataforma Symphony de AVI-SPL y los productos TeamConnect Bar de Sennheiser.
Acroname는 Valens Semiconductor의 한 회사로, USBExt3c를 출시했습니다. 이 3포트 스위치 가능 허브는 고급 PoE 및 USB-C 전원 공급 기능과 함께 USB3 및 USB2 확장을 제공합니다. 이 제품은 Valens의 HDBaseT 기술과 Acroname의 BrainStem 기술을 결합하여 USB 연장 시스템의 전원 공급 및 협상 문제를 해결합니다.
이 솔루션은 표준 케이블 제한을 넘어 USB 연결성을 확장할 수 있으며, 특히 고화질 카메라 및 스토리지 장치와 같은 고대역폭 장치에 유익합니다. 이 제품은 Acroname의 BrainStem 제어 플랫폼과 Valens VS6320 칩셋을 사용하여 USB를 더 전문적인 기술로 만듭니다.
USBExt3c는 Integrated Systems Europe (ISE) 2025에서 2025년 2월 4일부터 7일까지 HDBaseT Alliance 부스 #2M500에서 첫 선을 보일 예정입니다. 이 제품은 AVI-SPL의 Symphony 플랫폼 및 Sennheiser의 TeamConnect Bar 제품과 호환됩니다.
Acroname, une entreprise de Valens Semiconductor, a lancé le USBExt3c, un hub commutable à 3 ports offrant une extension USB3 et USB2 avec une alimentation PoE avancée et une livraison d'énergie USB-C. Le produit combine la technologie HDBaseT de Valens et les technologies BrainStem d'Acroname pour résoudre les problèmes de livraison et de négociation d'énergie dans les systèmes USB étendus.
La solution permet une connectivité USB étendue au-delà des limitations des câbles standard, ce qui est particulièrement bénéfique pour les appareils à large bande passante tels que les caméras haut de gamme et les dispositifs de stockage. Le produit utilise la plateforme de contrôle BrainStem d'Acroname et le chipset VS6320 de Valens, rendant l'USB une technologie de niveau professionnel.
Le USBExt3c sera présenté lors de Integrated Systems Europe (ISE) 2025 du 4 au 7 février 2025, au stand de l'Alliance HDBaseT #2M500. Le produit est compatible avec la plateforme Symphony d'AVI-SPL et les produits TeamConnect Bar de Sennheiser.
Acroname, ein Unternehmen von Valens Semiconductor, hat den USBExt3c lanciert, einen schaltbaren Hub mit 3 Ports, der USB3- und USB2-Erweiterung mit fortschrittlicher PoE- und USB-C-Stromversorgung bietet. Das Produkt kombiniert Valens' HDBaseT-Technologie und Acronames BrainStem-Technologie, um Herausforderungen bei der Stromversorgung und Verhandlung in USB-erweiterten Systemen zu lösen.
Die Lösung ermöglicht eine erweiterte USB-Konnektivität über die Standardkabelbeschränkungen hinaus, was besonders vorteilhaft für hochbandbreitige Geräte wie hochwertige Kameras und Speichergeräte ist. Das Produkt verwendet die BrainStem-Steuerplattform von Acroname und den VS6320-Chipsatz von Valens, wodurch USB zu einer professionellen Technologie wird.
Der USBExt3c wird auf der Integrated Systems Europe (ISE) 2025, die vom 4. bis 7. Februar 2025 stattfindet, am Stand der HDBaseT Alliance #2M500 vorgestellt. Das Produkt ist mit der Symphony-Plattform von AVI-SPL und den TeamConnect Bar Produkten von Sennheiser kompatibel.
- Launch of new product addressing market needs in USB extension and power delivery
- Integration of Valens' HDBaseT and Acroname's BrainStem technologies showing post-acquisition synergies
- Product compatibility with major industry platforms (AVI-SPL Symphony, Sennheiser TeamConnect Bar)
- None.
Insights
This product launch marks a significant technical advancement in professional USB connectivity, addressing a important market need in the AV installation and OEM manufacturing sectors. The USBExt3c represents the first tangible synergy realization between Valens Semiconductor and its Acroname acquisition, demonstrating strategic value creation through technology integration.
The product's market positioning is particularly noteworthy for three reasons:
- It targets the growing professional AV installation market, which is experiencing rapid growth due to post-pandemic workplace transformations and the surge in hybrid meeting spaces
- The integration with major industry platforms like AVI-SPL's Symphony and Sennheiser's TeamConnect Bar suggests strong potential for enterprise adoption
- The timing aligns with the increasing demand for high-bandwidth USB devices in professional settings, particularly for video conferencing and machine vision applications
From a technical perspective, the VS6320 chipset integration provides a competitive advantage in the professional USB extension market. The combination of USB3.2 speeds with advanced power delivery capabilities addresses a significant pain point in professional AV installations, where power management and reliable high-speed connections over longer distances have been persistent challenges.
While the immediate revenue impact may be modest relative to Valens' overall business, this launch strengthens the company's position in the professional AV market and demonstrates the strategic value of the Acroname acquisition. The product's compatibility with major industry platforms suggests potential for significant channel partnerships and enterprise adoption, though market penetration speed will depend on integration ease and pricing strategy.
Leveraging both Valens' HDBaseT and Acroname's BrainStem technologies, the USB3Ext3c addresses the challenge of power delivery and negotiation in USB-extended systems. It allows users to manage an array of USB-based peripheral devices, extending past the short cable limitations of USB2 and USB3, without worrying about power negotiation. This is a significant benefit specifically for high-bandwidth devices, such as high-end cameras, storage devices, and devices requiring high-power charging (e.g., laptops).
The new product is based on Acroname's system automation control platform, BrainStem, which provides highly modular and scalable hardware and software tools, including tools for management of USB and USB-PD, used in OEM applications around the world. The product also leverages the Valens VS6320 chipset, the first ASIC-based high-performance extension solution for USB3.2.
"This product launch represents a significant step forward in making USB a professional-grade technology," said Justin Gregg, CEO of Acroname. "It enables our customers to achieve unprecedented reliability in their USB connections for robust and flexible system design."
"This exciting product is the result of significant synergies between our two companies and is precisely what we envisioned when we acquired Acroname," said Gili Friedman, Head of the Cross-Industry Business Unit at Valens Semiconductor. "By combining the robust HDBaseT standard with Acroname's BrainStem technology, Acroname is delivering cutting-edge solutions that push the boundaries of USB extension and power delivery."
The USBExt3c will be officially unveiled at Integrated Systems Europe (ISE) 2025 from Feb 4, 2025 – Feb 7, 2025, and will be on display at the HDBaseT Alliance booth #2M500. In addition, Acroname will also be demonstrating other robust USB solutions that maximize system visibility, which are compatible with AVI-SPL's Symphony platform and Sennheiser's TeamConnect Bar products.
See the product page for photos and more information.
Contact Lance Davies for more information or interviews: lance@acroname.com
About Valens Semiconductor
Valens Semiconductor (NYSE: VLN) is a leader in high-performance connectivity, enabling customers to transform the digital experiences of people worldwide. Valens' chipsets are integrated into countless devices from leading customers, powering state-of-the-art audio-video installations, next-generation videoconferencing, and enabling the evolution of ADAS and autonomous driving. Pushing the boundaries of connectivity, Valens sets the standard everywhere it operates, and its technology forms the basis for the leading industry standards such as HDBaseT® and MIPI A-PHY.
For more information, visit https://www.valens.com/.
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SOURCE Acroname
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