Veeco Announces Agreement with IBM to Explore Wet Processing System for Advanced Packaging Applications
Veeco Instruments Inc. (NASDAQ: VECO) has announced an agreement with IBM to explore advanced packaging applications using Veeco's WaferStorm® Wet Processing System. The system will be installed at the Albany NanoTech Complex, where IBM and partners conduct R&D in advanced packaging and chiplet technologies.
The WaferStorm system enables important hybrid bonding cleaning processes with low defectivity thresholds at 40nm and 60nm. It features ImmJET multi-wafer immersion and high-pressure spray technology, allowing multiple processes on one flexible platform that can handle various wafer sizes and thicknesses.
This collaboration demonstrates Veeco's commitment to partnering with leading device manufacturers in critical emerging technologies, including cloud and AI innovation. The WaferStorm system is widely used in advanced packaging, MEMS, RF, data storage, and photonics markets due to its flexibility and low cost of ownership.
Veeco Instruments Inc. (NASDAQ: VECO) ha annunciato un accordo con IBM per esplorare applicazioni di imballaggio avanzato utilizzando il sistema di lavorazione umida WaferStorm® di Veeco. Il sistema sarà installato presso il Albany NanoTech Complex, dove IBM e i suoi partner conducono attività di ricerca e sviluppo in tecnologie di imballaggio avanzato e chiplet.
Il sistema WaferStorm consente importanti processi di pulizia per bonding ibrido con soglie di difettosità basse a 40nm e 60nm. Presenta la tecnologia di immersione multi-wafer ImmJET e spruzzatura ad alta pressione, consentendo molteplici processi su una piattaforma flessibile in grado di gestire diverse dimensioni e spessori di wafer.
Questa collaborazione dimostra l'impegno di Veeco a collaborare con i principali produttori di dispositivi in tecnologie emergenti critiche, inclusa l'innovazione nel cloud e nell'intelligenza artificiale. Il sistema WaferStorm è ampiamente utilizzato nei mercati dell'imballaggio avanzato, MEMS, RF, archiviazione dati e fotonica grazie alla sua flessibilità e al basso costo di proprietà.
Veeco Instruments Inc. (NASDAQ: VECO) ha anunciado un acuerdo con IBM para explorar aplicaciones de empaquetado avanzado utilizando el sistema de procesamiento húmedo WaferStorm® de Veeco. El sistema se instalará en el Albany NanoTech Complex, donde IBM y sus socios realizan I+D en tecnologías de empaquetado avanzado y chiplet.
El sistema WaferStorm permite importantes procesos de limpieza de unión híbrida con umbrales de defectos bajos a 40nm y 60nm. Presenta la tecnología de inmersión de múltiples obleas ImmJET y tecnología de pulverización a alta presión, lo que permite múltiples procesos en una plataforma flexible que puede manejar diversos tamaños y grosores de obleas.
Esta colaboración demuestra el compromiso de Veeco de asociarse con los principales fabricantes de dispositivos en tecnologías emergentes críticas, incluida la innovación en la nube y la inteligencia artificial. El sistema WaferStorm se utiliza ampliamente en los mercados de empaquetado avanzado, MEMS, RF, almacenamiento de datos y fotónica debido a su flexibilidad y bajo costo de propiedad.
Veeco Instruments Inc. (NASDAQ: VECO)는 Veeco의 WaferStorm® 습식 가공 시스템을 사용하여 고급 패키징 응용 프로그램을 탐색하기 위해 IBM과 협정 체결을 발표했습니다. 이 시스템은 IBM과 파트너들이 고급 패키징 및 칩렛 기술에 대한 연구 및 개발을 수행하는 Albany NanoTech Complex에 설치될 예정입니다.
WaferStorm 시스템은 40nm 및 60nm에서 낮은 결함 임계값을 가진 중요한 하이브리드 본딩 청소 프로세스를 가능하게 합니다. 여러 웨이퍼 크기와 두께를 처리할 수 있는 유연한 플랫폼 위에서 여러 프로세스를 수행할 수 있도록 ImmJET 다중 웨이퍼 침수 및 고압 스프레이 기술이 특징입니다.
이번 협업은 클라우드 및 인공지능 혁신을 포함한 핵심 신기술 분야의 주요 장치 제조업체와 파트너십을 맺기 위한 Veeco의 의지를 보여줍니다. WaferStorm 시스템은 유연성과 소유 비용이 낮기 때문에 고급 패키징, MEMS, RF, 데이터 저장 및 포토닉스 시장에서 널리 사용됩니다.
Veeco Instruments Inc. (NASDAQ: VECO) a annoncé un accord avec IBM pour explorer des applications d'emballage avancées utilisant le système de traitement humide WaferStorm® de Veeco. Le système sera installé au Albany NanoTech Complex, où IBM et ses partenaires effectuent des R&D sur les technologies d'emballage avancé et de chiplet.
Le système WaferStorm permet d'importants processus de nettoyage de liaison hybride avec des seuils de défauts bas à 40nm et 60nm. Il dispose de la technologie d'immersion multi-wafer ImmJET et d'une technologie de pulvérisation haute pression, permettant d'effectuer plusieurs processus sur une plateforme flexible pouvant gérer différentes tailles et épaisseurs de wafer.
Cette collaboration démontre l'engagement de Veeco à s'associer avec des fabricants de dispositifs de premier plan dans les technologies émergentes critiques, y compris l'innovation dans le cloud et l'IA. Le système WaferStorm est largement utilisé dans les marchés de l'emballage avancé, MEMS, RF, stockage de données et photonique en raison de sa flexibilité et de son faible coût de possession.
Veeco Instruments Inc. (NASDAQ: VECO) hat eine Vereinbarung mit IBM bekannt gegeben, um fortgeschrittene Verpackungsanwendungen mit dem WaferStorm® Nassverarbeitungssystem von Veeco zu erkunden. Das System wird im Albany NanoTech Complex installiert, wo IBM und Partner an F&E in fortgeschrittener Verpackungs- und Chiplet-Technologie arbeiten.
Das WaferStorm-System ermöglicht wichtige Reinigungsprozesse für hybrides Bonding mit niedrigen Defektgrenzwerten von 40nm und 60nm. Es bietet die ImmJET-Technologie für die Mehrwafer-Nassverarbeitung und Hochdrucksprühtechnologie, die es ermöglicht, mehrere Prozesse auf einer flexiblen Plattform zu bearbeiten, die verschiedene Wafergrößen und -dicken handhaben kann.
Diese Zusammenarbeit zeigt Veecos Engagement, mit führenden Geräteherstellern in kritischen aufstrebenden Technologien zusammenzuarbeiten, einschließlich Cloud- und KI-Innovationen. Das WaferStorm-System wird aufgrund seiner Flexibilität und niedrigen Betriebskosten in den Bereichen fortgeschrittenes Packaging, MEMS, RF, Datenspeicherung und Photonik weit verbreitet eingesetzt.
- Agreement with IBM to explore advanced packaging applications
- Installation of WaferStorm system at Albany NanoTech Complex for R&D
- WaferStorm system enables important hybrid bonding cleaning processes with low defectivity thresholds
- Flexible platform handling multiple wafer sizes and thicknesses
- Industry choice for critical wet processing applications in various markets
- None.
Insights
Veeco's agreement with IBM marks a significant step in advanced packaging technology. The WaferStorm® system's ability to handle 40nm and 60nm defectivity thresholds is important for hybrid bonding, a key process in chiplet technology. This collaboration could accelerate the development of more efficient and powerful AI and cloud computing systems.
The system's flexibility to handle multiple wafer sizes and processes on a single platform is a game-changer, potentially reducing manufacturing complexity and costs. This could lead to faster time-to-market for advanced chips, giving Veeco a competitive edge in the semiconductor equipment market.
However, the real test will be in the practical implementation and scalability of this technology. The success of this partnership could position Veeco as a key player in the evolving landscape of advanced packaging, which is becoming increasingly critical as traditional Moore's Law scaling faces challenges.
This partnership with IBM, a tech giant, could significantly boost Veeco's market position and financial outlook. While specific financial terms weren't disclosed, such collaborations often lead to increased revenue streams and market share in the long term.
Veeco's focus on advanced packaging aligns with industry trends, as the global advanced packaging market is projected to grow at a CAGR of 10.2% from 2023 to 2030. This strategic move could potentially increase Veeco's total addressable market and drive future growth.
Investors should monitor how this partnership translates into concrete financial results in upcoming quarters. Key metrics to watch include revenue growth, gross margins and order backlog. If successful, this collaboration could lead to similar partnerships, further strengthening Veeco's market position and financial performance.
Veeco’s WaferStorm® Wet Processing System to Enable Essential Cleaning Processes in Hybrid Bonding for IBM
PLAINVIEW, N.Y., Aug. 14, 2024 (GLOBE NEWSWIRE) -- Veeco Instruments Inc. (NASDAQ: VECO) today announced that IBM selected the WaferStorm® Wet Processing System for Advanced Packaging applications and has entered into a joint development agreement to explore advanced packaging applications using multiple wet processing technologies from Veeco. Under the agreement, the Waferstorm Wet Processing System will be installed at facilities at the Albany NanoTech Complex in Albany, NY, where IBM and other ecosystem partners are driving leading-edge R&D in advanced packaging and chiplet technologies.
The WaferStorm system enables crucial hybrid bonding cleaning processes such as resist strip, temporary bonding strip, and pre-bond cleaning with low defectivity thresholds at 40nm and 60nm. TheWaferStorm Wet Processing System’s ImmJET multi-wafer immersion and high-pressure spray technology can perform multiple processes on one flexible platform that can handle multiple wafer sizes and thicknesses with minimal hardware modifications.
“The collaboration with IBM illustrates Veeco’s commitment to partnering with leading device manufacturers at the forefront of critical emerging technologies including cloud and AI innovation,” commented Mathew Abraham, Veeco’s Vice President of Wet Processing Products. “Our innovative high throughput platform with industry-leading cost of ownership, powered by our proprietary ImmJET solvent technology, propels Advanced Packaging like never before and allows for superior process capabilities and cost-effectiveness. We’re keen to strengthen our relationship with IBM, a major tech pioneer pushing the limits of Advanced Packaging adoption.”
Due to its exceptional flexibility, Veeco’s WaferStorm system is the industry choice for critical wet processing applications in the advanced packaging, MEMS, RF, data storage, and photonics markets. The system supports a wide range of processes, including metal lift-off, photoresist, flux clean, scrubber, and TSV cleaning. With its process performance record and low cost of ownership, the WaferStorm system helps to ensure optimal results for photoresist strip and dry film strip applications, making it an ideal choice for customers keen on innovation.
About Veeco
Veeco (NASDAQ: VECO) is an innovative manufacturer of semiconductor process equipment. Its laser annealing, ion beam, chemical vapor deposition (CVD), metal organic chemical vapor deposition (MOCVD), single wafer etch and clean, and lithography technologies play an integral role in the fabrication and packaging of advanced semiconductor devices. With equipment designed to optimize performance, yield and cost of ownership, Veeco holds leading technology positions in the markets it serves. To learn more about Veeco’s systems and service offerings, visit www.veeco.com.
To the extent that this news release discusses expectations or otherwise makes statements about the future, such statements are forward-looking and are subject to a number of risks and uncertainties that could cause actual results to differ materially from the statements made. These factors include the risks discussed in the Business Description and Management’s Discussion and Analysis sections of Veeco’s Annual Report on Form 10-K for the year ended December 31, 2023, and in our subsequent quarterly reports on Form 10-Q, current reports on Form 8-K and press releases. Veeco does not undertake any obligation to update any forward-looking statements to reflect future events or circumstances after the date of such statements.
Veeco Contacts:
Investors: Anthony Pappone | (516) 500-8798 | apappone@veeco.com
Media: Kevin Long | (516) 714-3978 | klong@veeco.com
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