Welcome to our dedicated page for Taiwan Semi SEC filings (Ticker: TSM), a comprehensive resource for investors and traders seeking official regulatory documents including 10-K annual reports, 10-Q quarterly earnings, 8-K material events, and insider trading forms.
Taiwan Semiconductor Manufacturing Company Ltd. filings document the reporting framework of a foreign private issuer and ADR whose U.S. disclosures include Form 6-K current reports and annual Form 20-F materials. The filings cover consolidated revenue reports, quarterly earnings presentations, accounting differences between Taiwan-IFRSs and IASB-issued IFRSs, and operating results for the company's semiconductor foundry business.
TSMC's regulatory disclosures also address shareholder meeting agendas, business reports and financial statements, Audit and Risk Committee review materials, earnings distribution, directors' compensation, employee profit-sharing bonuses, amendments to corporate procedures, unsecured bond issuance, asset acquisitions and dispositions, capital appropriations, share cancellations, and changes in shareholdings or pledges by directors, executive officers and large shareholders.
Taiwan Semiconductor Manufacturing Co. Ltd. senior vice president Ying-Lang Wang reported a small open-market purchase of common shares through the company’s Employee Stock Purchase Plan. On June 5, an ESPP trust bought 56 common shares (2330.TW) at $76.01 per share under predetermined plan terms.
After this ESPP transaction, indirect holdings through the ESPP trust totaled 6,337 shares362,392 shares held directly, 1,135,529 shares held by the spouse, and 10,581 shares held by an LTI bonus plan trust over which Wang has investment control. The filing shows a net purchase of 56 shares and no reported sales.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD EVP and Co-COO Yuh-Jier Mii reported a small open-market purchase of 72 Common Shares (2330.TW) on June 5, 2026, acquired indirectly through an Employee Stock Purchase Plan trust at $76.0100 per share.
After this transaction, the ESPP trust holds 7,959 common shares for his benefit, while a separate Long-Term Incentive trust holds 63,345 common shares and he directly owns 1,254,057 common shares plus 25 American Depositary Shares.
He also holds Equity Linked Notes issued by UBS AG that reference a basket including TSM American Depositary Shares, which may settle in up to 703 ADS if conditions at their March 4, 2027 exercisable date are met.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD Chairman and CEO Che-Chia Wei reported an indirect purchase of 150 Common Shares (2330.TW) on behalf of an ESPP trust. The shares were bought on June 5, 2026 at $76.01 per share in an open-market transaction executed by the administrator of the company’s Employee Stock Purchase Plan under predetermined terms.
After this transaction, the ESPP trust held 17,689 common shares for his benefit. Separate holding entries show indirect ownership of 700,261 shares by his spouse and 285,245 shares via a Long-Term Incentive bonus plan trust, plus 7,452,349 shares held directly. This filing mainly updates the detailed breakdown of his direct and indirect ownership.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD Senior Vice President Shien-Yang Wu reported an open-market purchase of 57 Common Shares (2330.TW) on June 5, 2026, at an average price of $76.01 per share. The shares were bought by the administrator of the company’s Employee Stock Purchase Plan on behalf of Wu and are held indirectly through an ESPP trust.
Following this ESPP transaction, indirect holdings through the ESPP trust increased to 6,694 Common Shares. The filing also lists additional indirect holdings by Wu’s spouse of 90 American Depositary Shares and 198,943 Common Shares, and indirect holdings of 10,581 Common Shares through a Long-Term Incentive bonus plan trust, as well as 630,228 Common Shares held directly.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD VP Bor-Zen Tien reported small share purchases linked to the company’s Employee Stock Purchase Plan. On June 5, indirect accounts bought a total of 50 Common Shares (2330.TW) in open-market transactions at $76.01 per share, including 7 shares held for an immediate family member and 43 shares held by an ESPP trust, both under predetermined ESPP terms.
Following these transactions, Tien’s reported holdings include 107 American Depositary Shares, which each represent five Common Shares, and 11,051 Common Shares held directly, plus indirect holdings of 67 Common Shares for an immediate family member and 188 Common Shares in the ESPP trust. The activity reflects a modest, routine net purchase rather than a large position change.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD vice president and CIO Chris Horng-Dar Lin reported updated holdings, including a small purchase through the company’s employee plan. On June 5, 2026, a trust under the Employee Stock Purchase Plan bought 48 Common Shares (2330.TW) at about $76.01 per share, pursuant to terms predetermined by the issuer, bringing that ESPP trust position to 5,836 Common Shares.
Lin also reported indirect holdings in American Depositary Shares and Common Shares through a family trust, spouse, and a Long-Term Incentive bonus plan trust, as well as direct positions in both ADSs and Common Shares. No derivative positions were reported.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD VP Lu Lee-Chung reported a small share purchase and updated holdings. On June 5, 2026, an administrator for the company’s Employee Stock Purchase Plan bought 52 Common Shares (2330.TW) on his behalf at $76.01 per share, under predetermined plan terms.
Following this transaction, he holds 6,333 shares indirectly via the ESPP trust, 7,036 shares indirectly via an LTI trust, 15,000 shares indirectly through a spouse, and 276,716 shares directly. The filing shows no derivative positions and reflects a routine, compensation-linked purchase rather than a large discretionary trade.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD vice president Chin‑Sheng Lu reported an open‑market purchase of 37 common shares at about $76.01 per share. The shares were bought by the administrator of the company’s Employee Stock Purchase Plan under predetermined terms and are held indirectly by an ESPP trust.
After this filing, Lu is shown with 50,967 common shares held directly, 3,000 shares held indirectly by a spouse, and 37 shares held indirectly through the ESPP trust. This is a small, routine employee stock purchase rather than a large discretionary trade.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD VP Yung-Haw Liaw reported an indirect purchase of common shares through the company’s Employee Stock Purchase Plan. On June 5, 2026, the ESPP administrator bought 48 Common Shares (2330.TW) on his behalf at $76.01 per share, based on a New Taiwan dollar price translated at the disclosed exchange rate. After this ESPP transaction, he indirectly holds 6,193 shares via the ESPP trust, in addition to 430,000 shares held by Hsing Yu Investment Co., Ltd., 7,036 shares held by an LTI trust, and 463,054 shares held directly. The filing reflects a small, routine increase in his overall ownership primarily through employee plans.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD senior vice president Chun-Hsien Lee made a small open-market purchase of 51 common shares on behalf of an Employee Stock Purchase Plan at $76.01 per share, executed by the ESPP administrator under predetermined terms.
After this transaction, indirect holdings include 5,885 common shares held via an ESPP trust, 6,000 common shares held by a spouse, and 10,581 common shares held by a Long-Term Incentive trust, alongside 506,032 common shares held directly.