Valens Semiconductor to Showcase High-Performance Connectivity Innovations for AI Applications at Embedded World 2025
Valens Semiconductor (NYSE: VLN) has announced its participation at Embedded World 2025, where it will showcase innovative connectivity technology for AI applications. The company will demonstrate two key standards: MIPI A-PHY for native CSI-2 interface extension and HDBaseT USB3 for USB 3.2 extension.
The demonstrations will be conducted in collaboration with industry partners including Leopard Imaging, Intel, and Teledyne e2v. Key highlights include AI platform connectivity infrastructure for NVIDIA, EMC technology demonstrations showing 20x better noise resistance, and solutions for high-speed, long-reach sensor connectivity.
Valens will present two sessions at the event: one focusing on connectivity innovations in the industrial market and another addressing challenges in medical industry's transition to disposable endoscopes. The event will take place from March 11-13 at Hall 2, Booth 454.
Valens Semiconductor (NYSE: VLN) ha annunciato la sua partecipazione a Embedded World 2025, dove presenterà tecnologie innovative di connettività per applicazioni AI. L'azienda dimostrerà due standard chiave: MIPI A-PHY per l'estensione dell'interfaccia CSI-2 nativa e HDBaseT USB3 per l'estensione di USB 3.2.
Le dimostrazioni saranno condotte in collaborazione con partner del settore tra cui Leopard Imaging, Intel e Teledyne e2v. I punti salienti includono l'infrastruttura di connettività della piattaforma AI per NVIDIA, dimostrazioni della tecnologia EMC che mostrano una resistenza al rumore 20 volte migliore e soluzioni per la connettività di sensori ad alta velocità e lungo raggio.
Valens presenterà due sessioni all'evento: una focalizzata sulle innovazioni nella connettività nel mercato industriale e l'altra che affronta le sfide nella transizione dell'industria medica verso endoscopi usa e getta. L'evento si svolgerà dal 11 al 13 marzo presso il Padiglione 2, Stand 454.
Valens Semiconductor (NYSE: VLN) ha anunciado su participación en Embedded World 2025, donde presentará tecnologías innovadoras de conectividad para aplicaciones de IA. La empresa demostrará dos estándares clave: MIPI A-PHY para la extensión de la interfaz CSI-2 nativa y HDBaseT USB3 para la extensión de USB 3.2.
Las demostraciones se llevarán a cabo en colaboración con socios de la industria, incluidos Leopard Imaging, Intel y Teledyne e2v. Los aspectos destacados incluyen la infraestructura de conectividad de la plataforma de IA para NVIDIA, demostraciones de tecnología EMC que muestran 20 veces mejor resistencia al ruido, y soluciones para la conectividad de sensores de alta velocidad y largo alcance.
Valens presentará dos sesiones en el evento: una centrada en innovaciones de conectividad en el mercado industrial y otra que aborda los desafíos en la transición de la industria médica hacia endoscopios desechables. El evento se llevará a cabo del 11 al 13 de marzo en el Pabellón 2, Stand 454.
발렌스 반도체 (NYSE: VLN)는 Embedded World 2025에 참가하여 AI 애플리케이션을 위한 혁신적인 연결 기술을 선보일 것이라고 발표했습니다. 이 회사는 MIPI A-PHY를 통한 CSI-2 인터페이스 확장과 HDBaseT USB3를 통한 USB 3.2 확장의 두 가지 주요 표준을 시연할 예정입니다.
시연은 Leopard Imaging, Intel 및 Teledyne e2v와 같은 산업 파트너들과 협력하여 진행됩니다. 주요 하이라이트로는 NVIDIA를 위한 AI 플랫폼 연결 인프라, 20배 더 나은 노이즈 저항을 보여주는 EMC 기술 시연, 고속 및 장거리 센서 연결을 위한 솔루션이 포함됩니다.
발렌스는 행사에서 두 개의 세션을 발표할 예정입니다: 하나는 산업 시장의 연결 혁신에 초점을 맞추고, 다른 하나는 의료 산업의 일회용 내시경으로의 전환에서의 도전을 다룹니다. 이 행사는 3월 11일부터 13일까지 Hall 2, 부스 454에서 개최됩니다.
Valens Semiconductor (NYSE: VLN) a annoncé sa participation à Embedded World 2025, où elle présentera des technologies de connectivité innovantes pour des applications d'IA. L'entreprise démontrera deux normes clés : MIPI A-PHY pour l'extension de l'interface CSI-2 native et HDBaseT USB3 pour l'extension de l'USB 3.2.
Les démonstrations seront réalisées en collaboration avec des partenaires de l'industrie, notamment Leopard Imaging, Intel et Teledyne e2v. Les points forts incluent l'infrastructure de connectivité de la plateforme IA pour NVIDIA, des démonstrations de technologie EMC montrant une résistance au bruit 20 fois meilleure, et des solutions pour la connectivité de capteurs à haute vitesse et longue portée.
Valens présentera deux sessions lors de l'événement : l'une axée sur les innovations de connectivité dans le marché industriel et l'autre abordant les défis de la transition de l'industrie médicale vers des endoscopes jetables. L'événement se déroulera du 11 au 13 mars dans le Hall 2, Stand 454.
Valens Semiconductor (NYSE: VLN) hat seine Teilnahme an Embedded World 2025 angekündigt, wo es innovative Verbindungstechnologien für KI-Anwendungen präsentieren wird. Das Unternehmen wird zwei wichtige Standards demonstrieren: MIPI A-PHY zur Erweiterung der nativen CSI-2-Schnittstelle und HDBaseT USB3 zur Erweiterung von USB 3.2.
Die Demonstrationen werden in Zusammenarbeit mit Industriepartnern wie Leopard Imaging, Intel und Teledyne e2v durchgeführt. Zu den wichtigsten Highlights gehören die Verbindungsinfrastruktur der KI-Plattform für NVIDIA, EMC-Technologiedemonstrationen, die eine 20-fache bessere Geräuschresistenz zeigen, und Lösungen für Hochgeschwindigkeits- und Langstrecken-Sensorkonnektivität.
Valens wird auf der Veranstaltung zwei Sitzungen präsentieren: eine, die sich auf Verbindungstechnologien im Industriesektor konzentriert, und eine andere, die die Herausforderungen des Wechsels der Medizinbranche zu Einweg-Endoskopen behandelt. Die Veranstaltung findet vom 11. bis 13. März in Halle 2, Stand 454 statt.
- Demonstration of superior EMC technology with 20x better noise resistance
- Strategic partnerships with major industry players including Intel and Teledyne
- Integration of two standard-compliant chipsets expanding market reach
- None.
HOD HASHARON,
Two innovative connectivity standards, MIPI A-PHY and HDBaseT USB3, will take center stage at the Valens booth. MIPI A-PHY provides native extension of the widely-used CSI-2 interface, offering robotics developers the ability to separate processing from the perception sensors, which provides unprecedented design flexibility, cost-efficiency, and performance. HDBaseT USB3 provides the extension of USB 3.2, allowing leading camera vendors to extend their USB 3.2 product lines for applications requiring long link distances.
Demonstrations at Valens' booth will include:
The Ultimate Connectivity Infrastructure for NVIDIA – AI platforms, including AMR, robotic arms, and more.
EMC Technology Shootout – Valens chipsets withstand 20 times more noise in a live side-by-side EMC shootout against a competing legacy solution.
Simplest Wiring Infrastructure – Native CSI-2 extension based on the MIPI A-PHY standard, enabling high-speed, long-reach sensor connectivity over the most challenging connectors and cables.
Solving USB Challenges for Embedded Systems – Extension and test automation for the USB 3 protocol.
Valens will have two speaking opportunities at the show:
- How Can Connectivity Innovations Transform the Industrial Market?
- March 11, 11:00-11:30AM CET
- Session 1.1 IOT & Connectivity
- Addressing the Challenges in the Medical Industry's Transition to Disposable Endoscopes
- March 11, 3:00 – 3:30PM CET
- Session 6.1 Embedded Vision
"Valens' entry into machine vision is already shaking up the market, with two standard-compliant chipsets that offer transformative connectivity," said Moti Strobach, VP Business Development at Valens Semiconductor. "Our chipsets extend two of the most commonly used interfaces in the industry, allowing our customers and partners to reach new and exciting applications. We're proud to showcase our technology at Embedded 2025, and we welcome you to visit us at our booth."
Date: Mar. 11-13
Booth: Hall 2, 454
Schedule a demo tour with our experts and discover Valens' high-performance sensor connectivity.
About Valens Semiconductor
Valens Semiconductor (NYSE: VLN) is a leader in high-performance connectivity, enabling customers to transform the digital experiences of people worldwide. Valens' chipsets are integrated into countless devices from leading customers, powering state-of-the-art audio-video installations, next-generation videoconferencing, and enabling the evolution of ADAS and autonomous driving. Pushing the boundaries of connectivity, Valens sets the standard everywhere it operates, and its technology forms the basis for the leading industry standards such as HDBaseT® and MIPI A-PHY. For more information, visit https://www.valens.com/.
Forward-Looking Statements
This press release includes "forward-looking statements" within the meaning of the "safe harbor" provisions of the United States Private Securities Litigation Reform Act of 1995. Forward-looking statements may be identified by the use of words such as "estimate," "plan," "project," "forecast," "intend," "will," "expect," "anticipate," "believe," "seek," "target" or other similar expressions that predict or indicate future events or trends or that are not statements of historical matters. These forward-looking statements include, but are not limited to, statements regarding our anticipated future results, including financial results, our five-year plan, currency exchange rates, and contract wins, and future economic and market conditions. These statements are based on various assumptions, whether or not identified in this press release, and on the current expectations of Valens Semiconductor's ("Valens") management and are not predictions of actual performance. These forward-looking statements are provided for illustrative purposes only and are not intended to serve as and must not be relied on by any investor as a guarantee, an assurance, a prediction or a definitive statement of fact or probability. Actual events and circumstances are difficult or impossible to predict and will differ from assumptions. Many actual events and circumstances are beyond the control of Valens Semiconductor. These forward-looking statements are subject to a number of risks and uncertainties, including the cyclicality of the semiconductor industry; the effect of inflation and a rising interest rate environment on our customers and industry; the ability of our customers to absorb inventory; competition in the semiconductor industry, and the failure to introduce new technologies and products in a timely manner to compete successfully against competitors; if Valens fails to adjust its supply chain volume due to changing market conditions or fails to estimate its customers' demand; disruptions in relationships with any one of Valens' key customers; any difficulty selling Valens' products if customers do not design its products into their product offerings; Valens' dependence on winning selection processes; even if Valens succeeds in winning selection processes for its products, Valens may not generate timely or sufficient net sales or margins from those wins; sustained yield problems or other delays or quality events in the manufacturing process of products; our ability to effectively manage, invest in, grow, and retain our sales force, research and development capabilities, marketing team and other key personnel; our ability to timely adjust product prices to customers following price increase by the supply chain; our ability to adjust our inventory level due to reduction in demand due to inventory buffers accrued by customers; our expectations regarding the outcome of any future litigation in which we are named as a party; our ability to adequately protect and defend our intellectual property and other proprietary rights; our ability to successfully integrate or otherwise achieve anticipated benefits from acquired businesses; the market price and trading volume of the Valens ordinary shares may be volatile and could decline significantly; global political and economic uncertainty, including with respect to
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Valens Semiconductor Ltd.
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