UMC Launches Most Advanced 22nm eHV Platform to Power Next-Generation Smartphone Displays

Rhea-AI Summary

United Microelectronics (UMC) has launched its most advanced 22nm embedded high voltage (eHV) technology platform. This platform, named 22eHV, is designed to power premium displays for smartphones and other mobile devices, offering improved power efficiency and reduced die size.

The 22eHV platform is the first in the industry to accommodate the rising penetration of AMOLED displays, reducing core device power consumption by up to 30% compared to 28nm eHV processes. It also features the industry's smallest SRAM bit cells, reducing die area by 10%, and enhances image processing speed for high-resolution images and fast response times.

UMC has been a leader in the AMOLED DDIC market since 2020 and currently holds more than 90% market share for 28nm small-panel DDICs. The company aims to expand its eHV portfolio to FinFET technology to meet future display trends.

Positive

• Launch of the advanced 22nm eHV platform, 22eHV.
• Improved power efficiency: 30% reduction in core device power consumption compared to 28nm.
• Smaller die size: 10% reduction in die area due to the smallest SRAM bit cells.
• Enhanced image processing speed and response time for high-resolution images.
• UMC holds over 90% market share in the 28nm small-panel DDIC market.

Negative

• None.

Tech Expert

UMC's launch of the 22nm embedded high voltage (eHV) technology platform is a significant advancement in the semiconductor industry. This new technology offers up to 30% reduction in power consumption compared to the previous 28nm processes, which is an impressive leap. It's particularly relevant for the growing AMOLED display market, used in high-end smartphones. This technology's ability to reduce die size and improve image processing speed while maintaining power efficiency is a compelling proposition for mobile device manufacturers.

The reduction of die area by 10% due to the industry's smallest SRAM bit cells is another noteworthy achievement. This not only reduces production costs but also allows for more compact design in smartphones. These enhancements can result in longer battery life and better performance, which are key selling points in the competitive mobile device market.

From an investor's perspective, UMC’s move to 22nm eHV is likely to enhance its market position, especially as it already holds a dominant share in the 28nm small-panel DDIC market. This could lead to increased revenue and potentially higher stock value as demand for efficient and high-performance display drivers grows.

In the long term, UMC's strategy to expand its eHV portfolio to FinFET displays its forward-thinking approach and commitment to staying ahead of display trends. Investors should consider the potential for UMC to maintain and even grow its market leadership with this new technology.

Market Research Analyst

For retail investors, UMC's announcement signifies a strategic advancement that aligns with the increasing penetration of AMOLED displays in the smartphone market. This development is instrumental given the industry's constant push for better battery performance and superior visual quality. The 30% reduction in core device power consumption and the 10% decrease in die area are critical factors that can translate into improved user experience and cost efficiency for manufacturers.

UMC’s established dominance in the 28nm DDIC market, with over 90% share, indicates strong expertise and reliability, which bodes well for the adoption of the 22nm platform. Such a strong market footing suggests that UMC is well-positioned to capitalize on its innovations and sustain its leadership. The company's proactive move to work on future trends, such as FinFET, further strengthens its growth trajectory.

Investors should monitor the adoption rate of this new technology by major smartphone manufacturers, as it can be a strong indicator of UMC's future financial performance. Additionally, UMC's ability to maintain its competitive edge in terms of manufacturing and technological advancements will be important for its long-term success.

HSINCHU, Taiwan--(BUSINESS WIRE)-- United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced the availability of its 22nm embedded high voltage (eHV) technology platform, the most advanced display driver IC foundry solution in the market to power premium displays for smartphones and other mobile devices. With unmatched power efficiency and reduced die size, the new platform, 22eHV, enables mobile device manufacturers to enhance battery life of their products while offering superior visual experiences.

To accommodate for the rising penetration of AMOLED displays in smartphones, UMC is the first in the industry to launch a 22nm eHV platform, which reduces core device power consumption by up to 30% compared to 28m eHV processes. The new display driver IC (DDIC) solution also boasts the industry’s smallest SRAM bit cells, reducing die area by 10%, as well as improved image processing speed for high-resolution images and fast response time.

“We are proud to be the first in the industry to introduce a 22nm eHV solution, empowering our customers to develop compact, power-efficient display drivers for next-generation smartphones,” said Steven Hsu, UMC’s Vice President of Technology Development. “UMC has been the undisputed foundry leader in the AMOLED DDIC market since we started 28nm eHV production in 2020. With the launch of 22eHV, we once again demonstrate our world-class eHV capabilities and commitment to enabling our customers’ product roadmaps. Beyond 22nm, our development teams are working on expanding our eHV portfolio to FinFET in anticipation of future display trends.”

With decades of experience in DDIC technology development and wafer manufacturing, UMC was the first pure-play foundry to begin mass production of 28nm small-panel DDICs. Since then, UMC has dominated the 28nm small-panel DDIC market with more than 90% share*. Small-panel DDICs are used to power AMOLED and OLED displays in smartphones, tablets, IoT devices, and virtual reality/augmented reality applications.

*According to data from UMC and Omdia

About UMC

UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry company. The company provides high-quality IC fabrication services, focusing on logic and various specialty technologies to serve all major sectors of the electronics industry. UMC’s comprehensive IC processing technologies and manufacturing solutions include Logic/Mixed-Signal, embedded High-Voltage, embedded Non-Volatile-Memory, RFSOI, BCD etc. Most of UMC's 12-in and 8-in fabs with its core R&D are located in Taiwan, with additional ones throughout Asia. UMC has a total of 12 fabs in production with combined capacity of more than 400,000 wafers per month (12-in equivalent), and all of them are certified with IATF 16949 automotive quality standard. UMC is headquartered in Hsinchu, Taiwan, plus local offices in United States, Europe, China, Japan, Korea & Singapore, with a worldwide total of 20,000 employees. For more information, please visit: http://www.umc.com.

Note from UMC Concerning Forward-Looking Statements

Some of the statements in the foregoing announcement are forward-looking within the meaning of the U.S. Federal Securities laws, including statements about introduction of new services and technologies, future outsourcing, competition, wafer capacity, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information regarding these and other risks is included in UMC’s filings with the U.S. Securities and Exchange Commission. UMC does not undertake any obligation to update any forward-looking statement as a result of new information, future events or otherwise, except as required under applicable law.

View source version on businesswire.com: https://www.businesswire.com/news/home/20240619596872/en/

Media

UMC Corporate Communications

Michelle Yun

886-3-578-2258 x16951

michelle_yun@umc.com

Source: United Microelectronics Corporation

FAQ

What is UMC's new 22nm eHV platform?

UMC's new 22nm eHV platform, named 22eHV, is an advanced display driver IC technology designed to power premium displays for smartphones and other mobile devices with improved power efficiency and reduced die size.

How much power consumption reduction does UMC's 22eHV platform offer?

UMC's 22eHV platform offers up to a 30% reduction in core device power consumption compared to 28nm eHV processes.

What are the benefits of UMC's 22eHV platform for smartphone displays?

The benefits of UMC's 22eHV platform for smartphone displays include improved power efficiency, reduced die size, enhanced image processing speed, and faster response times for high-resolution images.

What market share does UMC hold in the 28nm small-panel DDIC market?

UMC holds more than 90% market share in the 28nm small-panel DDIC market.

What future developments are planned for UMC's eHV technology?

UMC plans to expand its eHV technology portfolio to FinFET to accommodate future display trends.