Welcome to our dedicated page for United Microelec news (Ticker: UMC), a resource for investors and traders seeking the latest updates and insights on United Microelec stock.
United Microelectronics Corporation (UMC) (NYSE: UMC; TWSE: 2303) is a global semiconductor foundry that regularly publishes detailed operational and financial updates, making its news flow highly relevant to investors and industry observers. As a manufacturer of integrated circuits focused on logic and specialty technologies, UMC issues frequent announcements on monthly sales, quarterly results, technology milestones, and strategic collaborations.
News for UMC commonly includes monthly revenue reports that summarize unaudited net sales, often presented with year-over-year comparisons and cumulative figures for the year. The company also releases quarterly earnings updates that cover revenue, margins, capacity utilization, wafer shipments, cash flow, and regional and application-based revenue breakdowns. These disclosures provide insight into demand trends across communication, consumer, computer, and other end markets, as well as the mix of technology geometries and customer types such as fabless companies and IDMs.
UMC’s news stream also highlights technology and product platform developments, such as the introduction of its 55nm BCD platform for power management ICs and the expansion of its silicon photonics roadmap through a licensing agreement with imec. In addition, the company reports on partnerships and manufacturing initiatives, including memoranda of understanding to support onshore semiconductor production and strengthen supply chain resilience.
By following UMC news, readers can track how the foundry’s capacity, technology portfolio, and application mix evolve over time. Stock Titan’s UMC news page brings these updates together so that investors and analysts can review sales trends, technology announcements, and regional developments in one place.
UMC (NYSE: UMC) filed its 2025 annual report on Form 20-F with the U.S. Securities and Exchange Commission on April 30, 2026. The report is available for download and shareholders may request a free hard copy.
For access, UMC provided a download link and an investor relations email for hard copy requests.
UMC (NYSE: UMC) reported 1Q26 consolidated revenue of NT$61.04 billion, gross margin of 29.2%, and net income attributable to shareholders of NT$16.17 billion (EPS NT$1.29; ADS US$0.204). Wafer shipments were 1,021K with 79% utilization; 22nm contributed 14% of revenue. CAPEX guidance is US$1.5 billion for 2026. UMC expects wafer shipments to rise by high-single digits in Q2 2026.
United Microelectronics (NYSE: UMC) reported unaudited consolidated net sales for March 2026 and the first quarter.
March 2026 net sales were NT$20,830,626 thousand, up NT$971,979 thousand (+4.89% year-over-year). Jan.–Mar. 2026 net sales were NT$61,037,902 thousand, up NT$3,178,945 thousand (+5.49% year-over-year). All figures are in consolidated thousands of New Taiwan Dollars.
HyperLight, UMC (NYSE: UMC) and Wavetek announced a collaboration with Jabil to scale thin-film lithium niobate (TFLN) photonics for hyperscale AI data-center interconnects. The partnership combines HyperLight's TFLN chiplet platform, UMC/Wavetek wafer foundry capacity, and Jabil's high-volume system integration to enable energy-efficient optical modules for rack-level deployment.
The collaboration emphasizes lower power per module, reduced laser counts, and scalable 6-inch and 8-inch manufacturing to support mass deployment in AI clusters.
HyperLight, UMC (NYSE: UMC), and Wavetek announced a strategic partnership to enable high-volume foundry production of the TFLN Chiplet Platform on both 6-inch and 8-inch wafers. The collaboration pairs HyperLight platform architecture with Wavetek's 6-inch HVM experience and UMC's 8-inch production capability to support AI and cloud infrastructure deployment at scale.
The platform unifies IMDD, coherent, and co-packaged optics requirements, targets extreme modulation bandwidth, CMOS-level drive voltages, ultralow optical loss, reduced laser consumption, and aims to lower power and manufacturing complexity for data center and emerging quantum/sensing applications.
United Microelectronics Corporation (NYSE: UMC) reported unaudited consolidated net sales for February 2026 of NT$19,345,126 thousand, up NT$1,151,611 thousand or 6.33% year-over-year. Cumulative Jan.–Feb. 2026 sales were NT$40,207,276 thousand, a 5.81% increase versus Jan.–Feb. 2025.
All figures are in thousands of New Taiwan Dollars and consolidated.
United Microelectronics Corporation (UMC) reported unaudited consolidated net sales for January 2026 of NT$20,862,150 thousand, up NT$1,055,355 thousand or 5.33% year-over-year. The monthly total equals the year-to-date figure reported for Jan.-Jan.
UMC (NYSE: UMC) reported 4Q25 revenue of NT$61.81 billion, gross margin 30.7% and EPS of NT$0.81. Full-year results included a 93% YoY increase in 22nm revenue and shipments up 12.3% year-on-year. Cash and equivalents were NT$110.66 billion with free cash flow of NT$17.38 billion in 4Q25.
The company noted record 22nm quarterly revenue, capacity utilization of 78%, and ongoing investments in Singapore Phase 3 and US partnerships for growth in 2026.
United Microelectronics Corporation (NYSE: UMC) reported unaudited consolidated net sales for December 2025 and for the full year 2025 in New Taiwan Dollars (NT$) thousands.
Key figures: December 2025 revenue NT$19,280,724 versus NT$18,965,818 in December 2024, a Y/Y increase of NT$314,906 (1.66%). Jan.–Dec. 2025 revenue NT$237,553,199 versus NT$232,302,584 in 2024, a Y/Y increase of NT$5,250,615 (2.26%). All figures are consolidated and unaudited.
UMC (NYSE: UMC) licensed imec’s iSiPP300 silicon photonics process to accelerate its 12-inch silicon photonics roadmap and support next‑generation connectivity. The transfer adds co‑packaged optics (CPO) compatibility and leverages UMC’s SOI wafer expertise plus prior 8‑inch photonics experience.
The company said it is working with several new customers for optical transceiver PICs, with risk production slated for 2026 and 2027, and plans to combine the platform with advanced packaging and 3D modules to target data center and high‑performance computing interconnects.