Tower Semiconductor Releases 300mm 65nm 3.3V-Based BCD Power Management Platform
Tower Semiconductor (NASDAQ/TASE: TSEM) has announced its new 300mm 65nm 3.3V-based BCD Power management platform (PML), complementing its existing 5V-based offering currently in high-volume production in Japan and undergoing qualification in Albuquerque, New Mexico.
The platform features LDMOS devices with ultra-low on-resistance and best-in-class figure-of-merit, designed for high power efficiency in mobile devices, AI, and data center applications. The technology includes power devices with wide voltage range and 3.3V gate voltage capability, suitable for PMIC, Audio IC, and high-power voltage regulators for GPU and CPU applications.
Tower Semiconductor (NASDAQ/TASE: TSEM) ha annunciato la sua nuova piattaforma di gestione dell'alimentazione BCD a 300mm e 65nm basata su 3.3V (PML), che completa l'offerta esistente a 5V attualmente in produzione ad alta volumetria in Giappone e in fase di certificazione ad Albuquerque, Nuovo Messico.
La piattaforma presenta dispositivi LDMOS con resistenza di attivazione ultra-bassa e una figura di merito ai vertici della categoria, progettati per alta efficienza energetica in dispositivi mobili, intelligenza artificiale e applicazioni nei data center. La tecnologia include dispositivi di potenza con ampio intervallo di tensione e capacità di tensione di gate a 3.3V, adatti per PMIC, Audio IC e regolatori di tensione ad alta potenza per applicazioni GPU e CPU.
Tower Semiconductor (NASDAQ/TASE: TSEM) ha anunciado su nueva plataforma de gestión de energía BCD de 300 mm y 65 nm basada en 3.3V (PML), complementando su oferta existente de 5V que actualmente se encuentra en producción a gran escala en Japón y en proceso de calificación en Albuquerque, Nuevo México.
La plataforma presenta dispositivos LDMOS con resistencia de encendido ultra-baja y mejor figura de mérito de su clase, diseñados para una alta eficiencia energética en dispositivos móviles, IA y aplicaciones en centros de datos. La tecnología incluye dispositivos de potencia con amplio rango de voltaje y capacidad de voltaje de puerta de 3.3V, adecuados para PMIC, Audio IC y reguladores de voltaje de alta potencia para aplicaciones de GPU y CPU.
타워 반도체(NASDAQ/TASE: TSEM)는 새로운 300mm 65nm 3.3V 기반 BCD 전원 관리 플랫폼(PML)을 발표했습니다. 이 플랫폼은 현재 일본에서 대량 생산되고 있는 5V 기반 제품을 보완하며 뉴멕시코주 앨버커키에서 인증 절차를 진행 중입니다.
이 플랫폼은 휴대기기, 인공지능 및 데이터 센터 애플리케이션에서 높은 전력 효율성을 위해 설계된 초저 저항 LDMOS 장치를 특징으로 하며, 동급 최고의 성능 지표를 제공합니다. 기술은 PMIC, 오디오 IC 및 GPU와 CPU 애플리케이션을 위한 고전력 전압 레귤레이터에 적합한 넓은 전압 범위와 3.3V 게이트 전압 기능을 갖춘 전력 장치를 포함합니다.
Tower Semiconductor (NASDAQ/TASE: TSEM) a annoncé sa nouvelle plateforme de gestion de puissance BCD de 300 mm et 65 nm basée sur 3,3 V (PML), complétant son offre existante à 5 V actuellement en production de masse au Japon et en cours de qualification à Albuquerque, Nouveau-Mexique.
La plateforme comprend des dispositifs LDMOS avec une résistance à l'état passant ultra-faible et les meilleures performances de sa catégorie, conçus pour une efficacité énergétique élevée dans les dispositifs mobiles, l'IA et les applications de centres de données. La technologie inclut des dispositifs de puissance avec une large plage de tension et une capacité de tension de grille de 3,3 V, adaptés aux PMIC, Audio IC et régulateurs de tension de haute puissance pour les applications GPU et CPU.
Tower Semiconductor (NASDAQ/TASE: TSEM) hat seine neue 300 mm 65 nm BCD-basierte Power Management-Plattform (PML) mit 3,3 V vorgestellt, die das bestehende Angebot mit 5 V ergänzt, das derzeit in Japan in Hochvolumenproduktion läuft und sich in Albuquerque, New Mexico, in der Qualifizierung befindet.
Die Plattform bietet LDMOS-Geräte mit ultra-niedrigem Durchgangswiderstand und erstklassigen Leistungskennzahlen, die für hohe Energieeffizienz in mobilen Geräten, KI und Rechenzentrumsanwendungen entwickelt wurden. Die Technologie umfasst Leistungsgeräte mit einem breiten Spannungsbereich und einer Gate-Spannungsfähigkeit von 3,3 V, die für PMIC, Audio-ICs und Hochleistungs-Spannungsregler für GPU- und CPU-Anwendungen geeignet sind.
- Introduction of new advanced 300mm 65nm power management platform
- Platform features ultra-low on-resistance and best-in-class figure-of-merit
- Technology enables improved power consumption and extended battery life
- Expands product portfolio for mobile, AI, and data center markets
- None.
Insights
The release of Tower Semiconductor's 300mm 65nm 3.3V-based BCD power management platform marks a technical advancement, but carries moderate market implications. The platform's ultra-low on-resistance LDMOS devices and voltage flexibility are optimized for power-intensive applications in mobile, AI and data center markets. While this positions TSEM competitively in the
The technical specifications suggest a
The platform complements TSEM's existing 5V-based offering and expands manufacturing capabilities across facilities in Japan and New Mexico, indicating a strategic move to capture market share in high-growth segments. For investors, this represents a long-term value proposition rather than a short-term catalyst.
The strategic significance of this platform lies in its timing and market positioning. With AI workloads driving unprecedented demand for efficient power management solutions and data centers facing mounting pressure to reduce energy consumption, TSEM's new platform addresses critical industry pain points.
The 3.3V-based architecture, particularly optimized for modern mobile devices and AI accelerators, positions TSEM to capture share in high-margin segments. The platform's ability to support both overdrive and underdrive capabilities significantly expands its application scope, especially in PMICs and voltage regulators for GPU/CPU applications.
However, the market is highly competitive with established players like Texas Instruments and Infineon. TSEM's success will depend on customer qualification cycles and the platform's actual performance in real-world applications. The true value proposition lies in enabling customers to develop differentiated products, but this requires successful customer engagement and design wins.
Delivering high-efficiency power, high-performance analog, and high-density digital in a single power management platform for mobile, AI, and data center applications
MIGDAL HAEMEK, Israel, December 23, 2024 – Tower Semiconductor (NASDAQ/TASE: TSEM), a leading foundry of high-value analog semiconductor solutions, today announced its new 300mm 65nm 3.3V-based BCD Power management platform, PML, in addition to its successful 5V-based offering already in high-volume production in Japan and that which is being qualified in Albuquerque, New Mexico, USA, manufacturing site. This new, cutting-edge platform addresses the stringent low-voltage requirements of mobile devices and meets the growing demands for high power efficiency and power density in AI and data center applications.
The advanced 300mm BCD PML offering comprises LDMOS devices with ultra-low on-resistance and best-in-class figure-of-merit, achieving highest power conversion efficiency for fast switching converters. In addition, it features power devices with wide voltage range and a nominal 3.3V gate voltage that can be substantially overdriven and underdriven addressing products such as PMIC, Audio IC, and high-power voltage regulators for GPU and CPU. These advantages enable users to achieve outstanding performance in power consumption and extend battery life in battery operated applications.
“Our new PML platform exemplifies Tower Semiconductor’s continuous success in providing cutting-edge power management technology solutions,” said Shimon Greenberg, General Manager of Power Management Business Unit. “Specifically designed for advanced power management applications, this innovation empowers our customers to develop industry-leading products with a competitive edge that address the evolving demands of the strategic mobile, AI, and data center markets”.
For additional information on Tower’s PM technology platform, please visit here.
About Tower Semiconductor
Tower Semiconductor Ltd. (NASDAQ/TASE: TSEM), the leading foundry of high-value analog semiconductor solutions, provides technology, development, and process platforms for its customers in growing markets such as consumer, industrial, automotive, mobile, infrastructure, medical and aerospace and defense. Tower Semiconductor focuses on creating a positive and sustainable impact on the world through long-term partnerships and its advanced and innovative analog technology offering, comprised of a broad range of customizable process platforms such as SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS image sensor, non-imaging sensors, displays, integrated power management (BCD and 700V), photonics, and MEMS. Tower Semiconductor also provides world-class design enablement for a quick and accurate design cycle as well as process transfer services including development, transfer, and optimization, to IDMs and fabless companies. To provide multi-fab sourcing and extended capacity for its customers, Tower Semiconductor owns two facilities in Israel (150mm and 200mm), two in the U.S. (200mm), two in Japan (200mm and 300mm) which it owns through its
Safe Harbor Regarding Forward-Looking Statements
This press release includes forward-looking statements, which are subject to risks and uncertainties. Actual results may vary from those projected or implied by such forward-looking statements. A complete discussion of risks and uncertainties that may affect the accuracy of forward-looking statements included in this press release or which may otherwise affect Tower’s business is included under the heading “Risk Factors” in Tower’s most recent filings on Forms 20-F and 6-K, as were filed with the Securities and Exchange Commission (the “SEC”) and the Israel Securities Authority. Tower does not intend to update, and expressly disclaim any obligation to update, the information contained in this release.
Tower Semiconductor Investor Relations Contact: Noit Levy | +972-4-604-7066 | noitle@towersemi.com
Tower Semiconductor Company Contact: Orit Shahar | +972-74-7377440 | oritsha@towersemi.com
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