Welcome to our dedicated page for Tower Semiconductor news (Ticker: TSEM), a resource for investors and traders seeking the latest updates and insights on Tower Semiconductor stock.
Tower Semiconductor Ltd (NASDAQ/TASE: TSEM) is a pure-play specialty semiconductor foundry focused on high-value analog semiconductor solutions. News related to Tower Semiconductor often centers on its technology platforms, collaborations with customers and partners, and its role in markets such as consumer, industrial, automotive, mobile, infrastructure, medical, and aerospace and defense.
Recent announcements highlight collaborations in Silicon Photonics (SiPho) and power management, including work on AI datacenter fabrics, optical interconnects, and high-efficiency power conversion for servers and AI compute systems. Other news items describe silicon photonics-based FMCW LiDAR for automotive and Physical AI applications, high-speed imaging solutions with embedded analog AI, and wafer-scale 3D-IC integration that combines SiPho and SiGe BiCMOS processes for Co-Packaged Optics and data center applications.
Investors and industry followers can also find updates on Tower Semiconductor’s participation in global technology and investor conferences, as well as its Technical Global Symposium series, which showcases its analog, RF, sensor, display, power management, and photonics capabilities. Earnings releases and Form 6-K filings provide additional context on the company’s operations and strategic focus.
This news page aggregates these developments, offering a single view into Tower Semiconductor’s ongoing technology announcements, market collaborations, financial updates, and corporate events. Users interested in analog foundry technologies, silicon photonics, RF, sensors, and power management can use this feed to follow how Tower Semiconductor’s platforms are being applied across AI, connectivity, automotive, and industrial markets.
Tower Semiconductor (NASDAQ: TSEM) and Axiro Semiconductor announced availability of U.S.-fabricated Ku- and X-band radar beamforming ICs (BFICs) built on Tower's SiGe technology on April 27, 2026.
The BFICs are ramping to volume production, designed for defense radar and satcom, and positioned to reinforce secure U.S. supply chains for mission-critical radar applications.
Tower Semiconductor (NASDAQ/TASE: TSEM) will release its Q1 2026 earnings on Wednesday, May 13, 2026 and will host a conference call the same day at 10:00 a.m. ET. The call will cover Q1 2026 results and Q2 2026 guidance.
According to Tower Semiconductor, the call will be webcast via the company Investor Relations site, requires pre-registration for dial-in details and PIN, and will be available for replay for 90 days.
Tower Semiconductor (NASDAQ/TASE: TSEM) announced a strategic restructuring to take full ownership of its 300mm Fab 7 in Japan and transfer full ownership of the 200mm Fab 5 to Nuvoton affiliate NTCJ.
The transaction targets an April 1, 2027 close, includes mutual long‑term supply agreements to avoid customer disruption, and contemplates expanding Uozu 300mm capacity to about 4x current levels pending METI subsidy and customary approvals.
Tower Semiconductor (NASDAQ/TASE: TSEM) and Nuvoton announced a strategic restructuring of TPSCo effective upon closing, expected April 1, 2027, subject to customary conditions and regulatory approvals. Tower will acquire full ownership and control of TPSCo's 12‑inch fab and foundry business. NTCJ will acquire TPSCo's 8‑inch fab and foundry business and pay $25 million to Tower on closing. The parties will provide reciprocal production services and aim to maintain continuity of customer engagements, operations, development programs and employee stability across both facilities.
Tower Semiconductor (NASDAQ/TASE: TSEM) and Coherent (NYSE: COHR) demonstrated 400 Gbps/lane data transmission using a silicon Mach-Zehnder modulator built in a production-ready silicon photonics (SiPho) process on March 23, 2026.
The demo achieved a clear open eye at 420 Gb/s PAM4, used Coherent’s InP CW high-power laser, and targets next-generation 3.2T optical transceivers for pluggable and co-packaged optics in datacenter links.
Tower Semiconductor (NASDAQ/TASE: TSEM) released its Gen3 BCD LDMOS power management platform to address rising AI data center power demands and high-current applications. The platform targets higher efficiency, lower heat, and die-size reduction for power management ICs, and targets Monolithic Smart Power Stage/DrMOS markets.
Tower will present these developments at APEC 2026 March 23–25 in San Antonio (booth #1455); a presentation by Dr. Mete Erturk is scheduled March 24, 3:45–4:15 PM at Expo Theater 3.
Tower Semiconductor (NASDAQ/TASE: TSEM) and Oriole Networks announced a collaboration to deliver nanosecond optical circuit switching for AI scale-up and scale-out networking using Tower's silicon photonics platform. The partnership targets ultra-low, deterministic tail latency and high-bandwidth optical interconnects for AI data centers.
The work aims to integrate lasers, amplification, switching, modulation, and detection on a single SiPho platform and to commercialize Oriole's PRISM networking architecture; company representatives will attend OFC 2026, March 17–19 in Los Angeles.
Tower Semiconductor (NASDAQ/TASE: TSEM) will participate in OFC 2026 March 17–19, 2026 at the Los Angeles Convention Center, booth #2221.
Company representatives will discuss its Silicon Photonics (SiPho) roadmap and showcase SiPho and SiGe BiCMOS solutions for telecom, co‑packaged optics, DWDM lasers, FMCW LiDAR and quantum computing. A partner demo schedule will be posted on the company events webpage.
Tower Semiconductor (NASDAQ:TSEM) and Salience Labs announced a partnership to manufacture Photonic Integrated Circuit (PIC) based Optical Circuit Switches (OCS) for AI datacenter infrastructure, moving the program from development into a pre-production phase.
The collaboration leverages Tower's silicon photonics platforms PH18DA (with integrated III-V lasers) and TPS45PH (low-loss nitride waveguides) to target lower latency, higher bandwidth and reduced energy per bit for AI clusters. The release cites Dell'Oro Group's projection that data-center switch spending for AI back-end networks could exceed $100 billion by 2030. Both companies will attend OFC 2026 (March 17–19) for meetings and demonstrations.
Xanadu and Tower Semiconductor (TSEM) expanded their collaboration to advance silicon photonics for fault-tolerant photonic quantum computers on Tower’s high-volume platform. They co‑engineered a custom material stack and production flow to validate Xanadu’s photonic circuit designs at manufacturable scale, aiming to support large-scale quantum information processing.
The work builds on prior joint tapeouts and focuses on ultra-low loss silicon nitride (SiN) and integrated photodiodes to optimize critical component performance for commercial-scale systems.