Welcome to our dedicated page for Tower Semiconductor news (Ticker: TSEM), a resource for investors and traders seeking the latest updates and insights on Tower Semiconductor stock.
Tower Semiconductor Ltd. reports developments tied to its role as a pure-play specialty foundry for high-value analog semiconductor solutions. The company provides technology, development and process platforms for IDMs and fabless companies across consumer, industrial, automotive, mobile, infrastructure, medical, aerospace and defense markets.
Recurring updates cover analog and specialty process platforms including SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS and non-imaging sensors, displays, integrated power management, silicon photonics and MEMS. Company announcements also address customer and partner demonstrations, aerospace and defense foundry applications, AI infrastructure and optical networking technologies, quarterly financial results, conference participation, and the multi-fab manufacturing footprint in Israel, the United States, Japan and Italy.
Tower Semiconductor (NASDAQ/TASE: TSEM) announced a strategic restructuring to take full ownership of its 300mm Fab 7 in Japan and transfer full ownership of the 200mm Fab 5 to Nuvoton affiliate NTCJ.
The transaction targets an April 1, 2027 close, includes mutual long‑term supply agreements to avoid customer disruption, and contemplates expanding Uozu 300mm capacity to about 4x current levels pending METI subsidy and customary approvals.
Tower Semiconductor (NASDAQ/TASE: TSEM) and Nuvoton announced a strategic restructuring of TPSCo effective upon closing, expected April 1, 2027, subject to customary conditions and regulatory approvals. Tower will acquire full ownership and control of TPSCo's 12‑inch fab and foundry business. NTCJ will acquire TPSCo's 8‑inch fab and foundry business and pay $25 million to Tower on closing. The parties will provide reciprocal production services and aim to maintain continuity of customer engagements, operations, development programs and employee stability across both facilities.
Tower Semiconductor (NASDAQ/TASE: TSEM) and Coherent (NYSE: COHR) demonstrated 400 Gbps/lane data transmission using a silicon Mach-Zehnder modulator built in a production-ready silicon photonics (SiPho) process on March 23, 2026.
The demo achieved a clear open eye at 420 Gb/s PAM4, used Coherent’s InP CW high-power laser, and targets next-generation 3.2T optical transceivers for pluggable and co-packaged optics in datacenter links.
Tower Semiconductor (NASDAQ/TASE: TSEM) released its Gen3 BCD LDMOS power management platform to address rising AI data center power demands and high-current applications. The platform targets higher efficiency, lower heat, and die-size reduction for power management ICs, and targets Monolithic Smart Power Stage/DrMOS markets.
Tower will present these developments at APEC 2026 March 23–25 in San Antonio (booth #1455); a presentation by Dr. Mete Erturk is scheduled March 24, 3:45–4:15 PM at Expo Theater 3.
Tower Semiconductor (NASDAQ/TASE: TSEM) and Oriole Networks announced a collaboration to deliver nanosecond optical circuit switching for AI scale-up and scale-out networking using Tower's silicon photonics platform. The partnership targets ultra-low, deterministic tail latency and high-bandwidth optical interconnects for AI data centers.
The work aims to integrate lasers, amplification, switching, modulation, and detection on a single SiPho platform and to commercialize Oriole's PRISM networking architecture; company representatives will attend OFC 2026, March 17–19 in Los Angeles.
Tower Semiconductor (NASDAQ/TASE: TSEM) will participate in OFC 2026 March 17–19, 2026 at the Los Angeles Convention Center, booth #2221.
Company representatives will discuss its Silicon Photonics (SiPho) roadmap and showcase SiPho and SiGe BiCMOS solutions for telecom, co‑packaged optics, DWDM lasers, FMCW LiDAR and quantum computing. A partner demo schedule will be posted on the company events webpage.
Tower Semiconductor (NASDAQ:TSEM) and Salience Labs announced a partnership to manufacture Photonic Integrated Circuit (PIC) based Optical Circuit Switches (OCS) for AI datacenter infrastructure, moving the program from development into a pre-production phase.
The collaboration leverages Tower's silicon photonics platforms PH18DA (with integrated III-V lasers) and TPS45PH (low-loss nitride waveguides) to target lower latency, higher bandwidth and reduced energy per bit for AI clusters. The release cites Dell'Oro Group's projection that data-center switch spending for AI back-end networks could exceed $100 billion by 2030. Both companies will attend OFC 2026 (March 17–19) for meetings and demonstrations.
Xanadu and Tower Semiconductor (TSEM) expanded their collaboration to advance silicon photonics for fault-tolerant photonic quantum computers on Tower’s high-volume platform. They co‑engineered a custom material stack and production flow to validate Xanadu’s photonic circuit designs at manufacturable scale, aiming to support large-scale quantum information processing.
The work builds on prior joint tapeouts and focuses on ultra-low loss silicon nitride (SiN) and integrated photodiodes to optimize critical component performance for commercial-scale systems.
Tower Semiconductor (NASDAQ/TASE: TSEM) and Scintil Photonics announced availability of the world’s first heterogeneously integrated DWDM laser sources for AI infrastructure using Scintil’s SHIP™ platform.
Key points: LEAF Light™ is production-ready, validated on Tower’s silicon photonics lines, and positioned for high-volume hyperscale deployment with a multi-site manufacturing footprint and a stated path to "millions of units per month."
Tower Semiconductor (NASDAQ: TSEM) reported record Q4 2025 revenue of $440 million (Q4 vs Q4 +14%, Q/Q +11%) and full-year 2025 revenue of $1.57 billion (+9% YoY). Q4 net profit was $80 million ($0.71 basic EPS). The company plans an additional $270 million CapEx for SiPho, totaling $920 million, targeting >5x December 2026 SiPho wafer starts versus Q4‑2025 monthly run‑rate.