Welcome to our dedicated page for Teradyne news (Ticker: TER), a resource for investors and traders seeking the latest updates and insights on Teradyne stock.
Teradyne, Inc. designs, develops, and manufactures automated test equipment and advanced robotics systems. Its news commonly covers Semiconductor Test, Product Test, and Robotics results; automated test platforms for semiconductors, electronics products, silicon photonics, co-packaged optics, AI accelerators, data-center networking, and ADAS semiconductors; and advanced robotics brands Universal Robots and Mobile Industrial Robots for manufacturing and warehouse automation.
Company updates also include quarterly financial results, cash dividends, product introductions such as Photon 100, industry-event demonstrations, manufacturing partnerships, and intellectual-property actions involving robotics software and automation technology.
Teradyne (NASDAQ:TER) has been named a 2026 Recognized Employer in the VETS Indexes Employer Awards. The recognition follows an objective, data-driven review of policies and outcomes for veterans and the broader military-connected community across five categories, including recruiting, retention, inclusive culture, and support for families and reservists.
Teradyne (NASDAQ:TER) declared a quarterly cash dividend of $0.13 per share, payable on June 12, 2026 to shareholders of record at the close of business on May 21, 2026.
This announcement specifies the dividend amount, record date, and payment date for shareholders.
Teradyne (NASDAQ:TER) reported record Q1 2026 results with revenue $1,282 million, GAAP EPS $2.53 and non-GAAP EPS $2.56. Semiconductor Test contributed $1,111 million, Robotics $91 million, Product Test $80 million. Management tied ~70% of revenue to AI-related demand and guided Q2 revenue of $1,150–$1,250 million with GAAP EPS guidance $1.83–$2.12.
Teradyne Robotics (NYSE:TER) and Flex expanded a long-standing partnership on April 22, 2026 to scale intelligent automation across global manufacturing.
Flex will both deploy Teradyne Robotics' Universal Robots and MiR solutions across its facilities and manufacture key robotics components, enabling faster replication, real-world validation, and global supply-chain support.
Summary not available.
Teradyne (NASDAQ: TER) will report first quarter 2026 results on Tuesday, April 28, 2026 after 4:30 p.m. Eastern Time. A conference call to discuss results and management's business outlook is scheduled for 8:30 a.m. ET, Wednesday, April 29, 2026.
Investors can access a live webcast and presentation materials at the company's investor site; a replay will also be posted.
Teradyne (NASDAQ: TER) will exhibit at SEMICON China 2026, March 25–27 at the Shanghai New International Expo Centre, hall N2 booth 2371. Teradyne will showcase four test platforms—UltraFLEXplus, ETS-800, Titan HP, and Magnum EPIC—and sponsor the SEMICON China Design Innovation Forum.
Teradyne will present a featured session, "DevOpsForTest," on Thursday at 16:40 and marks 25 years of operations in China since 2001.
Teradyne (NASDAQ: TER) launched the Photon 100 on March 17, 2026, a purpose-built opto-electric automated test platform for high-volume silicon photonics (SiPh) and co-packaged optics (CPO) manufacturing.
The Photon 100 integrates optical and electrical instrumentation with Teradyne's UltraFLEXplus platform, supports wafer, optical engine, and CPO test insertions, and aims to simplify operations, increase throughput, and accelerate time-to-market for AI and next-generation data center interconnects.
Universal Robots (TER) launched the UR AI Trainer at GTC 2026 in partnership with Scale AI, offering a first direct lab-to-factory solution for AI model training.
The system captures synchronized multimodal datasets (motion, force, vision) via leader-follower demos, uses Direct Torque Control, and will publish a large industrial dataset later in 2026. Demos include Generalist AI foundation models and NVIDIA Isaac simulation integration.
Teradyne (NASDAQ: TER) launched Omnyx on March 16, 2026, a manufacturing test platform for printed circuit board assemblies and sub-assemblies designed for AI and data center architectures.
Omnyx combines structural, parametric, high-speed interconnect, and functional tests in one platform to reduce defect escapes, improve end-of-line yield, and accelerate time to market. Visit teradyne.com/omnyx or see booth 2100 at IPC APEX EXPO, March 17–19.