STMicroelectronics breaks the 20nm barrier for cost-competitive next-generation microcontrollers
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Insights
The announcement by STMicroelectronics regarding the development of an 18nm FD-SOI process with embedded phase change memory (ePCM) represents a significant technological advancement in the semiconductor industry. The transition from 40nm to 18nm technology is expected to yield a more than 50% improvement in performance-to-power ratio, which is a substantial leap forward. This is particularly relevant as energy efficiency becomes increasingly important in electronic design.
The ability to integrate larger memory sizes and higher levels of digital and analog peripherals will likely cater to the growing market for edge AI processing and IoT devices, where local data processing and decision-making capabilities are critical. The 2.5-times increase in non-volatile memory density and the threefold increase in digital density will enable more complex applications to run on microcontrollers, potentially reducing the need for separate microprocessors in some designs.
The 3dB improvement in noise figure is noteworthy for wireless MCU applications, as it suggests better signal quality and potentially improved communication range or reliability. The capability for 3V operation is unique for sub-20 nm technologies and will likely be well-received in the power management space.
From a business perspective, STMicroelectronics' collaboration with Samsung Foundry could provide a competitive edge in the market, given Samsung's expertise in advanced semiconductor manufacturing. The strategic move to sample the new microcontrollers to selected customers by the second half of 2024, with production slated for 2025, suggests a calculated approach to market penetration and capturing market share in the high-performance, low-power MCU segment.
STMicroelectronics' breakthrough in microcontroller technology could have a notable impact on its financial performance in the medium to long term. Investors should be aware that the R&D and initial production costs associated with this advanced technology could affect short-term profitability. However, the potential revenue growth from the adoption of these next-generation microcontrollers could offset these costs in the long run.
The market for MCUs is expanding, particularly with the rise of edge computing and IoT devices. As STMicroelectronics is positioning itself to meet this demand with a more capable and energy-efficient product, it stands to benefit from increased sales in these sectors. The company's ability to offer a cost-effective alternative to microprocessors could open up new market segments and drive revenue growth.
It's also important to consider the competitive landscape. If STMicroelectronics is able to maintain a technological lead with this new process, it could secure a more dominant position in the market. However, competitors are also investing heavily in similar technologies and the time-to-market will be a critical factor. Investors should monitor the company's progress in development and production ramp-up, as delays could provide opportunities for competitors to catch up.
The advancement in microcontroller technology by STMicroelectronics is expected to have a ripple effect across various sectors that utilize embedded systems. The larger on-chip memories and integration capabilities will be particularly beneficial for applications requiring advanced security features, over-the-air updates and edge AI processing. This aligns with the industry trend towards smarter, more autonomous devices that can process data locally to reduce latency and reliance on cloud services.
The introduction of ARM Cortex-M core-based microcontrollers with these enhancements will likely stimulate the development of new applications in sectors such as automotive, industrial and consumer electronics. The robust high-temperature operation and radiation hardening are indicative of the company's focus on reliability, which is paramount in industrial and automotive applications. This could lead to increased adoption rates in these industries, where safety and durability are critical.
Furthermore, the commitment to energy efficiency and high performance could make STMicroelectronics a preferred supplier for companies looking to improve the environmental footprint of their products. As sustainability becomes a more pressing concern for consumers and regulators, STMicroelectronics' technological advancements could provide a competitive advantage and bolster its market position.
STMicroelectronics breaks the 20nm barrier
for cost-competitive next-generation microcontrollers
- First STM32 microcontroller based on new technology to sample to selected customers in the second half of 2024.
- 18nm FD-SOI with embedded phase change memory (ePCM) to deliver a leap in performance and power consumption.
Geneva, March 19, 2024 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronic applications, announces an advanced process based on 18nm Fully Depleted Silicon On Insulator (FD-SOI) technology with embedded phase change memory (ePCM) to support next-generation embedded processing devices. This new process technology, co-developed by ST and Samsung Foundry, delivers a leap in performance and power consumption for embedded processing applications while allowing larger memory sizes and higher levels of integration of analog and digital peripherals. The first next-generation STM32 microcontroller based on the new technology will start sampling to selected customers in the second half of 2024, with production planned for the second half of 2025.
Remi El-Ouazzane, President of Microcontrollers, Digital ICs and RF products Group at STMicroelectronics, said: “As a leading innovator in the semiconductor industry, ST has pioneered and brought to our customers FD-SOI and PCM technologies for automotive and aerospace applications. We are now taking the next step to bring the benefits of these technologies to developers of industrial applications starting with our next-generation STM32 microcontrollers.”
Technology benefits
Compared to ST 40nm embedded non-volatile memory (eNVM) technology used today, 18nm FD-SOI with ePCM vastly improves key figures of merit:
- More than
50% better performance-to-power ratio - 2.5-times higher non-volatile memory (NVM) density enabling larger on-chip memories
- Three times higher digital density for integration of digital peripherals such as AI and graphics accelerators and state-of-the-art security and safety features
- 3dB improvement in noise figure for enhanced RF performance in wireless MCUs
The technology is capable of 3V operation to supply analog features such as power management, reset systems, clock sources and digital/analog converters. It is the only sub-20 nm technology supporting this capability.
The technology also delivers the reliability required for demanding industrial applications thanks to robust high-temperature operation, radiation hardening, and data retention capabilities already proven in automotive applications.
Additional information on FD-SOI and PCM is available on ST.com.
Benefits to STM32 microcontroller developers and customers
Microcontrollers based on this technology will bring developers a new class of high-performance, low-power, and wireless MCUs. The large memory sizes support the growing needs of edge AI processing, multi-protocol RF stacks, over-the-air updates, and advanced security features. The high performance and large memory size capabilities will give developers using microprocessors today the option to use more highly integrated and cost-effective microcontrollers for their designs. And it will allow further steps in power efficiency for ultralow power devices where ST’s portfolio is industry-leading today.
The first microcontroller based on this technology will integrate the most advanced ARM® Cortex®-M core, providing enhanced performance for machine learning and digital signal processing applications. It will offer fast and flexible external memory interfaces, advanced graphic capabilities and will integrate numerous analog and digital peripherals. It will also have the advanced, certified security features already introduced on ST’s latest MCUs.
About STMicroelectronics
At ST, we are over 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027.
Further information can be found at www.st.com.
For further information, please contact:
INVESTOR RELATIONS:
Céline Berthier
Group VP, Investor Relations
Tel: +41 22 929 58 12
celine.berthier@st.com
MEDIA RELATIONS:
Alexis Breton
Corporate External Communications
Tel: +33 6 59 16 79 08
alexis.breton@st.com
Attachments
- C3244C -- Mar 19 2024 -- 18nm FD-SOI for next-gen STM32 MCUs_FINAL FOR PUBLICATION
- C3244C -- Mar 19 2024 -- 18nm FD-SOI for next-gen STM32 MCUs_IMAGE
FAQ
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