SEMIFIVE Collaborates with OPENEDGES on Chiplet Development

Rhea-AI Summary

SEMIFIVE and OPENEDGES have signed a Memorandum of Understanding to develop a cutting-edge chiplet platform featuring LPDDR6 memory interface for high-performance computing (HPC) applications. By combining SEMIFIVE's expertise in SoC design with OPENEDGES' advanced LPDDR6 memory subsystem, the collaboration aims to deliver cost-effective, high-performance, and flexible semiconductor solutions. This partnership, initiated in 2019, has produced multiple SoC platforms for AI, IoT, and HPC applications. The new platform promises to reduce development costs and time while enhancing performance and efficiency, potentially revolutionizing the semiconductor industry.

Positive

• Strategic partnership between SEMIFIVE and OPENEDGES aims to develop an advanced HPC chiplet platform.
• The chiplet platform will feature LPDDR6 memory interface optimized for the 4nm process node.
• SEMIFIVE's SoC design expertise will synergize with OPENEDGES' LPDDR6 technology to create cost-effective and high-performance solutions.
• The new chiplet platform is expected to set new standards in semiconductor design and manufacturing.
• The collaboration promises to reduce IP support and SoC design engineering costs.
• The partnership has already produced multiple SoC platforms for AI, IoT, and HPC applications since 2019.
• OPENEDGES' silicon-proven LPDDR controller and PHY IPs enhance performance, efficiency, and DRAM utilization.

Negative

• No specific revenue figures or financial impact details are provided in the press release, making it difficult to assess the immediate financial benefits.
• The press release lacks concrete timelines and milestones for the development and commercialization of the chiplet platform.
• Potential risks related to the integration of new technologies and the reliance on advanced 4nm process node are not addressed.

Developing HPC Chiplet Platform to Feature LPDDR6 Memory Interface

SEOUL, South Korea, June 12, 2024 /PRNewswire/ -- SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, announced its agreement of Memorandum of Understanding (MOU) with OPENEDGES Technology (OPENEDGES). This strategic partnership is dedicated to developing an advanced chiplet platform that incorporates OPENEDGES LPDDR6 memory subsystem, which includes DDR memory controller and DDR PHY IPs optimized for the 4nm process node. Leveraging SEMIFIVE's extensive expertise in SoC design and package development, this collaboration aims to create a high-performance computing (HPC) SoC chiplet platform, setting new standards in the semiconductor industry.

SEMIFIVE's chiplet platform offers a new paradigm for semiconductor design and manufacturing, promising a significant impact on the market through cost reduction, performance optimization, and development flexibility. This technology will accelerate innovation in the semiconductor industry, meet the needs of diverse customers, and create opportunities for new business models and collaboration across the ecosystem.

OPENEDGES' silicon-proven LPDDR controller and PHY IPs have played an essential role in enhancing performance, efficiency, and DRAM utilization. These key IPs have been instrumental in achieving successive milestones within SEMIFIVE's innovative SoC design platforms. Moreover, SEMIFIVE's optimized SoC design platform is pre-designed and validated on advanced nodes, thereby reducing IP support and SoC design engineering costs while improving overall development efficiency.

Beginning of their partnerships in 2019, OPENEDGES and SEMIFIVE have jointly collaborated to deliver multiple distinct SoC platforms applied across diverse applications, such as AI inference, IoT SoC, and HPC.

"We at OPENEDGES are immensely proud to join forces with SEMIFIVE in pioneering an advanced chiplet platform," said Sean Lee, CEO of OPENEDGES Technology. "Our IPs are reliable and have consistently demonstrated their capacity to empower our clients, enhancing both efficiency and effectiveness while reducing development risks. We remain steadfast in our commitment to fostering innovation and delivering continued success to our customers."

"Chiplets with essential features will mark a significant turning point in scalable SoC design," said Brandon Cho, CEO and co-founder of SEMIFIVE. "OPENEDGES' LPDDR6 technology will perfectly balance power, bandwidth, and storage for AI HPC memory architecture. SEMIFIVE's SoC platform, which is already showing over twice the efficiency in cost and development time, will synergize with this technology to greatly impact the custom semiconductor market."

About SEMIFIVE

SEMIFIVE is the pioneer of platform based SoC design, working with customers to implement innovative ideas into custom silicon in the most efficient way. Our SoC platforms offer a powerful springboard for new chip designs and leverage configurable domain-specific architectures and pre-validated key IP pools. We offer comprehensive spec-to-system capabilities with end-to-end solutions so that custom SoCs can be realized faster, with reduced cost and risks for key applications such as data center or AI-enabled IoT. With a strong partnership with Samsung Foundry as a leading SAFE^™ DSP partner, as well as the larger ecosystem, SEMIFIVE provides a one-stop shop solution for any SoC design needs. For more information, please visit www.semifive.com.

About OPENEDGES Technology, Inc.

OPENEDGES Technology, Inc. is a premier provider of memory subsystem IPs for the semiconductor industry. They offer a wide range of state-of-the-art solutions, including DDR memory controllers, DDR PHY, NoC interconnect, and NPU IPs that are widely adopted by customers worldwide. Their IPs comply with JEDEC standards, including LPDDR5X/5/4X/4/3, DDR5/4/3, GDDR6, and HBM3, ensuring their compatibility with the latest DDR technology trends. In 2019, they acquired The Six Semiconductor, Inc. (TSS), specializing in high-speed memory PHYs across multiple technologies. As a publicly listed company on the Korean Stock Exchange Market (394280. KQ), OPENEDGES is well-positioned to continue its growth and maintain its leadership in the memory subsystem IPs market.

View original content to download multimedia:https://www.prnewswire.com/news-releases/semifive-collaborates-with-openedges-on-chiplet-development-302168116.html

SOURCE SEMIFIVE

FAQ

What is the significance of SEMIFIVE and OPENEDGES' partnership announced on June 12, 2024?

The partnership aims to develop an advanced chiplet platform featuring LPDDR6 memory interface for high-performance computing, promising to set new standards in semiconductor design.

What technology is central to the new chiplet platform developed by SEMIFIVE and OPENEDGES?

The chiplet platform will feature OPENEDGES' LPDDR6 memory subsystem, including DDR memory controller and DDR PHY IPs optimized for the 4nm process node.

How does SEMIFIVE's experience contribute to the new chiplet platform?

SEMIFIVE's extensive expertise in SoC design and package development will enhance the cost-effectiveness, performance, and flexibility of the new chiplet platform.

What are the expected benefits of the SEMIFIVE and OPENEDGES chiplet platform for the semiconductor industry?

The platform promises cost reduction, performance optimization, and development flexibility, potentially revolutionizing semiconductor design and manufacturing.

Since when have SEMIFIVE and OPENEDGES been collaborating on SoC platforms?

SEMIFIVE and OPENEDGES have been collaborating since 2019 on developing multiple distinct SoC platforms for AI, IoT, and HPC applications.