QuickLogic Announces New Seven-Figure FPGA Hard IP Contract

Rhea-AI Summary

QuickLogic (NASDAQ: QUIK) announced a new discrete FPGA Hard IP contract with a ceiling value of $2.7 million. Revenue recognition is expected from Q2 2026 through Q1 2027.

The FPGA targets GlobalFoundries 12LP, includes Test Chips for a late 2026 Eval Kit, and may be offered as both standalone and chiplet-based Storefront devices.

Positive

• New discrete FPGA contract with ceiling value of $2.7 million
• Revenue recognition projected from Q2 2026 through Q1 2027
• Targets GlobalFoundries 12LP fabrication process with 2026 tape-out
• Eval Kit planned for late 2026 with third-party tool compatibility
• Potential chiplet and Storefront device offerings based on the discrete FPGA

Negative

• None.

News Market Reaction – QUIK

+14.59%

22 alerts

+14.59% Session close to close

+28.9% Peak in 5 hr 39 min

$391.62M Market Cap

0.6x Rel. Volume

In the May 13 session, QUIK gained 14.59%, reflecting a significant positive market reaction. Argus tracked a peak move of +28.9% during that session. Our momentum scanner triggered 22 alerts that day, indicating elevated trading interest and price volatility.

Data tracked by StockTitan Argus on the day of publication.

Market Context

The stock surged +14.6% in the session following this news. A strong positive reaction aligns with Q...

Analysis

The stock surged +14.6% in the session following this news. A strong positive reaction aligns with QuickLogic’s strategy of securing programmatic design wins. The seven‑figure FPGA Hard IP contract with a ceiling of $2.7 million, revenue visibility from Q2 2026 through Q1 2027, and future Eval Kit availability in late 2026 would fit the pattern of past operational news supporting upside. Investors would still need to weigh potential equity issuance capacity under the $125,000,000 shelf when assessing durability.

Key Figures

FPGA contract value: $2.7 million Revenue recognition start: Q2 2026 Revenue recognition end: Q1 2027 +2 more

5 metrics

FPGA contract value $2.7 million Ceiling value of new discrete FPGA Hard IP contract

Revenue recognition start Q2 2026 Revenue from contract begins in Q2 2026

Revenue recognition end Q1 2027 Revenue from contract extends through Q1 2027

Tape-out year 2026 Tape-out on GlobalFoundries 12LP process scheduled for 2026

Eval Kit timing Late 2026 New Evaluation Kit currently scheduled for late 2026

Historical Context

5 past events · Latest: 2026-05-05 (Positive)

Pattern 5 events

Date	Event	Sentiment	24h Move	Catalyst
2026-05-05	Product showcase	Positive	+2.1%	Announced EOS S3 and eFPGA demonstrations at Sensors Converge 2026.
2026-04-29	Credit facility	Positive	+4.4%	Established new $10M revolving credit facility with Sunflower Bank.
2026-04-28	Earnings call date	Neutral	-13.9%	Scheduled Q1 2026 earnings results conference call for May 12, 2026.
2026-04-16	Sales partnership	Positive	+0.5%	Appointed Quantum Leap Solutions as authorized sales representative.
2026-04-09	Dev kit demo	Positive	+7.9%	Announced RadPro FPGA Dev Kit demonstration at HEART Conference.

24h Move is the share-price change in the day after each event; other market factors may also have contributed.

Pattern Detected

Recent operational and partnership announcements have often coincided with positive price moves, while scheduling/housekeeping items have shown more volatile or negative reactions.

Recent Company History

Over the last month, QuickLogic has issued several operational updates and corporate actions. Demonstrations of its RadPro FPGA Dev Kit at the HEART Conference on April 13–17, 2026 and Sensors Converge plans on May 6–7, 2026 saw positive price reactions. A new $10 million revolving credit facility announced on April 29, 2026 also aligned with gains. In contrast, an earnings date announcement on April 28, 2026 coincided with a sharp decline. Today’s seven‑figure FPGA contract extends this pattern of operational milestones in defense and industrial markets.

Key Terms

fpga, embedded fpga (efpga), tape-out, defense industrial base (dib)

4 terms

fpga technical

"new contract for a large discrete FPGA with a ceiling value of $2.7 million"

A field-programmable gate array (FPGA) is a type of computer chip whose internal wiring can be changed after it is made, allowing engineers to program custom hardware functions without designing a new chip. For investors, FPGAs matter because that flexibility lets companies quickly adapt products to new software, standards, or customer needs—like a toolbox that can be rearranged to build different machines—so demand and pricing can shift with trends in data centers, telecommunications, AI, and specialized electronics.

embedded fpga (efpga) technical

"a developer of embedded FPGA (eFPGA) Hard IP, Strategic Radiation Hardened"

An embedded FPGA (eFPGA) is a small, reprogrammable block of digital circuitry built directly into a semiconductor chip that lets designers change hardware behavior after the chip is manufactured—like having a set of Lego pieces inside a device that can be rearranged to add or tweak features. For investors, eFPGAs matter because they can extend a product’s useful life, speed time-to-market for new features, reduce recall or redesign costs, and create recurring licensing or customization revenue, all of which affect a company’s competitiveness and margins.

tape-out technical

"12LP fabrication process with tape-out scheduled for 2026QuickLogic will be"

Tape-out is the milestone when a chip designer delivers the finalized, production-ready blueprint of a semiconductor chip to a foundry for fabrication. Think of it as handing a finished blueprint to a factory: it means design work is complete and manufacturing (with its costs and timelines) can begin. For investors, tape-out signals a clear step toward production, potential revenue, and the transition of technical risk into manufacturing and market risk.

defense industrial base (dib) technical

"used by both Defense Industrial Base (DIB) and Commercial customers."

Defense industrial base (DIB) is the network of companies, suppliers, factories and skilled workers that design, build, test and maintain military equipment, weapons, and related services. Investors care because the DIB channels government defense spending into real products and jobs—changes in contracts, policy, or supply chains can quickly affect many firms’ revenues, valuations and investment risk; think of it as the transportation and factory system that keeps an entire sector running.

AI-generated analysis. How Rhea-AI works. Not financial advice.

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Add on Google Not now

• Contract has ceiling value of $2.7 million with revenue recognition beginning in Q2 2026 and extending through Q1 2027
• Contract will target GlobalFoundries 12LP fabrication process with tape-out scheduled for 2026
• QuickLogic will be provided with Test Chips to characterize and include in new
  Eval Kits

SAN JOSE, Calif., May 13, 2026 /PRNewswire/ -- QuickLogic Corporation (NASDAQ: QUIK), a developer of embedded FPGA (eFPGA) Hard IP, Strategic Radiation Hardened and Antifuse FPGAs, and ruggedized programmable solutions, announced today it has been awarded a new contract for a large discrete FPGA with a ceiling value of $2.7 million. 

In the scope of this new contract, QuickLogic will design and tape-out FPGA Test Chips that will be incorporated in a new Evaluation Kit. The Eval Kit, which is currently scheduled for late 2026, will be compatible with common third-party development environments used by both Defense Industrial Base (DIB) and Commercial customers.  This enables customers to accelerate evaluations while lowering the risks and costs of new designs.

"In parallel with these efforts, we're exploring the potential to leverage the discrete FPGA as a chiplet and offer both solutions as Storefront devices.  With these options, the FPGA can be easily paired with third-party microcontrollers," said Andy Jaros, VP of IP Sales for QuickLogic.  "We are already seeing interest from some partners on this concept."

About QuickLogic 
QuickLogic Corporation is a fabless semiconductor company specializing in eFPGA Hard IP, Strategic Radiation Hardened and Antifuse FPGAs and ruggedized programmable logic solutions. QuickLogic's unique approach combines cutting-edge technology with open-source tools to deliver highly customizable, low-power solutions for aerospace and defense, industrial, computing, and consumer markets. For more information, visit www.quicklogic.com. 

QuickLogic and logo are registered trademarks of QuickLogic. All other trademarks are the property of their respective holders and should be treated as such. 

 

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SOURCE QuickLogic Corporation

FAQ

What did QuickLogic (NASDAQ: QUIK) announce on May 13, 2026 about its new FPGA contract?

QuickLogic announced a new discrete FPGA Hard IP contract with a ceiling value of $2.7 million. According to QuickLogic, the contract includes designing FPGA Test Chips and an Evaluation Kit aimed at accelerating customer design evaluations and reducing risks and costs.

How much is the new QuickLogic (QUIK) FPGA Hard IP contract worth?

The new QuickLogic FPGA Hard IP contract has a ceiling value of $2.7 million. According to QuickLogic, revenue from this agreement is expected to be recognized between Q2 2026 and Q1 2027, providing a defined multi-quarter revenue stream tied to the project milestones.

When will QuickLogic (QUIK) recognize revenue from its new $2.7 million FPGA contract?

QuickLogic expects to recognize revenue from the new FPGA contract from Q2 2026 through Q1 2027. According to QuickLogic, this timing aligns with design, tape-out, and related deliverables for the discrete FPGA and associated Test Chips and Evaluation Kit.

What technology node and foundry does the new QuickLogic (QUIK) FPGA project use?

The new QuickLogic FPGA will target the GlobalFoundries 12LP fabrication process. According to QuickLogic, tape-out of the large discrete FPGA is scheduled for 2026, supporting modern performance and integration needs for Defense Industrial Base and commercial customers.

What is the purpose of the new QuickLogic (QUIK) FPGA Test Chips and Evaluation Kit?

The FPGA Test Chips will be used in a new Evaluation Kit scheduled for late 2026. According to QuickLogic, the Eval Kit will support common third-party development environments, helping DIB and commercial customers speed evaluations and lower design risks and costs.

How might QuickLogic (QUIK) use the new discrete FPGA as a chiplet or Storefront device?

QuickLogic is exploring using the discrete FPGA as a chiplet and offering both versions as Storefront devices. According to QuickLogic, this approach could let customers easily pair the FPGA with third-party microcontrollers, and some partners are already expressing interest.