QuickLogic Corporation reports developments in fabless semiconductor products built around embedded FPGA technology, ruggedized programmable logic and specialized FPGA devices. News commonly covers eFPGA Hard IP, Strategic Radiation Hardened and Antifuse FPGAs, chiplet-related offerings, endpoint AI solutions and low-power platforms such as the EOS S3 SoC for always-on sensing applications.
Company updates also include customer contracts for advanced process technologies, technical demonstrations of RadPro FPGA development tools, sales-channel appointments, conference presentations, quarterly financial results and capital resources such as revolving credit facilities. The recurring business themes center on programmable logic for aerospace and defense, industrial, computing, consumer and embedded edge applications.
QuickLogic (NASDAQ: QUIK) will demonstrate its EOS™ S3 SoC and eFPGA solutions at Sensors Converge 2026 in Santa Clara.
Visit Booth 1039 on May 6–7, 2026 to see always-on, ultra-low-power sensor and voice-enabled systems, including the EOS S3 platform with Arm Cortex-M4F, low-power sound detection, and embedded FPGA.
QuickLogic (NASDAQ: QUIK) entered a new banking relationship with Sunflower Bank, establishing a $10 million revolving credit facility effective April 27, 2026.
The three-year senior secured facility replaces the prior agreement with Heritage Bank of Commerce, matures April 24, 2029, and will fund general corporate purposes, including working capital and strategic program support.
QuickLogic (NASDAQ: QUIK) scheduled a conference call to discuss first quarter fiscal 2026 financial results on Tuesday, May 12, 2026 at 5:30 p.m. ET / 2:30 p.m. PT.
Dial-in, international numbers, replay passcode and a webcast will be available; the webcast will be posted on QuickLogic's investor relations events page and stay online for 12 months.
QuickLogic (NASDAQ: QUIK) appointed Quantum Leap Solutions as an authorized sales representative on April 16, 2026 to expand representation of its eFPGA Hard IP, IP, chiplet offerings, ASIC and design services.
The partnership aims to broaden customer engagement across strategic markets by leveraging Quantum Leap Solutions' chiplet and IP integration expertise to accelerate adoption of QuickLogic's customizable, low-power semiconductor solutions.
QuickLogic (NASDAQ: QUIK) will demonstrate its newly released RadPro FPGA Dev Kit at the 41st HEART Conference, April 13–17, 2026, in Shreveport, Louisiana. The kit includes QuickLogic's first U.S.-fabricated RadPro FPGA on GlobalFoundries 12nm and Aurora FPGA User Tools for RTL-to-bitstream development.
The company says the RadPro FPGA is silicon-proven, targets Defense Industrial Base evaluations, and Dev Kit shipments will be scheduled following the HEART Conference.
QuickLogic (NASDAQ: QUIK) announced a mid-6-figure contract to implement architectural enhancements for its high-density eFPGA Hard IP optimized for Intel 18A technology. The work delivers power, performance and area (PPA) improvements developed under contract in 2025 and is extensible to advanced nodes.
The company said the enhancements reduce power consumption, increase performance and shrink silicon area for high-density eFPGA cores in ASICs, SoCs and large discrete FPGAs, and may broaden addressable markets including cost-sensitive applications.
QuickLogic (NASDAQ: QUIK) will exhibit and present at GOMACTech 2026, March 9–12, 2026, in New Orleans. The company will staff an exhibit and deliver a technical poster titled "Enabling Flexible Heterogeneous Integration with an eFPGA Chiplet on Intel® 18A".
The poster is presented by Trey Peterson, Field Applications Engineer, on March 12, 2026, 10:30 AM–12:00 PM. Exhibit hours are March 10–11 at the New Orleans Ernest N. Morial Convention Center.
QuickLogic (NASDAQ: QUIK) reported fiscal Q4 2025 results and program milestones on March 3, 2026. Q4 revenue was $3.7M, down 34.2% year-over-year but up 84.0% sequentially. The company secured an expanded U.S. SRH FPGA prime contract ceiling near $89M and received a $13M contract tranche.
Q4 GAAP gross margin was 18.1%, GAAP net loss was $6.0M (loss $0.35/share), and non-GAAP net loss was $2.9M (loss $0.17/share). Management highlighted product, government, and design-win progress aimed at 2026 revenue growth.
QuickLogic (NASDAQ: QUIK) announced a $13 million contract award on February 18, 2026 to support continued development and demonstration of its Strategic Radiation Hardened (SRH) high‑reliability FPGA technology.
This award is the latest tranche of a multi‑year program that began in August 2022 and aims to meet Department of War (DoW) strategic and space system requirements, with QuickLogic continuing as Prime Contractor.
QuickLogic (NASDAQ: QUIK) will exhibit and present at Chiplet Summit 2026 in Santa Clara, Feb 17–19. The company will staff Booth #416 to demo eFPGA IP and eFPGA-based chiplets and will deliver a technical session on Feb 19 titled "Enabling Flexible Heterogeneous Integration with an eFPGA Chiplet on Intel® 18A".
The presentation by Trey Peterson, Applications Engineer, is scheduled for Session E-202 on Feb 19 from 3:00 p.m. to 4:20 p.m.