Onto Innovation Further Strengthens Company’s Panel Portfolio with New Glass Suite
Onto Innovation has introduced its new glass substrate suite, featuring the JetStep X500 lithography system with hybrid substrate handling capabilities and the Firefly G3 sub-micron automatic metrology and inspection system. These systems support panel-level packaging for AI, high-performance computing, and cloud computing. The AICS market is projected to grow at a 10% CAGR from 2023 to 2028. This growth is driven by the need for more stable substrates like glass, especially as organic substrate redistribution layers face challenges below 3µm. The JetStep X500 offers sub-1.5µm resolution and can expose areas up to 250mm x 250mm. The Firefly G3 system provides precise inspection and metrology for both organic and glass panels, including via measurement and defect inspection. This suite positions Onto for growth in the advanced packaging market.
- Onto Innovation launched the JetStep X500 and Firefly G3 systems, enhancing panel-level packaging solutions.
- The AICS market is expected to grow at a 10% CAGR from 2023 to 2028, benefiting Onto's product demand.
- The JetStep X500 system provides sub-1.5µm l/s RDL resolution and can handle large panel areas.
- The Firefly G3 system offers advanced inspection and metrology for both organic and glass panels, enhancing process control.
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Insights
Onto Innovation's introduction of the JetStep X500 and Firefly G3 systems is a notable development in the advanced IC substrates (AICS) space. The ability to handle both glass core panels and organic substrates positions these systems as versatile solutions for manufacturers. This hybrid handling capability is vital as the industry transitions towards glass substrates to address challenges with copper clad laminates for sub-3µm redistribution layers (RDLs).
The JetStep X500’s sub-1.5µm l/s RDL resolution and ability to expose large panel areas in one shot make it a competitive tool for next-generation chip packaging. This innovation addresses a critical need in heterogeneous integration (HI) chiplet packages, essential for AI and high-performance computing.
Moreover, the Firefly G3’s advanced 3D metrology and inspection capabilities, such as detecting cracks and chips in glass substrates and performing TGV metrology, highlight its utility in ensuring high-quality manufacturing processes. This places Onto Innovation at a favorable position as the AICS market is projected to grow at a
Overall, these innovations cater directly to evolving industry needs and could drive substantial market adoption, making Onto Innovation a key player in this sector.
Onto Innovation’s launch of these new systems could have significant financial implications. The AICS market's expected growth at a
Investors should note the potential revenue streams from both the JetStep X500 and Firefly G3 systems. These tools cater to high-growth segments such as AI and cloud computing, which are expanding rapidly. The hybrid handling capabilities and advanced inspection features address critical manufacturing pain points, potentially leading to a high adoption rate among manufacturers.
However, it’s important to monitor the company’s ability to scale production and manage operational costs effectively. The introduction of these systems also likely required substantial R&D investments, so profitability margins should be scrutinized.
Regarding short-term impacts, the announcement may positively influence stock prices due to market optimism. Long-term impacts will depend on the product's performance and market adoption rates.
Onto’s JetStep® lithography and Firefly® G3 inspection systems offer a powerful solution as the industry pursues glass core panel transition
The AICS HI roadmap is rapidly approaching several new demarcation points, including the challenges for organic substrate redistribution layers (RDLs) using copper clad laminate (CCL) below 3µm. These challenges are prompting manufacturers to adopt more stable substrates such as glass. The necessity for manufacturers to handle both large glass core panels as well as the existing mature CCL based organic substrates opens new market opportunities for lithography tools capable of handling both substrate types.
“The hybrid substrate handling capabilities of the JetStep X500 system demonstrate Onto Innovation’s commitment to continually improving our portfolio of panel-level products to meet cutting edge technological advances,” says Jason Robinson, vice president and general manager of Onto’s lithography business. “With the capability for sub-1.5µm l/s RDL resolution and the ability to expose panel areas of up to 250mm x 250mm in one shot, the JetStep series delivers an advanced packaging solution that meets the needs of today’s organic substrates and the glass substrates powering the next evolution in highly advanced HI packages.”
In addition to evolving lithographic requirements, the production of glass substrates generates several significant process control challenges attributed to cracks and chips and as a result of handling, through glass via (TGV) formation and the Cu plating process. Customers require 3D metrology solutions focused on TGVs, such as the need to measure via-to-via distance and via diameter for top, waist and bottom.
Using a combination of different illumination techniques, including Onto’s patented Clearfield® technology, the Firefly G3 system has emerged as a successful inspection tool for organic panels. By applying these same techniques to glass panels, Onto expands upon the Firefly G3 system’s previous success by delivering a uniquely designed inspection solution for bare and patterned glass substrates. Capable of identifying cracks and chips, the Firefly G3 system also can perform TGV metrology for vias, including finding the X and Y displacements of TGVs from their nominal positions in a matter of minutes. The system also can inspect for defects like dimples, which are formed during etching. Using the Firefly G3 system and its unique 3D metrology sensors for dielectric thickness measurements, customers are enabled to achieve proper copper plating height uniformity for RDLs.
“The Firefly G3 system is capable of supporting a range of panels and substrate types with sensitivity below 1µm, making it an extremely versatile investment for our customers,” says Mayson Brooks, vice president and general manager of Onto’s inspection business. “That versatility has led to a broad range of customers selecting the Firefly G3 system, along with the JetStep X500, for their next expansions, further positioning Onto Innovation for continued growth in the advanced packaging panel-level packaging market.”
To learn more about Onto’s glass panel suite, visit our booth #633 at SEMICON® West, contact us or reach out to your local sales team.
About Onto Innovation Inc.
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain combined with our connected thinking approach results in a unique perspective to help solve our customers’ most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. With headquarters and manufacturing in the
Forward Looking Statements
This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 (the “Act”) which include statements relating to Onto Innovation’s business momentum and future growth; the benefit to customers and the capabilities of Onto Innovation’s products and customer service; Onto Innovation’s ability to both deliver products and services consistent with our customers’ demands and expectations and strengthen its market position, Onto Innovation’s beliefs about market opportunities as well as other matters that are not purely historical data. Onto Innovation wishes to take advantage of the “safe harbor” provided for by the Act and cautions that actual results may differ materially from those projected as a result of various factors, including risks and uncertainties, many of which are beyond Onto Innovation’s control. Such factors include, but are not limited to, the Company’s ability to leverage its resources to improve its position in its core markets; its ability to weather difficult economic environments; its ability to open new market opportunities and target high-margin markets; the strength/weakness of the back-end and/or front-end semiconductor market segments; fluctuations in customer capital spending; the Company’s ability to effectively manage its supply chain and adequately source components from suppliers to meet customer demand; the effects of political, economic, legal, and regulatory changes or conflicts on the Company's global operations; its ability to adequately protect its intellectual property rights and maintain data security; the effects of natural disasters or public health emergencies, such as the COVID-19 pandemic, on the global economy and on the Company’s customers, suppliers, employees, and business; its ability to effectively maneuver global trade issues and changes in trade and export license policies; the Company’s ability to maintain relationships with its customers and manage appropriate levels of inventory to meet customer demands; and the Company’s ability to successfully integrate acquired businesses and technologies. Additional information and considerations regarding the risks faced by Onto Innovation are available in Onto Innovation’s Form 10-K report for the year ended December 30, 2023 and other filings with the Securities and Exchange Commission. As the forward-looking statements are based on Onto Innovation’s current expectations, the Company cannot guarantee any related future results, levels of activity, performance or achievements. Onto Innovation does not assume any obligation to update the forward-looking information contained in this press release, whether as a result of new information, future events or otherwise, except as required by law.
Source: Onto Innovation Inc.
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Investor Relations:
Sidney Ho, +1 408.376.9163
Sidney.ho@ontoinnovation.com
Source: Onto Innovation Inc.
FAQ
What new products did Onto Innovation announce on October 2023?
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