Onto Innovation Advances Process Control Suite for 3D Interconnect Yields
Onto Innovation (NYSE: ONTO) announced advances in its 3D interconnect process control suite, featuring two key developments: the new 3Di™ technology on the Dragonfly® G3 system for bump process control in high bandwidth memory and advanced logic applications, and the EchoScan™ system for detecting micro-voids in wafer bonding applications.
Initial orders for the 3Di technology include a top HBM manufacturer, a tier one OSAT, and a leading bump process equipment manufacturer. The first EchoScan system will ship in Q1, with additional deliveries planned throughout 2025. The solutions address the growing market for advanced packages with 2.5D and 3D integration, projected to grow at 19% from 2024-2028.
The technologies specifically target decreasing interconnect bump heights in high volume manufacturing (from 12µm to potentially 4µm) and enable void detection as small as 1µm in wafer bonding applications, significantly improving upon current technologies to ≥10µm sensitivity.
Onto Innovation (NYSE: ONTO) ha annunciato dei progressi nella sua suite di controllo del processo di interconnessione 3D, presentando due sviluppi chiave: la nuova tecnologia 3Di™ sul sistema Dragonfly® G3 per il controllo del processo di bump in applicazioni di memoria ad alta larghezza di banda e logica avanzata, e il sistema EchoScan™ per la rilevazione di micro-voidi nelle applicazioni di bonding dei wafer.
Gli ordini iniziali per la tecnologia 3Di includono un importante produttore di HBM, un OSAT di primo livello e un produttore leader di attrezzature per il processo di bump. Il primo sistema EchoScan sarà spedito nel primo trimestre, con ulteriori consegne previste durante il 2025. Le soluzioni affrontano il crescente mercato per pacchetti avanzati con integrazione 2.5D e 3D, che si prevede crescerà del 19% dal 2024 al 2028.
Le tecnologie mirano specificamente a ridurre le altezze dei bump di interconnessione nella produzione ad alto volume (da 12µm a potenzialmente 4µm) e consentono la rilevazione di void di dimensioni pari a 1µm nelle applicazioni di bonding dei wafer, migliorando significativamente le tecnologie attuali a una sensibilità di ≥10µm.
Onto Innovation (NYSE: ONTO) anunció avances en su suite de control de procesos de interconexión 3D, presentando dos desarrollos clave: la nueva tecnología 3Di™ en el sistema Dragonfly® G3 para el control del proceso de bump en aplicaciones de memoria de alta velocidad y lógica avanzada, y el sistema EchoScan™ para detectar micro-voids en aplicaciones de unión de obleas.
Los pedidos iniciales de la tecnología 3Di incluyen un importante fabricante de HBM, un OSAT de nivel uno y un fabricante líder de equipos para el proceso de bump. El primer sistema EchoScan se enviará en el primer trimestre, con entregas adicionales previstas a lo largo de 2025. Las soluciones abordan el creciente mercado de empaques avanzados con integración 2.5D y 3D, que se proyecta crecer un 19% entre 2024 y 2028.
Las tecnologías están específicamente dirigidas a disminuir las alturas de bump de interconexión en la fabricación de alto volumen (de 12µm a potencialmente 4µm) y permitir la detección de voids tan pequeños como 1µm en aplicaciones de unión de obleas, mejorando significativamente las tecnologías actuales a una sensibilidad de ≥10µm.
Onto Innovation (NYSE: ONTO)는 3D 인터커넥트 프로세스 제어 제품군의 발전을 발표하며 두 가지 주요 개발을 소개했습니다: 고대역폭 메모리 및 고급 논리 응용 프로그램에서 범프 프로세스 제어를 위한 3Di™ 기술과 웨이퍼 본딩 응용 프로그램에서 마이크로 보이드 감지를 위한 EchoScan™ 시스템입니다.
3Di 기술에 대한 초기 주문은 주요 HBM 제조업체, 1티어 OSAT 및 선도적인 범프 프로세스 장비 제조업체를 포함합니다. 첫 번째 EchoScan 시스템은 1분기에 배송될 예정이며, 2025년 전반에 걸쳐 추가 배송이 계획되어 있습니다. 이 솔루션은 2024년부터 2028년까지 19% 성장할 것으로 예상되는 2.5D 및 3D 통합의 고급 패키지 시장을 겨냥하고 있습니다.
이 기술은 고발생량 제조에서 인터커넥트 범프 높이를 줄이는 것을 목표로 하며 (12µm에서 잠재적으로 4µm로) 웨이퍼 본딩 응용 프로그램에서 1µm 크기의 보이드 감지를 가능하게 하여 현재 기술보다 크게 개선된 ≥10µm 감도를 제공합니다.
Onto Innovation (NYSE: ONTO) a annoncé des avancées dans sa suite de contrôle des processus d'interconnexion 3D, présentant deux développements clés : la nouvelle technologie 3Di™ sur le système Dragonfly® G3 pour le contrôle du processus de bump dans les applications de mémoire à large bande passante et de logique avancée, et le système EchoScan™ pour la détection de micro-voids dans les applications de jonction de wafers.
Les premières commandes pour la technologie 3Di incluent un fabricant majeur de HBM, un OSAT de premier niveau et un fabricant de premier plan d'équipements de processus de bump. Le premier système EchoScan sera expédié au premier trimestre, avec des livraisons supplémentaires prévues tout au long de 2025. Les solutions répondent à la demande croissante du marché pour des emballages avancés avec intégration 2.5D et 3D, qui devrait croître de 19 % entre 2024 et 2028.
Les technologies ciblent spécifiquement la réduction des hauteurs de bump d'interconnexion dans la fabrication en gros volumes (de 12µm à potentiellement 4µm) et permettent la détection de voids aussi petits que 1µm dans les applications de jonction de wafers, améliorant considérablement les technologies actuelles à une sensibilité de ≥10µm.
Onto Innovation (NYSE: ONTO) hat Fortschritte in seiner 3D-Interkonnektivitätsprozesskontrollsuite angekündigt und dabei zwei wichtige Entwicklungen vorgestellt: die neue 3Di™-Technologie im Dragonfly® G3-System zur Steuerung des Bump-Prozesses in Hochgeschwindigkeits-Speicher- und fortgeschrittenen Logikanwendungen sowie das EchoScan™-System zur Erkennung von Mikro-Voids in Waferverschmelzungsanwendungen.
Die ersten Bestellungen für die 3Di-Technologie umfassen einen führenden HBM-Hersteller, einen Tier-1-OSAT und einen führenden Hersteller von Bump-Prozessgeräten. Das erste EchoScan-System wird im ersten Quartal versendet, mit weiteren Lieferungen, die im Laufe von 2025 geplant sind. Die Lösungen richten sich an den wachsenden Markt für fortschrittliche Pakete mit 2.5D- und 3D-Integration, dessen Wachstum von 2024 bis 2028 auf 19% geschätzt wird.
Die Technologien zielen speziell darauf ab, die Interkonnektivitätsbump-Höhen in der Hochvolumenproduktion zu reduzieren (von 12µm auf potenziell 4µm) und ermöglichen die Erkennung von Voids so klein wie 1µm in Waferverschmelzungsanwendungen, was eine signifikante Verbesserung gegenüber den aktuellen Technologien mit einer Empfindlichkeit von ≥10µm darstellt.
- Secured multiple initial orders for 3Di technology from major industry players
- Addresses growing market projected at 19% growth (2024-2028)
- EchoScan system achieves 1µm void detection vs. current 10µm industry standard
- Technology enables real-time defect analysis and process control feedback
- None.
Insights
The introduction of 3Di™ technology and EchoScan™ system represents a significant technological leap in semiconductor packaging metrology. The ability to inspect bumps as small as 2µm in R&D and detect voids down to 1µm without water immersion addresses critical challenges in advanced packaging for AI chips. The projected 19% growth in advanced packages through 2028 positions Onto Innovation favorably in the high-stakes AI semiconductor market.
The technical specifications are particularly impressive - the reduction in bump heights from 12µm to 8µm and potentially 4µm requires unprecedented precision in measurement and inspection. The non-contact, immersion-free technology of EchoScan eliminates risks of contamination while maintaining high throughput, a important advantage over existing solutions to ≥10µm sensitivity.
Initial orders from a top HBM manufacturer, tier one OSAT and leading bump process equipment manufacturer validate strong market demand and potential revenue growth. The timing aligns perfectly with the AI boom and increasing demand for advanced packaging solutions in high-performance computing. The 19% CAGR forecast by TechInsights through 2028 suggests substantial market opportunity.
Integration with Discover® analytical software for real-time process control adds significant value proposition, potentially leading to increased adoption among manufacturers seeking to optimize yield management. This positions Onto Innovation as a critical enabler in the AI chip manufacturing supply chain, particularly as the industry moves toward more complex packaging solutions for high-bandwidth memory and advanced logic applications.
Announces orders for 3Di™ technology on Dragonfly® G3 system and release of EchoScan™ void detection system
Advanced packages with 2.5D and 3D integration schemes are projected to grow at a rate of
“High-performance HBM and GPU devices powering AI packages demand smaller line/space and bump pitch requirements,” says Mike Rosa, Onto’s chief marketing officer and senior vice president of strategy. “Onto designed the 3Di technology to meet customers’ needs for more stable technologies accommodating smaller bump sizes—even below 5µm in HVM and 2µm in R&D—in next generation logic and memory devices.”
Interconnect density intensifies with the adoption of hybrid bonding for bond pad interconnects, with planar bump heights and the challenge of inline micro void detection at the Cu-Cu bond pad interface. Undetected voids can lead to wafer cracking and open electrical connections, resulting in yield loss. Current technologies are limited to ≥10µm void size sensitivity and require water immersion, which adds the risk of bonded wafer contamination, delamination and lack of void traceability for inline process control.
“Onto’s EchoScan system offers die and wafer level, immersion free, non-contact technology for voids down to 1µm in HVM. This solution is being released to select customers to detect 1µm voids in atmosphere at the same speed as incumbent technologies limited to ~10µm,” Rosa continued. “Whether using micro bump or hybrid bonding technologies, Onto Innovation provides the critical process control solution. When paired with our Discover® analytical software, both solutions enable real-time defect analysis and feedback to process tools for statistical process control, reducing the cycle time of yield loss assessment and helping customers achieve high volume manufacturing goals.”
To learn more about the 3Di technology on the Dragonfly G3 system and the EchoScan void detection system, contact us or reach out to your local sales team.
About Onto Innovation Inc.
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that includes un-patterned wafer quality, 3D metrology spanning chip features from nanometer scale transistors to large die interconnects, macro defect inspection of wafers and packages, metal interconnect composition, factory analytics, and lithography for advanced semiconductor packaging.
Our breadth of offerings across the entire semiconductor value chain combined with our connected thinking approach results in a unique perspective to help solve our customers’ most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. With headquarters and manufacturing in the
Additional information can be found at www.ontoinnovation.com.
Forward Looking Statements
This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 (the “Act”) which include statements relating to Onto Innovation’s business momentum and future growth; the benefit to customers and the capabilities of Onto Innovation’s products and customer service; Onto Innovation’s ability to both deliver products and services consistent with our customers’ demands and expectations and strengthen its market position, Onto Innovation’s beliefs about market opportunities as well as other matters that are not purely historical data. Onto Innovation wishes to take advantage of the “safe harbor” provided for by the Act and cautions that actual results may differ materially from those projected as a result of various factors, including risks and uncertainties, many of which are beyond Onto Innovation’s control. Such factors include, but are not limited to, the Company’s ability to leverage its resources to improve its position in its core markets; its ability to weather difficult economic environments; its ability to open new market opportunities and target high-margin markets; the strength/weakness of the back-end and/or front-end semiconductor market segments; fluctuations in customer capital spending and any potential impact as a result of the novel coronavirus situation; the Company’s ability to effectively manage its supply chain and adequately source components from suppliers to meet customer demand; its ability to adequately protect its intellectual property rights and maintain data security; its ability to effectively maneuver global trade issues and changes in trade and export license policies; the Company’s ability to maintain relationships with its customers and manage appropriate levels of inventory to meet customer demands; and the Company’s ability to successfully integrate acquired businesses and technologies. Additional information and considerations regarding the risks faced by Onto Innovation are available in Onto Innovation’s Form 10-K report for the year ended December 30, 2023, and other filings with the Securities and Exchange Commission. As the forward-looking statements are based on Onto Innovation’s current expectations, the Company cannot guarantee any related future results, levels of activity, performance or achievements. Onto Innovation does not assume any obligation to update the forward-looking information contained in this press release, except as required by law.
Source: Onto Innovation Inc.
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Investor Relations:
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Source: Onto Innovation Inc.
FAQ
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