Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Synopsys and Intel Foundry have announced a major collaboration on angstrom-scale chip designs for Intel 18A and 18A-P technologies. The partnership features production-ready EDA flows and the industry's broadest IP portfolio, optimized for Intel's advanced process nodes.
Key developments include:
- Production-ready digital and analog EDA flows for Intel 18A and 18A-P technologies
- Early design technology co-optimization for Intel 14A-E
- Enhanced multi-die design capabilities through Intel's EMIB-T packaging technology
- Broad IP portfolio supporting 224G Ethernet, PCIe 7.0, UCIe, USB4, and other technologies
Synopsys has joined the Intel Foundry Accelerator Design Services Alliance and the new Intel Foundry Accelerator Chiplet Alliance, strengthening their ecosystem partnership. The collaboration aims to accelerate the development of high-performance AI and HPC chip designs, leveraging Intel's PowerVia backside power delivery and RibbonFET Gate-all-around transistor architecture.
Synopsys e Intel Foundry hanno annunciato una collaborazione significativa per la progettazione di chip a scala angstrom per le tecnologie Intel 18A e 18A-P. La partnership comprende flussi EDA pronti per la produzione e il più ampio portafoglio IP del settore, ottimizzati per i nodi di processo avanzati di Intel.
Sviluppi chiave includono:
- Flussi EDA digitali e analogici pronti per la produzione per le tecnologie Intel 18A e 18A-P
- Co-ottimizzazione tecnologica precoce per la progettazione Intel 14A-E
- Capacità avanzate di progettazione multi-die grazie alla tecnologia di packaging EMIB-T di Intel
- Ampio portafoglio IP che supporta Ethernet 224G, PCIe 7.0, UCIe, USB4 e altre tecnologie
Synopsys si è unita all'Intel Foundry Accelerator Design Services Alliance e alla nuova Intel Foundry Accelerator Chiplet Alliance, rafforzando la partnership nell'ecosistema. La collaborazione mira ad accelerare lo sviluppo di progetti di chip ad alte prestazioni per AI e HPC, sfruttando la tecnologia PowerVia di Intel per la distribuzione dell'alimentazione sul retro e l'architettura RibbonFET Gate-all-around dei transistor.
Synopsys e Intel Foundry han anunciado una colaboración importante en diseños de chips a escala angstrom para las tecnologías Intel 18A y 18A-P. La alianza incluye flujos EDA listos para producción y la cartera de IP más amplia de la industria, optimizada para los nodos de proceso avanzados de Intel.
Desarrollos clave incluyen:
- Flujos EDA digitales y analógicos listos para producción para las tecnologías Intel 18A y 18A-P
- Co-optimización temprana de tecnología de diseño para Intel 14A-E
- Capacidades mejoradas de diseño multi-die mediante la tecnología de empaquetado EMIB-T de Intel
- Amplia cartera de IP que soporta Ethernet 224G, PCIe 7.0, UCIe, USB4 y otras tecnologías
Synopsys se ha unido a la Intel Foundry Accelerator Design Services Alliance y a la nueva Intel Foundry Accelerator Chiplet Alliance, fortaleciendo su asociación en el ecosistema. La colaboración busca acelerar el desarrollo de diseños de chips de alto rendimiento para IA y HPC, aprovechando la entrega de energía PowerVia de Intel en la parte trasera y la arquitectura de transistores RibbonFET Gate-all-around.
Synopsys와 Intel Foundry는 Intel 18A 및 18A-P 기술을 위한 앙스트롬 규모의 칩 설계에 관한 주요 협력을 발표했습니다. 이번 파트너십은 인텔의 첨단 공정 노드에 최적화된 생산 준비된 EDA 플로우와 업계에서 가장 광범위한 IP 포트폴리오를 특징으로 합니다.
주요 개발 사항은 다음과 같습니다:
- Intel 18A 및 18A-P 기술을 위한 생산 준비된 디지털 및 아날로그 EDA 플로우
- Intel 14A-E를 위한 초기 설계 기술 공동 최적화
- Intel의 EMIB-T 패키징 기술을 통한 향상된 멀티 다이 설계 기능
- 224G 이더넷, PCIe 7.0, UCIe, USB4 및 기타 기술을 지원하는 광범위한 IP 포트폴리오
Synopsys는 Intel Foundry Accelerator Design Services Alliance와 새로운 Intel Foundry Accelerator Chiplet Alliance에 합류하여 생태계 파트너십을 강화했습니다. 이번 협력은 Intel의 PowerVia 백사이드 전원 공급 및 RibbonFET 게이트-올-어라운드 트랜지스터 아키텍처를 활용하여 고성능 AI 및 HPC 칩 설계 개발을 가속화하는 것을 목표로 합니다.
Synopsys et Intel Foundry ont annoncé une collaboration majeure sur des conceptions de puces à l'échelle angström pour les technologies Intel 18A et 18A-P. Ce partenariat comprend des flux EDA prêts pour la production ainsi que le portefeuille IP le plus large de l'industrie, optimisé pour les nœuds de procédé avancés d'Intel.
Les développements clés comprennent :
- Flux EDA numériques et analogiques prêts pour la production pour les technologies Intel 18A et 18A-P
- Co-optimisation précoce des technologies de conception pour Intel 14A-E
- Capacités améliorées de conception multi-die grâce à la technologie d'emballage EMIB-T d'Intel
- Large portefeuille IP prenant en charge Ethernet 224G, PCIe 7.0, UCIe, USB4 et d'autres technologies
Synopsys a rejoint l'Intel Foundry Accelerator Design Services Alliance ainsi que la nouvelle Intel Foundry Accelerator Chiplet Alliance, renforçant ainsi leur partenariat au sein de l'écosystème. Cette collaboration vise à accélérer le développement de conceptions de puces haute performance pour l'IA et le HPC, en tirant parti de la distribution d'alimentation PowerVia d'Intel par l'arrière et de l'architecture de transistor RibbonFET Gate-all-around.
Synopsys und Intel Foundry haben eine bedeutende Zusammenarbeit bei Angstrom-Skala-Chipdesigns für Intel 18A- und 18A-P-Technologien angekündigt. Die Partnerschaft umfasst produktionstaugliche EDA-Flows und das branchenweit umfangreichste IP-Portfolio, optimiert für Intels fortschrittliche Prozessknoten.
Wesentliche Entwicklungen umfassen:
- Produktionstaugliche digitale und analoge EDA-Flows für Intel 18A- und 18A-P-Technologien
- Frühe Design-Technologie-Kooptimierung für Intel 14A-E
- Erweiterte Multi-Die-Design-Fähigkeiten durch Intels EMIB-T Packaging-Technologie
- Umfangreiches IP-Portfolio zur Unterstützung von 224G Ethernet, PCIe 7.0, UCIe, USB4 und weiteren Technologien
Synopsys ist der Intel Foundry Accelerator Design Services Alliance und der neuen Intel Foundry Accelerator Chiplet Alliance beigetreten und stärkt damit die Partnerschaft im Ökosystem. Die Zusammenarbeit zielt darauf ab, die Entwicklung von Hochleistungs-Chipdesigns für KI und HPC zu beschleunigen, indem Intels PowerVia Backside-Stromversorgung und die RibbonFET Gate-all-around-Transistorarchitektur genutzt werden.
- Production-ready EDA flows for Intel's latest 18A and 18A-P nodes, enabling faster market entry for customers
- Broadest IP portfolio development for Intel 18A, including critical components like 224G Ethernet and PCIe 7.0
- Strategic membership in Intel Foundry Accelerator Design Services Alliance and Chiplet Alliance, strengthening market position
- Early access to Intel's 14A-E node development, maintaining competitive advantage
- Expansion into multi-die design solutions with Intel's EMIB-T technology, opening new revenue streams
- None.
Insights
Synopsys strengthens position by providing critical EDA and IP for Intel's advanced nodes, expanding market reach in high-growth chip segments.
The collaboration between Synopsys and Intel Foundry represents a strategic advancement in semiconductor design enablement for angstrom-scale technologies. Synopsys has achieved production-ready status for its EDA tools on Intel's most advanced nodes—18A and 18A-P—which feature breakthrough RibbonFET Gate-all-around transistors and PowerVia backside power delivery. These technologies are crucial for next-generation AI and high-performance computing applications.
The comprehensive nature of this partnership is particularly significant. Synopsys is providing certified AI-driven digital and analog design flows, enabling efficient exploration-to-signoff for multi-die designs with their 3DIC Compiler for Intel's EMIB-T packaging technology. This positions Synopsys at the forefront of the rapidly growing chiplet-based design movement, which allows more complex systems to be built from smaller, specialized dies.
Synopsys' development of "the industry's broadest IP portfolio" for these advanced nodes—including 224G Ethernet, PCIe 7.0, UCIe, USB4, and various foundation IP—removes critical barriers for Intel Foundry customers. The early engagement in design technology co-optimization for Intel's future 14A-E node indicates this is a long-term strategic alignment rather than a one-time collaboration.
By joining Intel's Foundry Accelerator Design Services Alliance and the new Chiplet Alliance, Synopsys secures its position as a key enabler in Intel's foundry ecosystem, supporting the development of increasingly complex heterogeneous chip designs.
Synopsys expands market opportunities through deep Intel Foundry integration, strengthening long-term revenue potential across multiple product lines.
This strategic collaboration with Intel Foundry reinforces Synopsys' market position in the semiconductor design ecosystem. By ensuring their EDA tools and IP portfolio are optimized for Intel's manufacturing processes, Synopsys is expanding its addressable market as Intel pushes to become a major foundry player competing with TSMC and Samsung.
The comprehensive nature of this collaboration creates multiple potential revenue streams for Synopsys:
- EDA tool adoption by customers designing for Intel 18A
- IP licensing opportunities across Intel's foundry customer base
- Design services through the Intel Foundry Accelerator Alliance
- Multi-die design solutions with 3DIC Compiler
Particularly noteworthy is Synopsys' early involvement in Intel's process technology roadmap, with engagement already underway for Intel's 14A-E node. This forward-looking approach helps secure Synopsys' relevance through future process generations, providing longer-term visibility for their business in this segment.
The partnership around advanced packaging with EMIB-T technology positions Synopsys to capitalize on the industry shift toward chiplet-based designs, which represents a growing market segment as traditional monolithic scaling becomes more challenging and expensive.
While the press release doesn't provide specific financial projections, the breadth of collaboration across EDA flows, IP, multi-die solutions, and design services demonstrates how Synopsys is positioned to benefit from Intel's foundry strategy regardless of Intel's ultimate market share outcomes in the foundry business.
Synopsys Production-Ready EDA Flows and Broadest IP Portfolio Deliver Leading PPA for Intel Foundry's Advanced Processes and Packaging Technologies
Highlights
- Production-ready Synopsys digital and analog EDA flows for Intel 18A and Intel 18A-P technologies pave the way for broad adoption and accelerate development of high-performance designs; engaged in early design technology co-optimization for Intel 14A-E
- Optimized EDA reference flow with a unified exploration-to-signoff platform accelerates 2.5D/3D multi-die designs for Intel's EMIB-T advanced packaging technology
- Broadest portfolio of high-performance and low-power IP for Intel 18A and expanded Synopsys IP support for Intel 18A-P offers customers faster time-to-tapeout
- Announcing membership in Intel Foundry Accelerator Design Services Alliance and the new Intel Foundry Accelerator Chiplet Alliance to advance Intel Foundry adoption and innovation
To drive multi-die design innovation forward, Synopsys and Intel Foundry are collaborating to enable Intel's new Embedded Multi-die Interconnect Bridge-T (EMIB-T) advanced packaging technology with an EDA reference flow powered by Synopsys 3DIC Compiler.
With its EDA flows, multi-die solution, and broad portfolio of Synopsys' foundation and interface IP on Intel 18A and Intel 18A-P, Synopsys is helping designers accelerate the development of highly optimized AI and HPC chip designs from silicon to systems.
In a keynote presentation at today's event, John Koeter, Senior Vice President, for the Synopsys IP Group, emphasized: "The successful collaboration between Synopsys and Intel Foundry is advancing the semiconductor industry with silicon to system design solutions to meet the evolving needs for AI and high-performance computing applications. Our production-ready EDA flows, IP, and multi-die solution, provides our mutual customers with comprehensive technologies to accelerate the development of chip designs that meet or exceed their requirements."
"Our continued collaboration with Synopsys enables engineering teams to accelerate 'systems of chips' innovation utilizing our unique systems foundry capabilities and optimized Synopsys EDA flows and IP on Intel 18A and Intel 18A-P process nodes to create differentiated designs with faster time-to-results," said Suk Lee, VP & GM of Ecosystem Technology Office, Intel Foundry. "Together, Intel Foundry and Synopsys are furthering design, manufacturing, and packaging co-optimization so our customers can meet the demands of the AI era."
Advancing Design Innovation with Comprehensive EDA and Multi-Die Solutions
Synopsys' digital and analog design flows are certified for Intel 18A process node and production-ready for Intel 18A-P enabling faster delivery of advanced-node SoCs with higher quality-of-results. Synopsys IP and EDA flows are also optimized for power and area on the Intel 18A and Intel 18A-P process nodes to take advantage of Intel's PowerVia backside power delivery network enabling thermal-aware implementation for PowerVia based designs. RibbonFET-driven synthesis and optimization enable designers to achieve differentiated power, performance, and area (PPA) on Intel 18A and Intel 18A-P process nodes. This is a result of an extensive design technology co-optimization (DTCO) effort between Intel Foundry and Synopsys engineering teams.
Synopsys and Intel Foundry are now engaging in early design technology co-optimization for Intel 14A-E to establish the readiness of Synopsys EDA flows for the next generation advanced node.
Synopsys and Intel have extended their collaboration to help mutual customers realize the PPA advantages of multi-die designs by enabling Intel's EMIB-T advanced packaging technology with Synopsys' 3DIC Compiler. EMIB-T combines the benefits of EMIB 2.5D and Foveros 3D packaging technologies for high interconnect densities at die sizes beyond the reticle limit. The EMIB-T reference flow is powered by Synopsys' unified exploration-to-signoff platform, allowing efficient EMIB-T designs with early bump and TSV planning and optimization, and automated UCIe and HBM routing for high quality-of-results and fast 3D heterogeneous integration. Synopsys 3DIC Compiler allows feasibility and partitioning, prototyping and floorplanning, and multiphysics signoff in a single environment, allowing efficient design creation, implementation, optimization, and closure.
Synopsys Expands IP Portfolio for Advanced Angstrom-Level Designs
The introduction of angstrom-level processes will be crucial for next-generation AI and HPC chips, delivering optimized performance, power, area, and latency. To accelerate time-to-market for these designs, Synopsys is developing the industry's broadest IP portfolio for Interface, Foundation, and SLM (Silicon Lifecycle Management) IP on Intel 18A process node, including 224G Ethernet, PCIe 7.0, UCIe, USB4, embedded memories, logic libraries, IOs, and PVT sensors. Utilizing Intel's PowerVia backside power delivery technology, Synopsys IP will enhance power distribution and performance, enabling advanced and differentiated chip designs with Intel Foundry technologies.
Further Strengthening Intel Foundry Ecosystem to Accelerate Adoption and Innovation
Synopsys is further expanding its collaboration with Intel Foundry and the ecosystem by joining the Intel Foundry Accelerator Design Services Alliance and the new Intel Foundry Accelerator Chiplet Alliance. As a member of the latest Intel Foundry Alliance, Synopsys commits to offering its design services, in addition to optimized EDA tools and IP, to help customers accelerate their advanced chip designs. As a founding member of the new Intel Foundry Chiplet Alliance, Synopsys will further enable interoperability, manufacturability and design solutions supporting multi-die chips on Intel 18A.
Additional Resources
Synopsys is exhibiting and speaking at Intel Foundry Direct Connect today at the San Jose McEnery Convention Center, Booth #35. For more information, visit the Synopsys Intel Foundry Direct Connect event page.
About Synopsys
Catalyzing the era of pervasive intelligence, Synopsys, Inc. (Nasdaq: SNPS) delivers trusted and comprehensive silicon to systems design solutions, from electronic design automation to silicon IP and system verification and validation. We partner closely with semiconductor and systems customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow. Learn more at www.synopsys.com.
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Editorial Contact
Kelli Wheeler
Synopsys, Inc.
corp-pr@synopsys.com
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