Onto Innovation Debuts Firefly® G3 Panel-level Packaging Inspection System
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Insights
The introduction of Onto Innovation Inc.'s Firefly G3 system into the advanced IC panel market is a significant development for the semiconductor industry. The system's capabilities in inspection and metrology process control are designed to enhance the production of panel-level substrates, which are crucial for the manufacture of advanced AI chiplets. The demand for such high-performance computing servers and the evolution of GPU technologies are driving the market growth, with a projected >25% CAGR through 2028, indicating a robust expansion in this sector.
For stakeholders, the ability of the Firefly G3 system to replace multiple tools and operators with its integrated technologies like Clearfind® and TrueADC® software could lead to substantial cost savings through improved yields and increased throughput. This is particularly relevant for manufacturers looking to streamline operations and reduce reliance on manual inspection processes, which are prone to human error.
The flexibility of the Firefly G3 system to cater to a wide range of applications, including the detection of under-film bubbles and particles, positions it as a versatile solution in the market. This versatility could lead to broader adoption across different manufacturing contexts, potentially increasing Onto Innovation Inc.'s market share.
The shipment of the Firefly G3 system to a tier-one customer and the expectation of additional customers taking delivery in the first half of 2024 suggests a positive revenue trajectory for Onto Innovation Inc. in the near term. The integration of advanced 3D metrology sensors, which allow for the measurement of film thicknesses and metal RDL line heights, represents a technological advancement that could create a competitive edge for Onto and drive future sales.
Investors should note that the adoption of such advanced systems could lead to an initial increase in capital expenditures for Onto's customers. However, the potential for improved production efficiency and yield could result in a strong return on investment, making it an attractive proposition for companies in the semiconductor space.
It is also important to monitor the semiconductor industry's cyclical nature and the impact of global economic conditions on capital equipment spending. While the current outlook is positive, shifts in the market could affect the adoption rates of new technologies like the Firefly G3 system.
The semiconductor industry is witnessing a transition towards more advanced packaging techniques and the Firefly G3 system's ability to optimize layer-over-layer overlay accuracy is crucial for enhancing panel performance and yield. The system's proprietary feed-forward and feedback software is a distinctive feature that enables real-time process optimization, which is a significant step forward in substrate manufacturing.
With the semiconductor industry's rapid growth, especially in AI and GPU technologies, the need for reliable and efficient inspection and metrology systems is becoming increasingly important. The Firefly G3 system's introduction of 3D metrology sensors is a response to this need, offering more precise and detailed data collection capabilities.
As the technology matures, customers will likely see a reduction in defect rates and an acceleration in the maturation of their processes, which is vital for staying competitive in a fast-paced industry. The long-term implications for companies investing in such technologies include not only improved production metrics but also the potential to lead in quality and innovation.
Advanced IC panel market supporting high performance packaging expected to grow >
The Firefly G3 system delivers unique inspection and metrology process control technologies aimed at buried defects and voids supporting next generations of glass and copper clad laminate (CCL)
The Firefly G3 system delivers unique inspection and metrology process control during high volume production of panel-level substrates including next generations of glass and copper clad laminate (CCL) (Photo: Business Wire)
*According to TechInsights, demand for high performance compute servers supporting applications in AI, and the continued evolution of GPU technologies for gaming and automotive, has contributed to the overall growth for panel-level technologies swelling to over
“The Firefly G3 system, when combined with Onto’s Clearfind® technology and TrueADC® software, replaces multiple tools and operators used for defect review and classification, which enables customers to improve yields and increase their panel substrate throughput,” says Mayson Brooks, vice president and general manager of Onto’s inspection business. “Manufacturers using manual inspection methods for defect review utilize multiple human inspectors to identify and reject critical defects while categorizing minor and negligible defects that are subject to human error.”
“The flexibility of the Firefly G3 system is further demonstrated by uniquely serving a wide range of applications, such as the detection of under-film bubbles and particles. If these defects are not found at an early stage, they lead to shorts and opens later in the manufacturing process,” adds Brooks.
This next-generation Firefly system goes beyond 2D inspection and metrology by supporting additional process control steps through the introduction of 3D metrology sensors. With the new-generation 3D sensors, the system can measure film thicknesses and the height of metal RDL lines. The addition of these sensors allows customers to collect critical data required to mature their process in a shorter amount of time.
To learn more about Onto’s Firefly G3 system, contact us or reach out to your local sales team.
About Onto Innovation Inc.
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain combined with our connected thinking approach results in a unique perspective to help solve our customers’ most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. With headquarters and manufacturing in the
Forward Looking Statements
This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 (the “Act”) which include statements relating to Onto Innovation’s business momentum and future growth; the benefit to customers and the capabilities of Onto Innovation’s products and customer service; Onto Innovation’s ability to both deliver products and services consistent with our customers’ demands and expectations and strengthen its market position, Onto Innovation’s beliefs about market opportunities as well as other matters that are not purely historical data. Onto Innovation wishes to take advantage of the “safe harbor” provided for by the Act and cautions that actual results may differ materially from those projected as a result of various factors, including risks and uncertainties, many of which are beyond Onto Innovation’s control. Such factors include, but are not limited to, the Company’s ability to leverage its resources to improve its position in its core markets; its ability to weather difficult economic environments; its ability to open new market opportunities and target high-margin markets; the strength/weakness of the back-end and/or front-end semiconductor market segments; fluctuations in customer capital spending; the Company’s ability to effectively manage its supply chain and adequately source components from suppliers to meet customer demand; the effects of political, economic, legal, and regulatory changes or conflicts on the Company's global operations; its ability to adequately protect its intellectual property rights and maintain data security; the effects of natural disasters or public health emergencies, such as the current COVID-19 pandemic, on the global economy and on the Company’s customers, suppliers, employees, and business; its ability to effectively maneuver global trade issues and changes in trade and export license policies; the Company’s ability to maintain relationships with its customers and manage appropriate levels of inventory to meet customer demands; and the Company’s ability to successfully integrate acquired businesses and technologies. Additional information and considerations regarding the risks faced by Onto Innovation are available in Onto Innovation’s Form 10-K report for the year ended December 31, 2022 and other filings with the Securities and Exchange Commission. As the forward-looking statements are based on Onto Innovation’s current expectations, the Company cannot guarantee any related future results, levels of activity, performance or achievements. Onto Innovation does not assume any obligation to update the forward-looking information contained in this press release, whether as a result of new information, future events or otherwise, except as required by law.
Source: Onto Innovation Inc.
ONTO-IP
View source version on businesswire.com: https://www.businesswire.com/news/home/20240116193169/en/
Investor Relations:
Michael Sheaffer, +1 978.253.6273
mike.sheaffer@ontoInnovation.com
Source: Onto Innovation Inc.
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