Onto Innovation Announces Over $100 Million in Orders for Systems Supporting Advanced Packaging for AI
- Over $100 million in orders for Dragonfly G3 system
- Expected growth in the AI GPU market
- Versatile capabilities of the Dragonfly G3 system
- None.
Dragonfly® G3 sub-micron inspection and metrology system supports production of AI chiplet packages
This year, several companies have announced accelerated demand for AI GPUs to supply both hyperscalers and corporate enterprises with specialized parallel computing platforms to meet the growing demand for large language model applications. “The Dragonfly G3 system is a versatile integrated inspection and metrology solution that supports manufacturers with their goal of using only known good die to create both HBM and chip-on-wafer GPU packages,” says Mayson Brooks, vice president and general manager of Onto’s inspection business. “The system’s range of high-performance optical capabilities enables it to monitor multiple parameters at high throughput. Specifically, our unique Clearfind® technology is in demand by several customers to detect non-visual organic residue on chip-to-chip connections to ensure long-term package reliability and to maintain integrity of the power and data lines.”
In addition to Clearfind technology, the Dragonfly G3 system offers sub-micron 2D defect detection and metrology, measuring the depth of through silicon vias and height of redistribution layers with a visible thickness and shape sensor while infrared (IR) technology detects edge cracks that also can adversely affect device reliability. The system is tightly integrated with control and leading automated defect classification software for real-time analysis and review.
Onto Innovation offers heterogeneous integration customers flexibility in addressing their specific process control challenges as part of a broader portfolio of metrology, inspection and enterprise software products in this rapidly growing space. To learn more about the Dragonfly G3 system, visit Onto Innovation at SEMICON®
About Onto Innovation Inc.
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain combined with our connected thinking approach results in a unique perspective to help solve our customers’ most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. With headquarters and manufacturing in the
Forward Looking Statements
This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 (the “Act”) which include statements relating to Onto Innovation’s business momentum and future growth; the benefit to customers and the capabilities of Onto Innovation’s products and customer service; Onto Innovation’s ability to both deliver products and services consistent with our customers’ demands and expectations and strengthen its market position, Onto Innovation’s beliefs about market opportunities as well as other matters that are not purely historical data. Onto Innovation wishes to take advantage of the “safe harbor” provided for by the Act and cautions that actual results may differ materially from those projected as a result of various factors, including risks and uncertainties, many of which are beyond Onto Innovation’s control. Such factors include, but are not limited to, the Company’s ability to leverage its resources to improve its position in its core markets; its ability to weather difficult economic environments; its ability to open new market opportunities and target high-margin markets; the strength/weakness of the back-end and/or front-end semiconductor market segments; fluctuations in customer capital spending; the Company’s ability to effectively manage its supply chain and adequately source components from suppliers to meet customer demand; the effects of political, economic, legal, and regulatory changes or conflicts on the Company's global operations; its ability to adequately protect its intellectual property rights and maintain data security; the effects of natural disasters or public health emergencies, such as the current COVID-19 pandemic, on the global economy and on the Company’s customers, suppliers, employees, and business; its ability to effectively maneuver global trade issues and changes in trade and export license policies; the Company’s ability to maintain relationships with its customers and manage appropriate levels of inventory to meet customer demands; and the Company’s ability to successfully integrate acquired businesses and technologies. Additional information and considerations regarding the risks faced by Onto Innovation are available in Onto Innovation’s Form 10-K report for the year ended December 31, 2022 and other filings with the Securities and Exchange Commission. As the forward-looking statements are based on Onto Innovation’s current expectations, the Company cannot guarantee any related future results, levels of activity, performance or achievements. Onto Innovation does not assume any obligation to update the forward-looking information contained in this press release, whether as a result of new information, future events or otherwise, except as required by law.
Source: Onto Innovation Inc.
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Investor Relations:
Michael Sheaffer, +1 978.253.6273
mike.sheaffer@ontoInnovation.com
Source: Onto Innovation Inc.
