Jabil Expands Silicon Photonics Capabilities to Enable Next-Generation AI and Data Center Technologies

Rhea-AI Summary

Jabil Inc. (NYSE: JBL) has announced an expansion of its silicon photonics capabilities to support the growing demands of hyperscalers and next-generation cloud and AI data centers. The company plans to introduce additional capabilities at its Ottawa, Canada site in Q4 2024 to support customers' advanced photonics packaging new product introductions (NPIs).

The NPI line will feature innovative capabilities such as fluxless flip-chip, fiber attachment, precise die bonding, and wire bonding. These advancements will support silicon photonics chip packaging, particularly in high-speed connectivity applications like co-packaged optics (CPO) and high-speed on-board connections.

Jabil continues to invest in next-generation silicon photonic technologies beyond 800G and 1.6T to support AI and cloud computing, focusing on optimized performance and reduced power consumption for modern data centers. The company will showcase its 800G LPO/LRO transceivers and in-progress 1.6T module at ECOC 2024 in Frankfurt, Germany, from Sept. 22–26.

Positive

• Expansion of silicon photonics capabilities to meet growing demands of hyperscalers and AI data centers
• Introduction of advanced NPI capabilities at Ottawa site in Q4 2024
• Investment in next-generation silicon photonic technologies beyond 800G and 1.6T
• Showcasing 800G LPO/LRO transceivers and in-progress 1.6T module at ECOC 2024

Negative

• None.

Broadened offerings at Ottawa, Canada, site to support customers’ silicon photonics new product introductions

ST. PETERSBURG, Fla.--(BUSINESS WIRE)-- Jabil Inc. (NYSE: JBL), a global leader in design, manufacturing, and supply chain solutions, today announced its continued investment in silicon photonics-based products and capabilities to support the increasing demands of hyperscalers and next-wave cloud and AI data center growth. The company is set to roll out additional capabilities at its Ottawa, Canada, site in the fourth calendar-year quarter of 2024 to support customers’ advanced photonics packaging new product introductions (NPIs).

The new product introduction (NPI) line will feature innovative capabilities designed to assist photonics customers quickly scale from proof of concept to mass production, such as fluxless flip-chip, fiber attachment, precise die bonding, and wire bonding. These advancements will support silicon photonics chip packaging, particularly in high-speed connectivity applications such as co-packaged optics (CPO) and high-speed on-board connections. By leveraging Jabil’s expertise, customers can benefit from enhanced performance and reliability in their photonics solutions, ultimately driving agility and scalability in their operations.

“The expansion of our Ottawa site is a game-changer for Jabil. This facility will enable us to meet the growing demands for advanced photonics solutions tailored to AI and next-generation data centers. Through our NPI capabilities, we can assist customers in their own product development journeys, significantly reducing the need for costly trial and error in developing their own solutions from scratch,” said Matt Crowley, Executive Vice President, Global Business Units.

Continued Investments in Photonics

Jabil continues to pioneer industry-first “silicon to solutions” manufacturing approaches that improve the scalability of current and next-generation photonics, including 800G and 1.6T. The company also continues to make investments in next-generation silicon photonic technologies beyond 800G and 1.6T to support AI and cloud computing, focusing on optimized performance and reduced power consumption for modern data centers.

Jabil at ECOC 2024

Jabil experts will be on hand at ECOC 2024, held at the Congress Center Messe Frankfurt in Frankfurt, Germany, Sept. 22–26. The Jabil team will host live demos of their 800G LPO/LRO transceivers and showcase their in-progress 1.6T module at Booth B101 and Meeting Room M on the show floor.

About Jabil:

At Jabil (NYSE: JBL), we are proud to be a trusted partner for the world's top brands, offering comprehensive engineering, manufacturing, and supply chain solutions. With over 50 years of experience across industries and a vast network of over 100 sites worldwide, Jabil combines global reach with local expertise to deliver both scalable and customized solutions. Our commitment extends beyond business success as we strive to build sustainable processes that minimize environmental impact and foster vibrant and diverse communities around the globe. Discover more at www.jabil.com.

View source version on businesswire.com: https://www.businesswire.com/news/home/20240923564083/en/

Media Contact

Timur Aydin

Senior Director, Enterprise Marketing and Communications

publicrelations@jabil.com

Source: Jabil, Inc.

FAQ

What new capabilities is Jabil (JBL) adding to its Ottawa site in Q4 2024?

Jabil is adding advanced photonics packaging capabilities for new product introductions (NPIs), including fluxless flip-chip, fiber attachment, precise die bonding, and wire bonding to support silicon photonics chip packaging.

How is Jabil (JBL) supporting the growth of AI and cloud data centers?

Jabil is investing in next-generation silicon photonic technologies beyond 800G and 1.6T, focusing on optimized performance and reduced power consumption for modern data centers to support AI and cloud computing growth.

What will Jabil (JBL) showcase at ECOC 2024 in Frankfurt?

Jabil will showcase its 800G LPO/LRO transceivers and demonstrate their in-progress 1.6T module at ECOC 2024, held in Frankfurt, Germany, from September 22-26.

How does Jabil's (JBL) expansion in Ottawa benefit its customers?

The expansion allows customers to benefit from enhanced performance and reliability in their photonics solutions, driving agility and scalability in their operations while reducing the need for costly trial and error in developing their own solutions.