Welcome to our dedicated page for Ceva news (Ticker: CEVA), a resource for investors and traders seeking the latest updates and insights on Ceva stock.
Ceva, Inc. (NASDAQ: CEVA) is a licensor of silicon and software IP whose technologies underpin wireless connectivity, sensing and Edge AI in smart edge devices. The Ceva news stream on Stock Titan highlights company announcements, partnerships, product recognitions and financial disclosures that illustrate how its IP is being adopted across IoT, automotive, consumer and communications markets.
Readers can follow updates on Ceva’s collaborations with semiconductor and solutions providers, such as integrations of its SensPro AI DSP in automotive ADAS and software‑defined vehicle platforms, or the use of its PentaG Lite 5G RedCap modem IP in connected vehicle and automotive IoT solutions. News items also cover licensing wins for its NeuPro NPU portfolio, deployments of its Bluetooth and Wi‑Fi IP in AIoT chipsets, and ecosystem expansions around NeuPro‑Nano for always‑on, voice‑enabled devices.
In addition to technology and customer news, Ceva regularly issues press releases on quarterly financial results, where it discusses trends in licensing and royalty revenue, wireless IoT shipments and AI processor licensing contributions. Investors can also see announcements related to capital markets activity, including underwritten public offerings of common stock made under its shelf registration statement.
This page aggregates these developments in one place, allowing investors, analysts and industry observers to review Ceva’s latest operational milestones and strategic agreements. For ongoing insight into how Ceva’s IP is used to connect, sense and infer at the edge, users can return to this news feed to read the most recent company and market updates.
Ceva (NASDAQ: CEVA) has appointed Amir Faintuch to its Board of Directors as an independent director, expanding the board to eight members. Faintuch will also serve on the Strategic Committee, making him the seventh independent director on the board.
Faintuch brings significant semiconductor industry experience, currently serving as CEO of Volumez, a Data Infrastructure as a Service company. His previous roles include senior positions at GlobalFoundries, Intel , and Qualcomm, where he held various technical and business leadership positions. At Intel, he was Senior VP and GM of Platform Engineering, while at Qualcomm, he served as President of Qualcomm Atheros.
The appointment aims to strengthen Ceva's leadership as it focuses on growth in the smart edge AI era. Faintuch holds a bachelor's degree in economics and business administration from Haifa University and a dual MBA from Northwestern University and Tel Aviv University.
Ceva (NASDAQ: CEVA), a leading licensor of silicon and software IP for Smart Edge devices, has scheduled its fourth quarter and full year 2024 earnings release for February 13, 2025, before NASDAQ market opens. The company will host a conference call at 8:30 a.m. Eastern Time to discuss quarterly performance.
The earnings call will be accessible via phone (U.S.: 1-844-435-0316, International: +1-412-317-6365) and live webcast. A replay will be available through February 20, 2025, via phone (+1-877-344-7529 or +1-412-317-0088, access code: 5632639) and on Ceva's website.
Ceva (NASDAQ: CEVA) announced that Oritek Semiconductor has licensed its SensPro™ Vision AI DSP for the Longquan 560 series of Advanced Driver Assistance Systems (ADAS) chipsets. The collaboration aims to enhance ADAS capabilities in Electric Vehicles (EV), particularly in the Chinese market.
The Longquan 560 series will integrate Ceva's SensPro Vision AI DSP to power various intelligent automotive features, including AI-based headlights, camera monitoring systems, zone control units, and integrated central computing units for driving and parking. This integration enables automakers to reduce development costs and accelerate time-to-market while implementing advanced features.
The partnership is strategically positioned within the rapidly growing global EV market, where China leads with over 50% of global EV sales. Projections indicate that battery-powered electric vehicles will represent 30% of global vehicle sales by 2027.
Ceva and Edge Impulse have announced enhanced computer vision capabilities for embedded ML applications through integration with NVIDIA TAO toolkit. The collaboration includes full integration of Edge Impulse Studio and NVIDIA TAO toolkit support with Ceva-NeuPro Studio for both NPN32 and NPN64 NPUs.
The integration enables AI developers to optimize performance for NeuPro-Nano NPUs with minimal coding requirements. Edge Impulse's platform provides cutting-edge AI/ML models, DSP blocks, and direct integration with NVIDIA's TAO toolkit, facilitating faster development cycles. The NeuPro-Nano's architecture supports AI inference, feature extraction, and DSP workloads for audio, voice, and vision applications, while providing accurate cycle count emulation for end-to-end AI applications.
The Ceva-NeuPro-Nano NPUs are currently available for licensing.
Ceva has announced new partnerships to enhance its embedded AI ecosystem for the Ceva-NeuPro-Nano NPU. The company is collaborating with Cyberon and AIZIP to provide pre-optimized neural networks for keyword spotting, face recognition, and speaker identification in smart edge devices.
The expanded partnership with Edge Impulse now includes full integration of Edge Impulse Studio and support for NVIDIA TAO toolkit with Ceva-NeuPro Studio for both NPN32 and NPN64 NPUs. AIZIP's contribution focuses on Face Detection models, while Cyberon brings its DSpotter keyword spotting technology optimized for power-efficient performance.
The Ceva-NeuPro-Nano NPUs are currently available for licensing, along with Cyberon and AIZIP's optimized neural networks. The Edge Impulse Platform integration will be available in the coming months.
Ceva (NASDAQ: CEVA) announced significant market traction for its Ceva-NeuPro-Nano Embedded AI NPUs in the AIoT and MCU markets. The NPN32 and NPN64 NPUs offer power, performance, and cost efficiencies for embedded AI model deployment on SoCs, featuring a Coremark/MHz score of 6.0.
The company has released Ceva-NeuPro Studio, an integrated IDE solution enabling comprehensive AI application development and deployment. Key features include support for open-source AI frameworks, inference code generation, and seamless integration with Edge Impulse Studio. The solution allows customers to evaluate AI models before silicon availability and deploy using NVIDIA TAO Toolkit.
The technology has received industry recognition, winning the Best IP/Processor of the Year 2024 at EE Awards Asia and the 2024 IoT Edge Computing Excellence Award.
Ceva (NASDAQ: CEVA) announced that Bestechnic has integrated Ceva-Waves Wi-Fi 6 and Bluetooth dual-mode IP platforms in their new Bluetooth/Wi-Fi combo products, including the BES2610 and BES2800 families. Bestechnic, having shipped over 1 billion smart audio SoCs with Ceva's Bluetooth technology, is expanding their partnership to address the growing Wi-Fi 6 market, projected to reach 2.7 billion units annually by 2027.
The new combo devices feature Bluetooth 5.4 dual-mode capability and Wi-Fi 6 subsystem, optimized for ultra-low power consumption with 2.4GHz Wi-Fi RX current as low as 14mA. These solutions target smart wearables, smart home, and smart audio applications, particularly focusing on devices requiring high-throughput wireless connectivity and lossless audio streaming capabilities.
Ceva and MediaTek have announced a partnership to integrate Ceva-RealSpace Elevate multi-channel spatial audio with head tracking into MediaTek's Dimensity 9400 flagship 5G smartphone chip. The solution will enhance mobile entertainment experiences through Bluetooth LE Audio.
The collaboration aims to deliver immersive three-dimensional sound environments that replicate natural hearing. The technology will be compatible with True Wireless Stereo (TWS) earbuds and headphones, offering features like stereo content spatialization and precise head tracking. The solution leverages Dimensity 9400's Bluetooth LE Audio capabilities for low latency streaming and improved battery life.
Ceva-RealSpace Elevate, available for licensing to smartphone OEMs, will be demonstrated at CES 2025. The solution supports various audio formats and includes a high-quality microphone array for spatial audio recording.
Ceva has unveiled the Ceva-Waves Links200, a groundbreaking multi-protocol wireless connectivity platform IP that supports next-generation Bluetooth High Data Throughput (HDT) and IEEE 802.15.4 technologies. The platform features a new Ceva-developed radio designed for TSMC's 12nm process, delivering data rates up to 7.5 Mbps - more than double traditional Bluetooth speeds.
The Links200 combines Bluetooth HDT with IEEE 802.15.4 support for Zigbee, Thread, and Matter protocols, enabling concurrent multi-link communication. The solution targets hearables, wearables, and wireless consumer electronics, supporting lossless, multi-channel, low-latency audio streaming for devices like TWS earbuds, headsets, and car audio systems.
Key features include full Bluetooth dual mode support, comprehensive integration of RF, modem, controller, and software stacks, advanced audio support, and compatibility with Ceva's sensing and inference IPs.
Ceva-NeuPro-Nano has won the Best IP/Processor of the Year award at the EE Awards Asia event in Taipei. The Neural Processing Units (NPUs) are designed to deliver optimal balance of ultra-low power and performance for embedded AI workloads in consumer, industrial, and AIoT products.
The technology features a fully programmable architecture that efficiently executes Neural Networks, supports advanced machine learning data types, and includes Ceva-NetSqueeze AI compression technology that enables up to 80% memory footprint reduction. The NPUs come with Ceva-NeuPro Studio, a unified AI stack supporting open AI frameworks including LiteRT for Microcontrollers and microTVM.
This solution addresses key challenges in embedded AI implementation, making artificial intelligence more accessible and practical for various applications including voice, vision, predictive maintenance, and health sensing in IoT devices.