Welcome to our dedicated page for Ceva news (Ticker: CEVA), a resource for investors and traders seeking the latest updates and insights on Ceva stock.
Ceva, Inc. (NASDAQ: CEVA) is a licensor of silicon and software IP whose technologies underpin wireless connectivity, sensing and Edge AI in smart edge devices. The Ceva news stream on Stock Titan highlights company announcements, partnerships, product recognitions and financial disclosures that illustrate how its IP is being adopted across IoT, automotive, consumer and communications markets.
Readers can follow updates on Ceva’s collaborations with semiconductor and solutions providers, such as integrations of its SensPro AI DSP in automotive ADAS and software‑defined vehicle platforms, or the use of its PentaG Lite 5G RedCap modem IP in connected vehicle and automotive IoT solutions. News items also cover licensing wins for its NeuPro NPU portfolio, deployments of its Bluetooth and Wi‑Fi IP in AIoT chipsets, and ecosystem expansions around NeuPro‑Nano for always‑on, voice‑enabled devices.
In addition to technology and customer news, Ceva regularly issues press releases on quarterly financial results, where it discusses trends in licensing and royalty revenue, wireless IoT shipments and AI processor licensing contributions. Investors can also see announcements related to capital markets activity, including underwritten public offerings of common stock made under its shelf registration statement.
This page aggregates these developments in one place, allowing investors, analysts and industry observers to review Ceva’s latest operational milestones and strategic agreements. For ongoing insight into how Ceva’s IP is used to connect, sense and infer at the edge, users can return to this news feed to read the most recent company and market updates.
Ceva has announced new partnerships to enhance its embedded AI ecosystem for the Ceva-NeuPro-Nano NPU. The company is collaborating with Cyberon and AIZIP to provide pre-optimized neural networks for keyword spotting, face recognition, and speaker identification in smart edge devices.
The expanded partnership with Edge Impulse now includes full integration of Edge Impulse Studio and support for NVIDIA TAO toolkit with Ceva-NeuPro Studio for both NPN32 and NPN64 NPUs. AIZIP's contribution focuses on Face Detection models, while Cyberon brings its DSpotter keyword spotting technology optimized for power-efficient performance.
The Ceva-NeuPro-Nano NPUs are currently available for licensing, along with Cyberon and AIZIP's optimized neural networks. The Edge Impulse Platform integration will be available in the coming months.
Ceva (NASDAQ: CEVA) announced significant market traction for its Ceva-NeuPro-Nano Embedded AI NPUs in the AIoT and MCU markets. The NPN32 and NPN64 NPUs offer power, performance, and cost efficiencies for embedded AI model deployment on SoCs, featuring a Coremark/MHz score of 6.0.
The company has released Ceva-NeuPro Studio, an integrated IDE solution enabling comprehensive AI application development and deployment. Key features include support for open-source AI frameworks, inference code generation, and seamless integration with Edge Impulse Studio. The solution allows customers to evaluate AI models before silicon availability and deploy using NVIDIA TAO Toolkit.
The technology has received industry recognition, winning the Best IP/Processor of the Year 2024 at EE Awards Asia and the 2024 IoT Edge Computing Excellence Award.
Ceva (NASDAQ: CEVA) announced that Bestechnic has integrated Ceva-Waves Wi-Fi 6 and Bluetooth dual-mode IP platforms in their new Bluetooth/Wi-Fi combo products, including the BES2610 and BES2800 families. Bestechnic, having shipped over 1 billion smart audio SoCs with Ceva's Bluetooth technology, is expanding their partnership to address the growing Wi-Fi 6 market, projected to reach 2.7 billion units annually by 2027.
The new combo devices feature Bluetooth 5.4 dual-mode capability and Wi-Fi 6 subsystem, optimized for ultra-low power consumption with 2.4GHz Wi-Fi RX current as low as 14mA. These solutions target smart wearables, smart home, and smart audio applications, particularly focusing on devices requiring high-throughput wireless connectivity and lossless audio streaming capabilities.
Ceva and MediaTek have announced a partnership to integrate Ceva-RealSpace Elevate multi-channel spatial audio with head tracking into MediaTek's Dimensity 9400 flagship 5G smartphone chip. The solution will enhance mobile entertainment experiences through Bluetooth LE Audio.
The collaboration aims to deliver immersive three-dimensional sound environments that replicate natural hearing. The technology will be compatible with True Wireless Stereo (TWS) earbuds and headphones, offering features like stereo content spatialization and precise head tracking. The solution leverages Dimensity 9400's Bluetooth LE Audio capabilities for low latency streaming and improved battery life.
Ceva-RealSpace Elevate, available for licensing to smartphone OEMs, will be demonstrated at CES 2025. The solution supports various audio formats and includes a high-quality microphone array for spatial audio recording.
Ceva has unveiled the Ceva-Waves Links200, a groundbreaking multi-protocol wireless connectivity platform IP that supports next-generation Bluetooth High Data Throughput (HDT) and IEEE 802.15.4 technologies. The platform features a new Ceva-developed radio designed for TSMC's 12nm process, delivering data rates up to 7.5 Mbps - more than double traditional Bluetooth speeds.
The Links200 combines Bluetooth HDT with IEEE 802.15.4 support for Zigbee, Thread, and Matter protocols, enabling concurrent multi-link communication. The solution targets hearables, wearables, and wireless consumer electronics, supporting lossless, multi-channel, low-latency audio streaming for devices like TWS earbuds, headsets, and car audio systems.
Key features include full Bluetooth dual mode support, comprehensive integration of RF, modem, controller, and software stacks, advanced audio support, and compatibility with Ceva's sensing and inference IPs.
Ceva-NeuPro-Nano has won the Best IP/Processor of the Year award at the EE Awards Asia event in Taipei. The Neural Processing Units (NPUs) are designed to deliver optimal balance of ultra-low power and performance for embedded AI workloads in consumer, industrial, and AIoT products.
The technology features a fully programmable architecture that efficiently executes Neural Networks, supports advanced machine learning data types, and includes Ceva-NetSqueeze AI compression technology that enables up to 80% memory footprint reduction. The NPUs come with Ceva-NeuPro Studio, a unified AI stack supporting open AI frameworks including LiteRT for Microcontrollers and microTVM.
This solution addresses key challenges in embedded AI implementation, making artificial intelligence more accessible and practical for various applications including voice, vision, predictive maintenance, and health sensing in IoT devices.
Ceva, Inc. (NASDAQ: CEVA), a leading licensor of silicon and software IP for Smart Edge devices, announced its participation in several upcoming investor events and conferences:
- 13th Annual ROTH Technology Conference on November 20, 2024, at the Hard Rock Hotel, New York.
- Barclays 22nd Annual Global Technology Conference on December 11, 2024, at The Palace Hotel, San Francisco.
- Northland Growth Conference 2024 2.0 on December 12, 2024, virtually.
- CES 2025 from January 7-10, 2025, in Las Vegas, Nevada.
- 27th Annual Needham Growth Conference on January 14-15, 2025, at Lotte New York Palace Hotel, NY.
For meetings, contact respective representatives. Ceva's CES 2025 meeting suite is by invitation only, and the Needham conference presentation will be webcast live with details on Ceva's investor relations website.
Ceva reported strong Q3 2024 financial results with total revenue of $27.2 million, up 13% year-over-year. The quarter saw record device shipments of 522 million units, including over 400 million combined Bluetooth, Wi-Fi, and cellular IoT shipments. Licensing revenue increased 12% to $15.6 million, while royalty revenue grew 15% to $11.6 million. The company secured 10 IP licensing agreements and raised its full-year 2024 guidance to 7-9% growth. Non-GAAP net income increased 137% to $3.4 million, with EPS of $0.14. The board authorized an additional 700,000 shares for repurchase.
Ceva has announced an expansion of its share repurchase program, adding 700,000 shares of common stock to the existing plan. Combined with approximately 356,000 shares available under the current program as of September 30, 2024, this brings the total to 1,056,000 shares available for repurchase. The company plans to execute these repurchases through open market or private transactions, subject to market conditions and trading regulations. CEO Amir Panush emphasized that this decision reflects management's confidence in Ceva's business performance and growth strategy, highlighting the company's strong balance sheet position.
Ceva, Inc. (NASDAQ: CEVA), a leading licensor of silicon and software IP for Smart Edge devices, has announced its schedule for the third quarter 2024 earnings release and conference call. The company will release its Q3 2024 results on November 7, 2024, before the NASDAQ market opens. Following the release, Ceva management will host a conference call at 8:30 a.m. Eastern Time to discuss the quarter's operating performance.
The conference call will be accessible via phone for both U.S. and international participants, as well as through a live webcast. For those unable to attend the live broadcast, a replay will be available by phone and on Ceva's website until November 14, 2024.
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