Ceva Powers Oritek's Next-Gen ADAS chipsets for Smarter, Safer Electric Vehicles
Rhea-AI Summary
Ceva (NASDAQ: CEVA) announced that Oritek Semiconductor has licensed its SensPro™ Vision AI DSP for the Longquan 560 series of Advanced Driver Assistance Systems (ADAS) chipsets. The collaboration aims to enhance ADAS capabilities in Electric Vehicles (EV), particularly in the Chinese market.
The Longquan 560 series will integrate Ceva's SensPro Vision AI DSP to power various intelligent automotive features, including AI-based headlights, camera monitoring systems, zone control units, and integrated central computing units for driving and parking. This integration enables automakers to reduce development costs and accelerate time-to-market while implementing advanced features.
The partnership is strategically positioned within the rapidly growing global EV market, where China leads with over 50% of global EV sales. Projections indicate that battery-powered electric vehicles will represent 30% of global vehicle sales by 2027.
Positive
- Strategic partnership in China's dominant EV market (>50% of global EV sales)
- New licensing agreement for SensPro technology in Longquan 560 series
- Expansion into high-growth ADAS market segment
- Technology enables multiple revenue streams through various automotive applications
Negative
- None.
News Market Reaction 1 Alert
On the day this news was published, CEVA declined 1.97%, reflecting a mild negative market reaction.
Data tracked by StockTitan Argus on the day of publication.
Lonquan 560 SoCs leverage Ceva-SensPro Vision AI DSP to advance ADAS capabilities amidst
The Longquan 560 series represents Oritek's commitment to innovation, catering to diverse intelligent automotive needs of Electric Vehicles (EV) such as AI-based headlights, camera monitoring systems (CMS), zone control units (ZCU), and integrated central computing units for driving and parking. These chips are equipped with the Ceva-SensPro Vision AI DSP, a high-performance, low-power processor designed for complex sensor processing and AI workloads. This combination enables automakers to accelerate time-to-market, reduce development costs, and integrate advanced features seamlessly.
"Ceva's SensPro Vision AI DSP, embedded in our Longquan 560 series, provides the high-performance, energy-efficient processing essential for ADAS innovation," said Mr. Gao Feng, CEO of Oritek. "Our collaboration will empower automakers to meet the demands of a fast-evolving automotive market, delivering smarter, safer, and more reliable solutions."
"Oritek's selection of our SensPro processor reinforces the market-leading performance we enable for advanced sensing and processing capabilities required by today's automotive leaders," said Ran Snir, vice president and general manager of the vision business unit at Ceva. "With SensPro's unique capability to seamlessly handle the most intensive real-time workloads associated with critical ADAS applications, we are excited to collaborate on delivering cutting-edge solutions for the rapidly expanding EV market."
Market Context: The Booming Global EV Industry
The global electric vehicle (EV) market is experiencing unprecedented growth, driven by escalating demand for sustainable transportation, stringent emissions regulations, and advancements in technology.
SensPro™ is a highly-scalable, high-performance vision AI DSP for multitasking sensing and AI workloads of multiple sensors including camera, Radar, LiDar, Time-of-Flight, microphones and inertial measurement units. The SensPro family is designed to handle multiple sensor processing for contextually-aware devices and can be utilized in modern intelligent systems in automotive (inc. ISO26262 functional safety compliance), robotics, surveillance, AR/VR, voice assistants, wearables, mobile and smart home devices. The SensPro maximizes performance-per-watt for multi-sensor processing use cases by utilizing a combination of high performance single and half precision floating point math, point cloud creation and Deep Neural Network processing, along with parallel processing capacity for voice, imaging, and Simultaneous Localization and Mapping (SLAM). For more information, visit https://www.ceva-ip.com/product/ceva-senspro/.
About Ceva, Inc.
At Ceva, we are passionate about bringing new levels of innovation to the smart edge. Our wireless communications, sensing and Edge AI technologies are at the heart of some of today's most advanced smart edge products. From Bluetooth, Wi-Fi, UWB and 5G platform IP for ubiquitous, robust communications, to scalable Edge AI NPU IPs, sensor fusion processors and embedded application software that make devices smarter, we have the broadest portfolio of IP to connect, sense and infer data more reliably and efficiently. We deliver differentiated solutions that combine outstanding performance at ultra-low power within a very small silicon footprint. Our goal is simple – to deliver the silicon and software IP to enable a smarter, safer, and more interconnected world. This philosophy is in practice today, with Ceva powering more than 17 billion of the world's most innovative smart edge products from AI-infused smartwatches, IoT devices and wearables to autonomous vehicles and 5G mobile networks.
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SOURCE Ceva, Inc.