BAE Systems to Deliver Advanced Microelectronics to U.S. Defense Industrial Base
BAE Systems' FAST Labs™ R&D organization has been awarded a $22 million contract by the Office of the Undersecretary of Defense for Research & Engineering's Trusted & Assured Microelectronics program. The contract, managed by NSTXL, supports the STEAM PIPE project to develop advanced chiplet prototypes for military systems.
These specialized chiplets are small, modular components that can be combined to form larger, complex system-on-a-chip designs. The technology aims to enable smaller form factor electronic warfare technology on new platforms. BAE Systems will collaborate with subcontractors Extoll GmbH and Comcores ApS on this project, which builds on recent technological advances and follows a milestone in the SHIP program.
Il dipartimento R&D FAST Labs™ di BAE Systems ha ricevuto un contratto di 22 milioni di dollari dall'Ufficio del Sottosegretario della Difesa per la Ricerca e l'Ingegneria nell'ambito del programma Trusted & Assured Microelectronics. Il contratto, gestito da NSTXL, supporta il progetto STEAM PIPE per lo sviluppo di avanzati prototipi di chiplet per sistemi militari.
Questi chiplet specializzati sono componenti piccoli e modulari che possono essere combinati per formare disegni più grandi e complessi di sistemi su chip. La tecnologia mira a consentire tecnologie di guerra elettronica con un fattore di forma ridotto su nuove piattaforme. BAE Systems collaborerà con i subappaltatori Extoll GmbH e Comcores ApS per questo progetto, che si basa su recenti avanzamenti tecnologici e segue un traguardo nel programma SHIP.
La organización de I+D FAST Labs™ de BAE Systems ha sido galardonada con un contrato de 22 millones de dólares por la Oficina del Subsecretario de Defensa para Investigación e Ingeniería, en el marco del programa de Microelectrónica Confiable y Asegurada. El contrato, gestionado por NSTXL, apoya el proyecto STEAM PIPE para desarrollar prototipos avanzados de chiplet para sistemas militares.
Estos chiplets especializados son componentes pequeños y modulares que pueden combinarse para formar diseños más grandes y complejos de sistema en un chip. La tecnología tiene como objetivo permitir tecnologías de guerra electrónica de menor tamaño en nuevas plataformas. BAE Systems colaborará con los subcontratistas Extoll GmbH y Comcores ApS en este proyecto, que se basa en avances tecnológicos recientes y sigue un hito en el programa SHIP.
BAE Systems의 FAST Labs™ R&D 조직이 국방부 연구 및 엔지니어링 사무국의 신뢰할 수 있는 마이크로전자 프로그램으로부터 2200만 달러 계약을 수주했습니다. NSTXL에서 관리하는 이 계약은 군사 시스템을 위한 고급 칩렛 프로토타입을 개발하기 위한 STEAM PIPE 프로젝트를 지원합니다.
이러한 특수 칩렛은 결합하여 더 크고 복잡한 시스템 온 칩 디자인을 형성할 수 있는 작고 모듈화된 구성 요소입니다. 이 기술은 새로운 플랫폼에서 작은 폼 팩터 전자전 기술을 가능하게 하는 것을 목표로 합니다. BAE Systems는 이 프로젝트에서 Extoll GmbH 및 Comcores ApS와 협력할 예정이며, 이는 최근의 기술 발전을 기반으로 하며 SHIP 프로그램의 이정표를 따릅니다.
L'organisation de R&D FAST Labs™ de BAE Systems a reçu un contrat de 22 millions de dollars de l'Office du Sous-secrétaire à la Défense pour la Recherche et l'Ingénierie dans le cadre du programme Trusted & Assured Microelectronics. Le contrat, géré par NSTXL, soutient le projet STEAM PIPE pour le développement de prototypes de chiplet avancés pour les systèmes militaires.
Ces chiplets spécialisés sont des composants petits et modulaires qui peuvent être combinés pour former des conceptions plus grandes et complexes de système sur puce. La technologie vise à permettre des technologies de guerre électronique de plus petite taille sur de nouvelles plateformes. BAE Systems collaborera avec les sous-traitants Extoll GmbH et Comcores ApS dans ce projet, qui s'appuie sur des avancées technologiques récentes et suit un jalon dans le programme SHIP.
Die R&D-Organisation FAST Labs™ von BAE Systems wurde mit einem Vertrag über 22 Millionen Dollar vom Büro des Staatssekretärs für Verteidigung für das Programm Trusted & Assured Microelectronics ausgezeichnet. Der Vertrag, der von NSTXL verwaltet wird, unterstützt das STEAM PIPE-Projekt, um fortschrittliche Chiplet-Prototypen für militärische Systeme zu entwickeln.
Diese spezialisierten Chiplets sind kleine, modulare Komponenten, die kombiniert werden können, um größere, komplexe System-on-a-Chip-Designs zu bilden. Die Technologie zielt darauf ab, elektronische Kriegsführungstechnologie im kleineren Formfaktor auf neuen Plattformen zu ermöglichen. BAE Systems wird in diesem Projekt mit den Subunternehmen Extoll GmbH und Comcores ApS zusammenarbeiten, das auf jüngsten technologischen Fortschritten basiert und einem Meilenstein im SHIP-Programm folgt.
- $22 million contract awarded for advanced microelectronics development
- Technology to be made available to entire U.S. defense industrial base
- Potential for breakthroughs in smaller form factor electronic warfare technology
- None.
Award part of the National Security Technology Accelerator’s STEAM PIPE project
BAE Systems awarded
Microelectronics play a critical role in furthering the Department of Defense’s warfighting capabilities. BAE Systems’ work under the STEAM PIPE project will result in the development and delivery of advanced chiplet prototypes that will transition into military systems. The technology will be made available to the entire
“The highly specialized chiplets are small, modular pieces that can be combined to form a larger, more complex system-on-a-chip,” said Wes Allen, director of Microelectronics at BAE Systems’ FAST Labs. “This is the beginning of a new chiplet ecosystem that could result in breakthroughs like enabling smaller form factor electronic warfare technology on new platforms.”
Work on the project, which builds on the technology advances of recent programs and follows a recently announced delivery milestone on the State-of-the-Art Heterogeneous Integrated Packaging (SHIP) program, includes collaboration with subcontractors Extoll GmbH and Comcores ApS.
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Paul Roberts, BAE Systems
Mobile: 603-521-2381
paul.a.roberts@baesystems.com
www.baesystems.com/US
@BAESystemsInc
Source: BAE Systems
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