Broadcom Delivers Industry Leading 200G/lane DSP for Gen AI Infrastructure
Broadcom Inc. (NASDAQ: AVGO) has announced the general availability of Sian™2, a 200 Gbps per lane (200G/lane) PAM-4 DSP PHY. This new product, along with the existing Sian DSP, enables pluggable modules with 200G/lane interfaces important for connecting next-generation AI clusters. The Sian family of products is designed to meet the growing demands of AI infrastructure, offering:
- Higher bandwidth (800G/1.6T links)
- Lower power consumption
- Lower latency
- Lower cost per bit
Sian2 supports both 800G and 1.6T pluggable modules, with features including support for multiple FEC options and built-in laser drivers. Broadcom is currently sampling the Sian2 BCM8582X device to early access customers and partners.
Broadcom Inc. (NASDAQ: AVGO) ha annunciato la disponibilità generale di Sian™2, un PHY DSP PAM-4 da 200 Gbps per lane (200G/lane). Questo nuovo prodotto, insieme all'esistente DSP Sian, consente moduli pluggabili con interfacce da 200G/lane, importanti per collegare i cluster AI di nuova generazione. La famiglia di prodotti Sian è progettata per soddisfare le crescenti esigenze dell'infrastruttura AI, offrendo:
- Maggiore larghezza di banda (link da 800G/1.6T)
- Minore consumo di energia
- Minore latenza
- Minore costo per bit
Sian2 supporta sia moduli pluggabili da 800G che da 1.6T, con funzionalità che includono il supporto per più opzioni FEC e driver laser integrati. Attualmente, Broadcom sta campionando il dispositivo Sian2 BCM8582X a clienti e partner in accesso anticipato.
Broadcom Inc. (NASDAQ: AVGO) ha anunciado la disponibilidad general de Sian™2, un PHY DSP PAM-4 de 200 Gbps por canal (200G/canal). Este nuevo producto, junto con el DSP Sian existente, habilita módulos extraíbles con interfaces de 200G/canal, lo cual es importante para conectar clústeres de IA de próxima generación. La familia de productos Sian está diseñada para satisfacer la creciente demanda de infraestructura de IA, ofreciendo:
- Mayor ancho de banda (enlaces de 800G/1.6T)
- Menor consumo de energía
- Menor latencia
- Menor costo por bit
Sian2 soporta módulos extraíbles de 800G y 1.6T, con características que incluyen soporte para múltiples opciones de FEC y controladores láser integrados. Actualmente, Broadcom está enviando el dispositivo Sian2 BCM8582X a clientes y socios de acceso anticipado.
브로드컴 Inc. (NASDAQ: AVGO)는 Sian™2의 일반 출시를 발표했습니다. 이는 레인당 200 Gbps(200G/lane) PAM-4 DSP PHY입니다. 이 새로운 제품은 기존의 Sian DSP와 함께 200G/lane 인터페이스를 가진 플러그형 모듈을 가능하게 하여 차세대 AI 클러스터를 연결하는 데 중요합니다. Sian 제품군은 AI 인프라의 증가하는 요구를 충족하도록 설계되었으며, 다음과 같은 기능을 제공합니다:
- 더 높은 대역폭(800G/1.6T 링크)
- 더 낮은 전력 소비
- 더 낮은 지연
- 비트당 더 낮은 비용
Sian2는 800G 및 1.6T 플러그형 모듈을 지원하며, 여러 가지 FEC 옵션과 내장 레이저 드라이버 지원 기능을 포함합니다. 브로드컴은 현재 Sian2 BCM8582X 장치를 초기 액세스 고객 및 파트너에게 샘플링하고 있습니다.
Broadcom Inc. (NASDAQ: AVGO) a annoncé la disponibilité générale de Sian™2, un PHY DSP PAM-4 à 200 Gbps par voie (200G/voie). Ce nouveau produit, avec le DSP Sian existant, permet la création de modules enfichables avec des interfaces de 200G/voie, essentiel pour connecter les clusters d'IA de prochaine génération. La famille de produits Sian est conçue pour répondre aux demandes croissantes des infrastructures d'IA, offrant :
- Une bande passante plus élevée (liens de 800G/1.6T)
- Une consommation d'énergie réduite
- Une latence plus faible
- Un coût par bit réduit
Sian2 prend en charge les modules enfichables de 800G et 1.6T, avec des fonctionnalités incluant le support de plusieurs options FEC et des pilotes laser intégrés. Broadcom teste actuellement le dispositif Sian2 BCM8582X auprès de clients et partenaires ayant un accès anticipé.
Broadcom Inc. (NASDAQ: AVGO) hat die allgemeine Verfügbarkeit von Sian™2 angekündigt, einem 200 Gbps pro Lane (200G/lane) PAM-4 DSP PHY. Dieses neue Produkt, zusammen mit dem bestehenden Sian DSP, ermöglicht steckbare Module mit 200G/lane-Schnittstellen, die wichtig sind, um KI-Cluster der nächsten Generation zu verbinden. Die Sian-Produktfamilie ist darauf ausgelegt, die wachsenden Anforderungen der KI-Infrastruktur zu erfüllen und bietet:
- Höhere Bandbreite (800G/1.6T Verbindungen)
- Geringeren Energieverbrauch
- Geringere Latenz
- Geringere Kosten pro Bit
Sian2 unterstützt sowohl 800G- als auch 1.6T-steckbare Module mit Funktionen, die Unterstützung für mehrere FEC-Optionen und integrierte Lasertreiber umfassen. Broadcom bietet derzeit das Sian2 BCM8582X-Gerät frühen Zugangskunden und -partnern an.
- Introduction of Sian™2, a 200G/lane PAM-4 DSP PHY, enabling higher bandwidth for AI infrastructure
- Support for 800G and 1.6T pluggable modules, doubling the bandwidth of current 100G/lane optics
- Lower power consumption, latency, and cost per bit compared to previous solutions
- Collaboration with industry partners like Eoptolink and InnoLight for high-performance transceiver solutions
- None.
Broadcom Sian Family of DSPs Enable Best-in-Class 800G and 1.6T Optical Transceivers
PALO ALTO, Calif., Sept. 23, 2024 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO) today announced the general availability of Sian™2, 200 Gbps per lane (200G/lane) PAM-4 DSP PHY. Sian2 features 200G/lane electrical and optical interfaces to augment the Sian DSP that supports 100 Gbps electrical and 200Gbps optical interfaces. Sian and Sian2 DSPs enable pluggable modules with 200G/lane interfaces that are foundational to connect next generation AI clusters.
AI cluster sizes and cluster performance needs are growing dramatically to support exploding AI model sizes. High performance, low latency, and resilient connectivity are vital for the scale-up and scale-out of next generation AI clusters. For these networks, customers demand reliable optical network connectivity with higher bandwidth, lower power, lower latency and lower cost. This necessitates the migration from the 400G/800G links with 100G/lane optics being used in AI clusters today to 800G/1.6T links with 200G/lane optics that Sian2 enables. Broadcom’s Sian2 and Sian DSPs are optimized for 800G and 1.6T optical module platforms and deliver unmatched performance by doubling the bandwidth with lower power, lower latency and lower cost per bit to facilitate AI data center scale.
“200G/lane DSP is foundational to high-speed optical links for next generation scale-up and scale-out networks in the AI infrastructure,” said Vijay Janapaty, vice president and general manager of the Physical Layer Products Division at Broadcom. “The Sian family of products reinforces Broadcom’s leadership in optical DSP PHYs and enables our AI data center customers to deploy high-performance 800G and 1.6T links.”
Further, the combination of Sian2 and Sian PHY and Broadcom’s leading-edge 200G/lane optics, including electro-absorption modulated laser (EML) and continuous wave laser (CWL), provides the best-in-class performance and power consumption enabling data center operators to cost-effectively scale AI workloads.
“AI market leaders will start ramping optical modules using 200G/lane in 2025,” commented Dr. Vlad Kozlov, CEO and Chief Analyst at LightCounting. “There is a race for dominance in AI fueling a demand for delivery in excess of 1M units of 1.6T optical transceivers within the first 12 months. We have never seen new products ramping at such rate.”
Sian2 Product Highlights:
- Low power 5nm 200G/lane DSP solution enabling sub-28W 1.6T transceivers
- Supports 800G and 1.6T pluggable modules
- Support for both 212.5-Gb/s and 226.875-Gb/s data rates for InfiniBand and Ethernet applications
- Support for multiple FEC options including Bypass, Segmented and Concatenated FEC
- Built-in low-swing and high-swing laser driver for both SiP and EML based optical modules
- Sub-80ns roundtrip (Ingress + Egress) latency for AI/ML applications
- Crossbar support for ease of transceiver design
Demo Showcase at ECOC 2024
Broadcom Sian2 PHY and 200G/lane optics inside 1.6T DR8 optical modules will be demonstrated in the Innolight Booth B81 and Eoptolink Booth D60 taking place at ECOC Exhibition 2024, in Frankfurt, Germany from September 23-25. Attendees will see live transmit eye performance and end-to-end pre-FEC & post-FEC performance with IEEE compliant KP4 FEC.
“Sian2 enables the design of high-speed optical transceivers for next generation switches, network interface cards and accelerators with 200G SerDes interfaces,” said Richard Huang, CEO, Eoptolink Technology. “The Broadcom Sian2 DSP and Eoptolink’s innovative transceiver design approach results in performance leading 1.6T pluggable optical transceivers. Combined with Eoptolink’s high volume manufacturing capability, this ensures the supply for the growing bandwidth in AI networks.”
“InnoLight is leading the industry’s transition to 1.6T with the lowest power transceiver solutions, leveraging Broadcom’s Sian2 DSP,” said Hai Ding, VP of Marketing, InnoLight Technology. “As engineering pioneers, we're redefining optical networking with our cutting-edge innovations, and helping accelerate the deployments of 200G/lane pluggables for next generation AI workloads.”
Availability
Broadcom is currently sampling the Sian2 BCM8582X device to its early access customers and partners. Please contact your local Broadcom sales representative for samples and pricing.
For more information on Broadcom’s 200G/lane optical solutions, please click here.
About Broadcom
Broadcom Inc. (NASDAQ: AVGO) is a global technology leader that designs, develops, and supplies a broad range of semiconductor, enterprise software and security solutions. Broadcom's category-leading product portfolio serves critical markets including cloud, data center, networking, broadband, wireless, storage, industrial, and enterprise software. Our solutions include service provider and enterprise networking and storage, mobile device and broadband connectivity, mainframe, cybersecurity, and private and hybrid cloud infrastructure. Broadcom is a Delaware corporation headquartered in Palo Alto, CA. For more information, go to www.broadcom.com.
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Press Contact:
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press.relations@broadcom.com
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