Applied Materials Announces New Collaboration Model for Advanced Packaging at Summit on Energy-Efficient Computing
Applied Materials announced the expansion of its EPIC innovation platform with a new collaboration model focused on advanced chip packaging technologies. The initiative, called EPIC Advanced Packaging, aims to accelerate the commercialization of energy-efficient computing solutions through partnerships between equipment makers, material providers, device companies, and research institutes.
The company hosted a summit in Singapore with over two dozen R&D leaders to address the increasing energy consumption challenges in AI computing. The strategy focuses on developing advanced packaging technologies like micro-bumps, through-silicon vias, and silicon interposers to enhance interconnect density and bandwidth for next-generation systems.
Applied Materials ha annunciato l'espansione della sua piattaforma di innovazione EPIC con un nuovo modello di collaborazione incentrato sulle tecnologie avanzate di imballaggio dei chip. L'iniziativa, chiamata EPIC Advanced Packaging, si propone di accelerare la commercializzazione di soluzioni di calcolo efficienti dal punto di vista energetico attraverso partnership tra produttori di attrezzature, fornitori di materiali, aziende di dispositivi e istituti di ricerca.
L'azienda ha ospitato un summit a Singapore con più di due dozzine di leader R&D per affrontare le crescenti sfide dei consumi energetici nel calcolo AI. La strategia si concentra sullo sviluppo di tecnologie di imballaggio avanzate come micro-bump, via silicio e interpositori in silicio per migliorare la densità di interconnessione e la larghezza di banda per i sistemi di prossima generazione.
Applied Materials anunció la expansión de su plataforma de innovación EPIC con un nuevo modelo de colaboración centrado en las tecnologías avanzadas de empaquetado de chips. La iniciativa, llamada EPIC Advanced Packaging, tiene como objetivo acelerar la comercialización de soluciones informáticas energéticamente eficientes a través de asociaciones entre fabricantes de equipos, proveedores de materiales, empresas de dispositivos e institutos de investigación.
La empresa organizó una cumbre en Singapur con más de dos docenas de líderes de I+D para abordar los crecientes desafíos del consumo energético en la computación de IA. La estrategia se centra en desarrollar tecnologías de empaquetado avanzadas como micro-bumps, vías a través del silicio y chip interposers para mejorar la densidad de interconexión y el ancho de banda para los sistemas de próxima generación.
Applied Materials는 고급 칩 패키징 기술에 초점을 맞춘 새로운 협업 모델로 EPIC 혁신 플랫폼 확장 사실을 발표했습니다. 'EPIC Advanced Packaging'이라고 불리는 이 이니셔티브는 장비 제조업체, 재료 제공업체, 장치 기업 및 연구 기관 간의 협력을 통해 에너지 효율적인 컴퓨팅 솔루션의 상용화를 가속화하는 것을 목표로 하고 있습니다.
회사는 싱가포르에서 20명 이상의 R&D 리더와 함께 AI 컴퓨팅의 증가하는 에너지 소비 문제를 다루기 위한 정상 회담을 개최했습니다. 이 전략은 마이크로 범프, 실리콘 관통 및 실리콘 인터포저와 같은 고급 패키징 기술을 개발하여 차세대 시스템의 인터커넥트 밀도 및 대역폭을 향상시키는 데 중점을 두고 있습니다.
Applied Materials a annoncé l'expansion de sa plateforme d'innovation EPIC avec un nouveau modèle de collaboration axé sur les technologies avancées d'emballage de puces. L'initiative, appelée EPIC Advanced Packaging, vise à accélérer la commercialisation de solutions informatiques écoénergétiques grâce à des partenariats entre fabricants d'équipements, fournisseurs de matériaux, entreprises de dispositifs et instituts de recherche.
L'entreprise a organisé un sommet à Singapour avec plus de deux douzaines de dirigeants R&D pour aborder les défis croissants de la consommation d'énergie dans le calcul IA. La stratégie se concentre sur le développement de technologies d'emballage avancées telles que les micro-bumps, les vias à travers le silicium et les interposeurs en silicium pour améliorer la densité d'interconnexion et la bande passante des systèmes de prochaine génération.
Applied Materials hat die Erweiterung ihrer EPIC-Innovationsplattform mit einem neuen Kooperationsmodell angekündigt, das sich auf fortschrittliche Chip-Verpackungstechnologien konzentriert. Die Initiative, bekannt als EPIC Advanced Packaging, zielt darauf ab, die Kommerzialisierung energieeffizienter Rechenlösungen durch Partnerschaften zwischen Geräteherstellern, Materialanbietern, Geräteunternehmen und Forschungsinstituten zu beschleunigen.
Das Unternehmen veranstaltete einen Gipfel in Singapur mit über zwei Dutzend F&E-Leitern, um die steigenden Herausforderungen des Energieverbrauchs im KI-Computing zu besprechen. Die Strategie konzentriert sich auf die Entwicklung fortschrittlicher Verpackungstechnologien wie Mikro-Bumps, durchgängige Siliziumverbindungen und Silizium-Interposers, um die Interkonnektivitätsdichte und die Bandbreite für Systeme der nächsten Generation zu verbessern.
- Strategic expansion into advanced packaging technology development
- Established collaborations with major industry leaders and research institutions
- Positioned to capitalize on growing AI chip packaging market
- None.
Insights
The launch of EPIC Advanced Packaging represents a significant strategic move in the semiconductor industry's evolution toward more efficient AI computing systems. This collaboration model addresses critical industry bottlenecks in advanced packaging, which is becoming essential for next-generation AI chips. The initiative's timing aligns with the industry's urgent need to improve energy efficiency in AI computing systems.
The participation of major industry players like AMD, Intel, TSMC and Samsung signals strong industry buy-in. This collaborative approach could accelerate the development of important technologies like micro-bumps and through-silicon vias (TSVs), potentially reducing time-to-market for advanced chip packages. The focus on Singapore as a hub leverages the region's established semiconductor ecosystem and could strengthen Applied Materials' position in the advanced packaging market.
This initiative positions Applied Materials strategically in the rapidly growing advanced packaging market, which is important for AI chip development. The company's approach to ecosystem collaboration could create significant competitive advantages and potential revenue streams through early access to emerging technologies. The broad participation from across the semiconductor value chain suggests strong market validation.
The focus on energy efficiency in AI computing addresses a critical market need and could drive substantial growth opportunities. With a market cap of
- EPIC Advanced Packaging marks an expansion of Applied’s global innovation platform
- Company convenes top semiconductor R&D leaders to advance high-performance, low-power AI chip packaging technologies
SANTA CLARA, Calif. and SINGAPORE, Nov. 18, 2024 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced plans to expand its global EPIC* innovation platform with a new collaboration model specifically designed to accelerate commercialization of advanced chip packaging technologies. To kick-off the initiative, Applied convened more than two dozen top R&D leaders from the semiconductor industry to encourage alliances between equipment makers, material providers, device companies and research institutes. The goal is to fast-track new technologies for the next generation of energy-efficient computing. Applied hosted the summit in Singapore, where the company has been collaborating on advanced packaging R&D with its customers and partners for over a decade.
The dramatic rise in the number of connected devices and the emergence of AI are creating tremendous growth opportunities for the chip industry. At the same time, the industry is confronting several challenges, foremost of which is the exponential increase in energy consumption fueled by the intense compute power required to support the growth of AI. In response, chipmakers and system designers are increasingly turning to advanced packaging and heterogeneous integration of multiple chips as a way to achieve more energy-efficient system performance.
“Advanced packaging is paramount to the semiconductor roadmap for enabling sustainable progress in the AI era,” said Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials. “Today’s summit unites the leaders from the most innovative organizations to explore collaborative advancements in performance-per-watt through advanced chip packaging. With our global innovation platform and the new EPIC Advanced Packaging strategy, Applied Materials is uniquely positioned to help chipmakers accelerate the journey from concept to commercialization of new technologies.”
Today’s most capable AI chips are enabled by multiple advanced packaging technologies, such as micro-bumps, through-silicon vias (TSVs) and silicon interposers. To tap the true potential of AI, the industry is developing a new set of packaging building blocks to dramatically increase the interconnect density and bandwidth of next-generation systems. The need to develop multiple technologies simultaneously – combined with a faster cadence of product introductions – creates challenges for system designers, who must navigate a complex array of solution paths and packaging architectures. This increased complexity adds additional risk, time and cost to chipmaker roadmaps.
There is a clear need for increased collaboration across this complicated ecosystem, as well as earlier engagement with all parts of the value chain. Applied’s strategy with EPIC Advanced Packaging is to address this need by driving co-innovation and changing the way foundational packaging technologies are developed and commercialized. Leveraging a global network of innovation centers, the strategy aims to give leading chipmakers and system designers early access to next-generation technologies and equipment, while also providing an opportunity for deep collaboration with suppliers and university partners to strengthen the lab-to-fab pipeline and develop future semiconductor talent.
EPIC Advanced Packaging is an expansion of Applied’s global EPIC platform. In May 2023, Applied launched the EPIC Center, currently under construction in Silicon Valley, which is focused on equipment and process technologies for forming transistors and wiring on individual chips. EPIC Advanced Packaging will leverage the R&D work taking place across Applied’s global innovation centers – driving progress in advanced packaging capabilities for connecting multiple chips within a computing system.
Summit Participants
Companies:
Absolics, Advantest, Ajinomoto Fine-Techno Co., AMD, Amkor, BESI, Broadcom, Chipletz, EV Group, Intel, Kioxia, Micron, NXP, Resonac, Samsung, SK hynix, Synopsys, TSMC, Ushio, Western Digital
Institutes and Universities:
A*STAR’s Institute of Microelectronics (IME), Singapore Economic Development Board (EDB), National University of Singapore (NUS), Singapore Institute of Technology (SIT)
*EPIC = Equipment and Process Innovation and Commercialization
Forward-Looking Statements
This press release contains forward-looking statements regarding our future plans and expectations to expand our global EPIC platform, including those relating to anticipated benefits to the semiconductor industry, the development and commercialization of new technologies, engagement across the semiconductor ecosystem, and other statements that are not historical facts. These statements and their underlying assumptions are subject to risks and uncertainties and are not guarantees of future performance. Factors that could cause actual results to differ materially from those expressed or implied by such statements include risks and uncertainties described in our SEC filings, including our recent Forms 10-Q and 8-K. All forward-looking statements are based on management’s current estimates, projections and assumptions, and we assume no obligation to update them.
About Applied Materials
Applied Materials, Inc. (Nasdaq: AMAT) is the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At Applied Materials, our innovations make possible a better future. Learn more at www.appliedmaterials.com.
Editorial Contacts:
Ricky Gradwohl (USA) +1 (408) 235-4676
Farand Ngoh (Singapore) +65 9653 2778
Investor Relations Contact:
Liz Morali +1 (408) 986-7977
FAQ
What is Applied Materials' (AMAT) new EPIC Advanced Packaging initiative?
Why did Applied Materials (AMAT) launch EPIC Advanced Packaging in November 2024?
Which companies are participating in Applied Materials' (AMAT) packaging summit?
