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Applied Materials Inc. develops materials engineering equipment and process technologies used in semiconductor manufacturing and advanced displays. News about AMAT centers on chipmaking systems for atomic-scale deposition, Gate-All-Around logic, DRAM and high-bandwidth memory, 3D advanced packaging, and process control for AI and high-performance computing devices.
Company updates also cover EPIC Center collaborations with chipmakers and ecosystem partners, commercialization pathways from R&D to high-volume manufacturing, quarterly earnings communications, dividend actions, capital allocation, and investor-conference participation.
Applied Materials (AMAT) introduced two chipmaking systems to improve precision processing in deep, narrow 3D logic and memory structures for next-generation AI chips. The Centris Spectral SiN ALD system targets uniform silicon nitride deposition, while Producer Selectra Mo Etch enables selective molybdenum removal for 3D NAND wordline separation.
Both systems are used by leading chipmakers at advanced nodes, aiming to enhance device performance, energy efficiency, yield and manufacturability across GAA transistors, DRAM and high-layer-count 3D NAND applications.
Applied Materials (AMAT) is expanding manufacturing and R&D in Singapore with a new US$500 million Tampines Campus, more than doubling its advanced cleanroom capacity there to support AI chip demand.
The volume-production facility adds AI-enabled automation, advanced sustainability features and is part of a broader strategy that has nearly doubled global manufacturing capacity, including major U.S. investments and a planned US$5 billion EPIC R&D Center.
Applied Materials (NASDAQ: AMAT) declared a quarterly cash dividend of $0.53 per share on its common stock, payable Sept. 10, 2026 to shareholders of record on Aug. 20, 2026.
The company highlights nine consecutive years of dividend increases, a 10-year dividend CAGR of 18%, and extensive capital returns through dividends and share repurchases.
Applied Materials (Nasdaq: AMAT) and SCREEN Semiconductor Solutions formed a new collaboration at Applied’s upcoming EPIC Center in Silicon Valley. The partners will co-develop co-optimized wafer cleaning and materials engineering process solutions to improve yields, performance and time-to-production for next-generation chips at advanced process nodes.
Applied Materials (Nasdaq: AMAT) announced that Broadcom (Nasdaq: AVGO) is joining its EPIC platform as an innovation partner to advance chip packaging for next-generation AI systems. The collaboration will use Applied’s global R&D centers and its new Silicon Valley EPIC Center, expected to be operational in 2026.
Applied Materials (NASDAQ: AMAT) reported record Q2 FY2026 revenue of $7.91 billion, up 11% year over year, with GAAP gross margin of 49.9% and operating margin of 31.9%.
GAAP EPS reached a record $3.51 and non-GAAP EPS $2.86. The company announced new EPIC Center partnerships, an agreement to acquire ASMPT’s NEXX business, raised its quarterly dividend 15% to $0.53 per share, and guided Q3 FY2026 revenue to $8.95 billion ± $0.5 billion with non-GAAP EPS of $3.36 ± $0.20.
Applied Materials (NASDAQ: AMAT) announced that Arizona State University, Rensselaer Polytechnic Institute and Stanford University are joining its Silicon Valley-based EPIC Center as inaugural research partners.
The EPIC (Equipment and Process Innovation and Commercialization) Center, described as the largest-ever U.S. investment in advanced semiconductor equipment R&D, aims to speed lab-to-fab innovation for energy-efficient AI chips. University teams will work with Applied’s scientists on advanced materials, novel processes, devices and chip architectures, gaining access to industry-scale tools and manufacturing-relevant environments. The facility is scheduled to become operational in 2026 and is intended to help develop future semiconductor talent.
Applied Materials (NASDAQ:AMAT) and TSMC formed a new innovation partnership at Applied’s EPIC Center in Silicon Valley to develop materials, equipment and process technologies for next-generation AI-focused semiconductors.
The collaboration targets advanced logic scaling, 3D transistor and interconnect structures, yield and variability improvements, supported by a planned EPIC Center capital spend scaling to about $5 billion.
Applied Materials (NYSE:AMAT) announced management participation in upcoming investor conferences with live audio webcasts and same-day replays.
Sessions: Tim Deane at J.P. Morgan on May 20, 2026 (5:00 a.m. PT / 8:00 a.m. ET); Gary Dickerson at Bernstein on May 28, 2026 (6:00 a.m. PT / 9:00 a.m. ET); Brice Hill at BofA on June 2, 2026 (8:40 a.m. PT / 11:40 a.m. ET). Webcasts at https://ir.appliedmaterials.com.
Applied Materials (NYSE: AMAT) has agreed to acquire ASMPT’s NEXX business to broaden its panel‑level advanced packaging portfolio. The deal adds NEXX’s large‑area electrochemical deposition (ECD) tools and team, targeting panel form factors up to ~510x515 mm to support larger AI accelerator packages.
The transaction is expected to close within several months, is subject to customary closing conditions, requires no regulatory approvals, and will integrate the NEXX team into Applied’s Semiconductor Products Group in Billerica, Massachusetts.