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ACM Research, Inc. (NASDAQ: ACMR) is a leading developer, manufacturer, and marketer of single-wafer wet cleaning equipment. Founded in 1998 and headquartered in Fremont, California, ACM Research aims to enhance the manufacturing process and yield for integrated chips, offering a range of advanced wafer processing solutions.
Under its flagship ULTRA C brand, the company provides innovative technologies like Space Alternated Phase Shift and Timely Energized Bubble Oscillation. These solutions are crucial for removing particles, contaminants, and defects from flat and patterned wafer surfaces at a microscopic level. The company's product portfolio also includes electro-chemical plating equipment used for advanced metal plating in back-end assembly and packaging processes.
ACM Research sells its products worldwide through a combination of direct sales and third-party representatives. The company has shown impressive growth, with recent financial results indicating a 26% revenue increase to $168.6 million for the third quarter of 2023. This growth is attributed to mature node investments by mainland China-based customers and a strong multi-product portfolio. Their gross margin has also improved, reaching 52.5% for the same quarter.
The company continues to expand its market reach with new products and significant partnerships. Recently, ACM Research introduced the ULTRA C v Vacuum Cleaning Tool to meet flux removal requirements for advanced 3D packaging structures and received orders from major manufacturers in the U.S. and China. Additionally, the company's operating subsidiary in Shanghai paid a substantial dividend to its shareholders and appointed Ernst & Young Hua Ming LLP as its auditor for 2023.
Looking ahead, ACM Research has updated its revenue guidance for 2023 to a range of $520 million to $540 million, reflecting its strong market position and strategic advancements. The company is also investing in its global operations, including increased efforts in Korea, which are expected to yield better traction with local customers and accelerate product development.
ACM Research (NASDAQ: ACMR) reported strong Q3 2024 results with record revenue of $204 million, up 21% year-over-year. The company achieved a gross margin of 51.4% and diluted EPS of $0.45. Total shipments reached $261 million, up 23% from Q3 2023. ACM has raised its fiscal year 2024 revenue guidance to $725-745 million from the previous $695-735 million range. The company's Ultra C Tahoe cleaning tool achieved a major breakthrough, now matching single-wafer cleaning tool performance while reducing chemical consumption by up to 75%. ACM also expanded its U.S. presence with a new Oregon facility purchase and opened a new R&D facility in Lingang, China.
ACM Research announced significant improvements to its Ultra C Tahoe Cleaning tool for semiconductor manufacturing. The enhanced system combines batch wafer processing and single wafer cleaning chambers, achieving performance comparable to standalone tools while reducing chemical consumption by up to 75%. The upgrade delivers cost savings up to $500,000 annually from sulfuric acid alone. The tool now features a 25-slot bench module and nine single-wafer chambers, achieving throughput exceeding 200 wafers per hour. Currently in production at several facilities in mainland China, the system achieves average particle counts below 6 at 26nm, meeting advanced node manufacturing requirements.
ACM Research (NASDAQ: ACMR) released preliminary unaudited Q3 2024 results, projecting revenue between $200 million to $203 million, representing a 19-20% year-over-year growth. Total shipments are expected to range from $245 million to $255 million, showing a 15-19% year-over-year increase. The company owns 82.0% of ACM Shanghai, which contributes the majority of consolidated revenue and net income. Full financial results will be discussed during the earnings call on November 7, 2024.
ACM Research (NASDAQ: ACMR) has announced its schedule for releasing third quarter 2024 financial results. The company will disclose its preliminary revenue range on October 30, 2024, before the U.S. market opens, coinciding with the reporting obligations of its subsidiary, ACM Research (Shanghai), to the Shanghai Stock Exchange. Full financial results will be released on November 7, 2024, also before the U.S. market opens.
A conference call to discuss the results is scheduled for 8:00 a.m. U.S. Eastern Time (9:00 p.m. China Time) on November 7. Participants can join via telephone by pre-registering through an online link, which will provide dial-in information and a PIN for access. Alternatively, a live webcast will be available on the Investors section of ACM's website.
ACM Research, Inc. (NASDAQ: ACMR) announced that its subsidiary ACM Research (Shanghai) posted backlog figures on the Shanghai Stock Exchange website. As of September 30, 2024, ACM Shanghai's total backlog was RMB 6,764.6 million (USD $964.8 million), compared to RMB 6,795.8 million on September 27, 2023, representing a slight year-over-year decrease of 0.46%.
The backlog includes orders for shipped tools not yet recognized as revenue under Chinese GAAP and orders for future shipments. ACM Shanghai will release its full financial results for the nine months ended September 30, 2024, on October 30, 2024, while ACM will report preliminary results on the same day. Full Q3 2024 financial results and a conference call are scheduled for early November 2024.
ACM Research (NASDAQ: ACMR) has received orders for four wafer-level packaging tools from U.S.-based entities. Two tools were ordered by a U.S. customer and two by a U.S. R&D center. These tools support advanced packaging processes like coating, developing, wet etching, and scrubbing. Delivery is scheduled for the first half of 2025. The customer's orders are for first tools subject to technical qualification, potentially leading to follow-on production orders. The R&D center's orders aim to advance wafer-level packaging research and showcase ACM's capabilities to prospective customers. Dr. David Wang, ACM's CEO, views these orders as demonstrating the company's broad range of advanced tools and growing traction with U.S.-based customers.
ACM Research (NASDAQ: ACMR) has launched the Ultra C bev-p panel bevel etching tool for fan-out panel-level packaging (FOPLP) applications. This innovative system is designed for double-sided bevel etching and cleaning in copper-related processes, enhancing efficiency and reliability. The tool can handle panel sizes from 510 mm x 515 mm to 600 mm x 600 mm, with thicknesses of 0.5 mm to 3 mm and warpages up to 10 mm.
Key features include advanced panel handling, efficient copper removal using diluted sulfuric acid and peroxide, and high throughput of 40 panels per hour. The Ultra C bev-p offers bevel control accuracy of ±0.2 mm and an exclusive control range of 0-20 mm. With a mean time between failures of 500 hours and 95% uptime, it ensures exceptional reliability and consistent performance for high-volume production.
ACM Research (NASDAQ: ACMR) reported strong Q2 2024 results, with record revenue of $202.5 million, up 40% year-over-year. The company achieved a gross margin of 47.8% and diluted EPS of $0.35. ACM introduced new products, including a Panel Electrochemical Plating tool for fan-out panel-level packaging. The company raised its 2024 revenue outlook to $695-$735 million and increased its long-term revenue target to $3 billion. ACM also announced plans to purchase a R&D facility with a clean room in Oregon to expand its U.S. footprint.
ACM Research (NASDAQ: ACMR) has launched the Ultra ECP ap-p tool for fan-out panel-level packaging (FOPLP). This innovative system employs horizontal plating for exceptional uniformity across panels, supporting sizes up to 600mm x 600mm. The tool is designed for advanced packaging with sub-micron features, particularly suitable for GPUs and high-density high bandwidth memory (HBM).
Key features include:
- Compatibility with organic and glass substrates
- Capabilities for Cu via filling, Cu pillar, Ni, SnAg plating, and solder bumping
- Proprietary technology for consistent plating across panels
- Advanced automation for efficiency and quality control
ACM believes FOPLP offers substantial growth prospects in meeting demands for low latency, high bandwidth, and cost-efficiency in semiconductor chips.
ACM Research, Inc. (NASDAQ: ACMR) has appointed Howard Chen as General Counsel and Vice President of Corporate Strategy, effective July 1, 2024. Chen, a leading high-tech legal practitioner with over 25 years of experience, brings valuable legal knowledge and industry insight to ACM. Previously, he served as Co-Chair of the China Practice at Greenberg Traurig and has represented numerous global technology companies with significant operations in Asia.
ACM's CEO, Dr. David Wang, expressed confidence that Chen's leadership will enhance the company's legal strategies and IP portfolio, supporting its mission to become a key supplier in the global semiconductor industry. Chen's career began with an engineering role at AMD, and he has since made significant contributions to technology firms globally. His accolades include being named one of the 'Best Lawyers in America' and 'IP Stars'.
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