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TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD VP Bor-Zen Tien reported updated holdings and an early redemption of a derivative note. The filing shows indirect ownership of 53 Common Shares by an immediate family member and 101 Common Shares held through an Employee Stock Purchase Plan trust, plus direct holdings of 9,051 Common Shares and 70 American Depositary Shares.
The Equity Linked Notes, with a principal amount of US$20,000 and referencing a basket that includes the company’s American Depositary Shares, were redeemed early for cash on April 24, 2026, before their June 3, 2026 exercisable/expiration date. No open-market share purchases or sales are reported.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD VP Bor-Zen Tien reported updated holdings and an early redemption of a derivative note. The filing shows indirect ownership of 53 Common Shares by an immediate family member and 101 Common Shares held through an Employee Stock Purchase Plan trust, plus direct holdings of 9,051 Common Shares and 70 American Depositary Shares.
The Equity Linked Notes, with a principal amount of US$20,000 and referencing a basket that includes the company’s American Depositary Shares, were redeemed early for cash on April 24, 2026, before their June 3, 2026 exercisable/expiration date. No open-market share purchases or sales are reported.
Taiwan Semiconductor Manufacturing Company Limited reports routine corporate updates for March 2026, including changes in insider shareholdings and a new unsecured bond issuance. Senior leaders such as Chairman & CEO C.C. Wei increased their TSMC shareholdings; his position rose from 7,917,270 to 8,152,610 shares, an increase of 235,340 shares. Several executive vice presidents and vice presidents also recorded modest share increases.
TSMC issued unsecured corporate bonds under Issuance 115-1 totaling NT$17.2 billion, split into a NT$12.6 billion tranche due March 2031 with a 1.72% coupon and a NT$4.6 billion tranche due March 2036 with a 1.78% coupon. The bonds use bullet repayment with interest payable annually. The company did not cancel any common shares during the month.
Taiwan Semiconductor Manufacturing Company Limited reports routine corporate updates for March 2026, including changes in insider shareholdings and a new unsecured bond issuance. Senior leaders such as Chairman & CEO C.C. Wei increased their TSMC shareholdings; his position rose from 7,917,270 to 8,152,610 shares, an increase of 235,340 shares. Several executive vice presidents and vice presidents also recorded modest share increases.
TSMC issued unsecured corporate bonds under Issuance 115-1 totaling NT$17.2 billion, split into a NT$12.6 billion tranche due March 2031 with a 1.72% coupon and a NT$4.6 billion tranche due March 2036 with a 1.78% coupon. The bonds use bullet repayment with interest payable annually. The company did not cancel any common shares during the month.
Taiwan Semiconductor Manufacturing Company Limited submitted a Form 6-K describing a Board decision to revise the agenda for its 2026 Annual Shareholders’ Meeting. Report items will cover 2025 business results, the Audit and Risk Committee’s review, earnings distribution, directors’ compensation, employees’ profit sharing bonuses, and issuance of unsecured corporate bonds.
Proposed resolutions now include accepting the 2025 Business Report and Financial Statements and newly added items to revise the Articles of Incorporation and to revise the Procedures for Acquisition or Disposal of Assets.
Taiwan Semiconductor Manufacturing Company Limited submitted a Form 6-K describing a Board decision to revise the agenda for its 2026 Annual Shareholders’ Meeting. Report items will cover 2025 business results, the Audit and Risk Committee’s review, earnings distribution, directors’ compensation, employees’ profit sharing bonuses, and issuance of unsecured corporate bonds.
Proposed resolutions now include accepting the 2025 Business Report and Financial Statements and newly added items to revise the Articles of Incorporation and to revise the Procedures for Acquisition or Disposal of Assets.
Taiwan Semiconductor Manufacturing Company Limited (TSMC) explains how its 2025 results differ under Taiwan-IFRSs and IFRSs issued by the IASB. Under Taiwan-IFRSs, TSMC reported net income attributable to shareholders of NT$1,717,883 million and basic earnings per share of NT$$66.26 in 2025.
For its Form 20-F, prepared under IFRSs issued by the IASB, TSMC reported net income attributable to shareholders of NT$1,697,604 million and basic and diluted earnings per share of NT65.47 in 2025. The company states that the main difference arises from the timing of recognition of R.O.C. tax on unappropriated earnings.
Taiwan Semiconductor Manufacturing Company Limited (TSMC) explains how its 2025 results differ under Taiwan-IFRSs and IFRSs issued by the IASB. Under Taiwan-IFRSs, TSMC reported net income attributable to shareholders of NT$1,717,883 million and basic earnings per share of NT$$66.26 in 2025.
For its Form 20-F, prepared under IFRSs issued by the IASB, TSMC reported net income attributable to shareholders of NT$1,697,604 million and basic and diluted earnings per share of NT65.47 in 2025. The company states that the main difference arises from the timing of recognition of R.O.C. tax on unappropriated earnings.
Taiwan Semiconductor Manufacturing Company (TSMC) reported very strong first quarter 2026 results. Revenue reached NT$1,134.10 billion (US$35.90 billion), up 35.1% year-over-year, while net income rose 58.3% to NT$572.48 billion and diluted EPS was NT$22.08.
Profitability was very high, with gross margin of 66.2%, operating margin of 58.1%, and net profit margin of 50.5%. Advanced technologies at 7-nanometer and below generated 74% of wafer revenue, led by 5-nanometer at 36% and 3-nanometer at 25%.
Management expects second quarter 2026 revenue between US$39.0 billion and US$40.2 billion, with gross margin of 65.5%–67.5% and operating margin of 56.5%–58.5%. They also expect 2026 revenue to increase by above 30% in US dollar terms, reflecting continued strong demand for leading-edge process technologies.
Taiwan Semiconductor Manufacturing Company (TSMC) reported very strong first quarter 2026 results. Revenue reached NT$1,134.10 billion (US$35.90 billion), up 35.1% year-over-year, while net income rose 58.3% to NT$572.48 billion and diluted EPS was NT$22.08.
Profitability was very high, with gross margin of 66.2%, operating margin of 58.1%, and net profit margin of 50.5%. Advanced technologies at 7-nanometer and below generated 74% of wafer revenue, led by 5-nanometer at 36% and 3-nanometer at 25%.
Management expects second quarter 2026 revenue between US$39.0 billion and US$40.2 billion, with gross margin of 65.5%–67.5% and operating margin of 56.5%–58.5%. They also expect 2026 revenue to increase by above 30% in US dollar terms, reflecting continued strong demand for leading-edge process technologies.
Taiwan Semiconductor Manufacturing Company Limited (TSMC) files its annual Form 20‑F describing strong 2025 growth, rising global risks, and major capacity investments. Net revenue reached NT$3,809,054 million, up from NT$2,894,308 million in 2024, led by High Performance Computing and smartphone demand.
High Performance Computing generated NT$2,192,931 million, or 58% of revenue, while smartphones contributed 29%. North America accounted for 75% of net revenue. TSMC’s annual capacity exceeded 17 million 12‑inch equivalent wafers, supported by advanced 3‑nanometer and 2‑nanometer nodes and new fabs in the U.S., Japan and Germany.
The report highlights extensive geopolitical, trade, export‑control, cybersecurity, environmental and supply‑chain risks, as well as customer concentration and utility constraints. Capital expenditures reached NT$1,272,411 million in 2025, with 2026 capex planned at US$52–56 billion focused on 2‑nanometer and 3‑nanometer capacity, specialty technologies and advanced packaging.
Taiwan Semiconductor Manufacturing Company Limited (TSMC) files its annual Form 20‑F describing strong 2025 growth, rising global risks, and major capacity investments. Net revenue reached NT$3,809,054 million, up from NT$2,894,308 million in 2024, led by High Performance Computing and smartphone demand.
High Performance Computing generated NT$2,192,931 million, or 58% of revenue, while smartphones contributed 29%. North America accounted for 75% of net revenue. TSMC’s annual capacity exceeded 17 million 12‑inch equivalent wafers, supported by advanced 3‑nanometer and 2‑nanometer nodes and new fabs in the U.S., Japan and Germany.
The report highlights extensive geopolitical, trade, export‑control, cybersecurity, environmental and supply‑chain risks, as well as customer concentration and utility constraints. Capital expenditures reached NT$1,272,411 million in 2025, with 2026 capex planned at US$52–56 billion focused on 2‑nanometer and 3‑nanometer capacity, specialty technologies and advanced packaging.
Taiwan Semiconductor Manufacturing Co. (TSM) vice president Yoo Chue-San reported a small open-market purchase of common shares through the company’s Employee Stock Purchase Plan. On the transaction date, 65 common shares (2330.TW) were bought at $57.87 per share by the ESPP administrator on the filer’s behalf under predetermined plan terms.
Following this transaction, indirect holdings through the ESPP trust totaled 6,431 shares1,797,614 common shares
Taiwan Semiconductor Manufacturing Co. (TSM) vice president Yoo Chue-San reported a small open-market purchase of common shares through the company’s Employee Stock Purchase Plan. On the transaction date, 65 common shares (2330.TW) were bought at $57.87 per share by the ESPP administrator on the filer’s behalf under predetermined plan terms.
Following this transaction, indirect holdings through the ESPP trust totaled 6,431 shares1,797,614 common shares
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD vice president Lipen Yuan reported an open-market purchase of 52 Common Shares (2330.TW) at $57.87 per share. The shares were bought in U.S. dollar terms by the administrator of the company’s Employee Stock Purchase Plan under predetermined terms.
After this transaction, 1,092 shares are held indirectly through the ESPP trust, 3,000 shares are held directly, and 1,650 shares are held indirectly by the spouse, giving a clearer picture of Yuan’s combined economic exposure to TSM common shares.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD vice president Lipen Yuan reported an open-market purchase of 52 Common Shares (2330.TW) at $57.87 per share. The shares were bought in U.S. dollar terms by the administrator of the company’s Employee Stock Purchase Plan under predetermined terms.
After this transaction, 1,092 shares are held indirectly through the ESPP trust, 3,000 shares are held directly, and 1,650 shares are held indirectly by the spouse, giving a clearer picture of Yuan’s combined economic exposure to TSM common shares.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD senior executive Kevin Xiaoqiang Zhang reported a small open-market purchase of additional shares. On April 9, 2026, an ESPP trust bought 79 Common Shares (2330.TW) for him at $57.87 per share, under predetermined Employee Stock Purchase Plan terms.
After this trade, he indirectly holds 7,034 Common Shares via the ESPP trust and 20,190 Common Shares through a Long-Term Incentive trust, and directly holds 329,663 Common Shares plus 2,500 American Depositary Shares, each ADS representing five Common Shares.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD senior executive Kevin Xiaoqiang Zhang reported a small open-market purchase of additional shares. On April 9, 2026, an ESPP trust bought 79 Common Shares (2330.TW) for him at $57.87 per share, under predetermined Employee Stock Purchase Plan terms.
After this trade, he indirectly holds 7,034 Common Shares via the ESPP trust and 20,190 Common Shares through a Long-Term Incentive trust, and directly holds 329,663 Common Shares plus 2,500 American Depositary Shares, each ADS representing five Common Shares.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD VP Bor-Zen Tien reported open-market purchases of 62 Common Shares (2330.TW) at an average price of $57.87 per share. The shares were bought indirectly, 53 through the company’s Employee Stock Purchase Plan (ESPP) trust and 9 for an immediate family member who is a TSMC employee.
After these transactions, disclosed holdings include 9,051 Common Shares held directly, 101 Common Shares held via the ESPP trust, and 53 Common Shares held for the immediate family member. Tien also holds Equity Linked Notes with a principal amount of $20,000 referencing a basket that includes up to 71 TSM American Depositary Shares, with a strike price of $278.8973 per ADS and an expiration on June 3, 2026. Each ADS represents five Common Shares.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD VP Bor-Zen Tien reported open-market purchases of 62 Common Shares (2330.TW) at an average price of $57.87 per share. The shares were bought indirectly, 53 through the company’s Employee Stock Purchase Plan (ESPP) trust and 9 for an immediate family member who is a TSMC employee.
After these transactions, disclosed holdings include 9,051 Common Shares held directly, 101 Common Shares held via the ESPP trust, and 53 Common Shares held for the immediate family member. Tien also holds Equity Linked Notes with a principal amount of $20,000 referencing a basket that includes up to 71 TSM American Depositary Shares, with a strike price of $278.8973 per ADS and an expiration on June 3, 2026. Each ADS represents five Common Shares.