Valens Semiconductor's VA7000 and VS6320 Chipsets Power New Innovations in the Industrial Machine Vision Market
Valens Semiconductor (NYSE: VLN) has announced the integration of its VA7000 and VS6320 chipsets into cutting-edge machine vision products from various companies. This marks Valens' initial penetration into a $460 million Total Addressable Market by 2029. The machine vision market is expected to reach $7.8B by 2029, driven by factory and warehouse automation growth.
The VA7000 chipset, compliant with the MIPI A-PHY standard, offers high-performance sensor connectivity, while the VS6320 provides USB 3.2 extension capabilities. These chipsets are powering products by Teledyne e2v, Airy3D, FRAMOS, D3 Embedded, and Leopard Imaging, among others.
Valens' chipsets enable advanced machine vision solutions, offering benefits such as reduced power, size, and cost of cameras, as well as extended link distances for USB-based industrial cameras. The company will showcase these solutions at the VISION event in Stuttgart, on October 8-10, 2024.
Valens Semiconductor (NYSE: VLN) ha annunciato l'integrazione dei suoi chipset VA7000 e VS6320 in prodotti avanzati di visione artificiale di varie aziende. Questo segna l'ingresso iniziale di Valens in un Mercato Totale Indirizzabile di $460 milioni entro il 2029. Si prevede che il mercato della visione artificiale raggiunga $7.8 miliardi entro il 2029, trainato dalla crescita dell'automazione di fabbrica e magazzino.
Il chipset VA7000, conforme allo standard MIPI A-PHY, offre connettività per sensori ad alte prestazioni, mentre il VS6320 fornisce capacità di estensione per USB 3.2. Questi chipset alimentano i prodotti di Teledyne e2v, Airy3D, FRAMOS, D3 Embedded e Leopard Imaging, tra gli altri.
I chipset di Valens abilitano soluzioni avanzate di visione artificiale, offrendo vantaggi come riduzione della potenza, delle dimensioni e dei costi delle telecamere, oltre a distanze di collegamento estese per telecamere industriali basate su USB. L'azienda presenterà queste soluzioni all'evento VISION a Stoccarda, dall'8 al 10 ottobre 2024.
Valens Semiconductor (NYSE: VLN) ha anunciado la integración de sus chipsets VA7000 y VS6320 en productos de visión artificial de vanguardia de varias empresas. Esto marca la entrada inicial de Valens en un Mercado Total Dirigible de $460 millones para 2029. Se espera que el mercado de visión artificial alcance $7.8 mil millones para 2029, impulsado por el crecimiento de la automatización en fábricas y almacenes.
El chipset VA7000, conforme al estándar MIPI A-PHY, ofrece conectividad de sensor de alto rendimiento, mientras que el VS6320 proporciona capacidades de extensión USB 3.2. Estos chipsets están impulsando productos de Teledyne e2v, Airy3D, FRAMOS, D3 Embedded y Leopard Imaging, entre otros.
Los chipsets de Valens permiten soluciones avanzadas de visión artificial, ofreciendo beneficios como reducción de potencia, tamaño y costo de las cámaras, así como distancias de enlace extendidas para cámaras industriales basadas en USB. La compañía mostrará estas soluciones en el evento VISION en Stuttgart, del 8 al 10 de octubre de 2024.
Valens Semiconductor (NYSE: VLN)은 다양한 회사의 최첨단 머신 비전 제품에 VA7000 및 VS6320 칩셋을 통합했다고 발표했습니다. 이는 Valens가 2029년까지 4억 6천만 달러의 총 주소able 시장에 처음 진입한 것을 나타냅니다. 머신 비전 시장은 공장과 창고 자동화의 성장에 힘입어 2029년까지 78억 달러에 이를 것으로 예상됩니다.
VA7000 칩셋은 MIPI A-PHY 표준을 준수하며 고성능 센서 연결을 제공하고, VS6320은 USB 3.2 확장 기능을 제공합니다. 이 칩셋은 Teledyne e2v, Airy3D, FRAMOS, D3 Embedded 및 Leopard Imaging 등 여러 제품에 전력을 공급하고 있습니다.
Valens의 칩셋은 고급 머신 비전 솔루션을 가능하게 하며, 카메라의 전력 소비, 크기 및 비용 절감과 USB 기반 산업 카메라를 위한 연장 링크 거리의 이점을 제공합니다. 회사는 2024년 10월 8일부터 10일까지 뮌헨에서 열리는 VISION 행사에서 이러한 솔루션을 선보일 예정입니다.
Valens Semiconductor (NYSE: VLN) a annoncé l'intégration de ses puces VA7000 et VS6320 dans des produits de vision machine de pointe provenant de diverses entreprises. Cela marque la première pénétration de Valens dans un marché total adressable de 460 millions de dollars d'ici 2029. Le marché de la vision machine devrait atteindre 7,8 milliards de dollars d'ici 2029, soutenu par la croissance de l'automatisation des usines et des entrepôts.
Le puce VA7000, conforme à la norme MIPI A-PHY, offre une connectivité de capteur haute performance, tandis que le VS6320 fournit des capacités d'extension USB 3.2. Ces puces alimentent des produits de Teledyne e2v, Airy3D, FRAMOS, D3 Embedded et Leopard Imaging, parmi d'autres.
Les chipsets de Valens permettent des solutions avancées de vision machine, offrant des avantages tels que une réduction de la consommation d'énergie, de la taille et du coût des caméras, ainsi que des distances de liaison étendues pour les caméras industrielles basées sur USB. L'entreprise présentera ces solutions lors de l'événement VISION à Stuttgart, du 8 au 10 octobre 2024.
Valens Semiconductor (NYSE: VLN) hat die Integration seiner VA7000 und VS6320 Chipsets in modernste Maschinenvisionsprodukte verschiedener Unternehmen bekannt gegeben. Dies markiert den ersten Eintritt von Valens in einen Gesamtadressierbaren Markt von 460 Millionen Dollar bis 2029. Der Maschinenvisionsmarkt wird voraussichtlich bis 2029 7,8 Milliarden Dollar erreichen, angetrieben durch das Wachstum der Automatisierung in Fabriken und Lagerhäusern.
Der VA7000 Chipset, der dem MIPI A-PHY Standard entspricht, bietet Hochleistungs-Sensorkonnektivität, während der VS6320 USB 3.2 Erweiterungsmöglichkeiten bietet. Diese Chipsets treiben die Produkte von Teledyne e2v, Airy3D, FRAMOS, D3 Embedded und Leopard Imaging und anderen an.
Die Chipsets von Valens ermöglichen fortschrittliche Maschinenvisionslösungen und bieten Vorteile wie reduzierte Energie, Größe und Kosten von Kameras, sowie erweiterte Verbindungsdistanzen für USB-basierte Industriekameras. Das Unternehmen wird diese Lösungen auf der VISION-Veranstaltung in Stuttgart vom 8. bis 10. Oktober 2024 präsentieren.
- Valens Semiconductor is entering a $460 million Total Addressable Market in machine vision by 2029
- The machine vision market is projected to reach $7.8B by 2029
- VA7000 and VS6320 chipsets are being integrated into products by leading companies in the industry
- Valens' chipsets enable reduced power, size, and cost of cameras for machine vision applications
- The company's technology extends link distances for USB-based industrial cameras
- None.
Insights
Valens Semiconductor's entry into the industrial machine vision market with its VA7000 and VS6320 chipsets marks a significant technological advancement. The VA7000, compliant with the MIPI A-PHY standard, offers automotive-grade connectivity that can reduce the power, size and cost of cameras - important factors in machine vision applications. The VS6320, as the first ASIC-based USB 3.2 extension solution, addresses the short link distance limitation of USB-based industrial cameras.
The integration of these chipsets by leading manufacturers like Teledyne e2v, Airy3D and FRAMOS demonstrates industry recognition of Valens' technology. Particularly noteworthy is the chipsets' ability to enable long-distance, high-bandwidth connectivity over simple, unshielded cables while maintaining robust EMC performance. This solves a critical challenge in industrial settings where vision processing units are often distant from camera modules.
With the machine vision market projected to reach
Valens Semiconductor's strategic move into the industrial machine vision market presents a compelling growth opportunity. With a projected Total Addressable Market of
The partnerships with established players like Teledyne e2v and emerging innovators such as Airy3D and D3 Embedded provide Valens with diverse channels to penetrate the market. These collaborations not only validate the technology but also accelerate market adoption. The cross-industry applicability of Valens' chipsets - from industrial automation to automotive - diversifies risk and expands potential revenue sources.
Investors should monitor Valens' ability to convert these partnerships into tangible sales growth and market share gains. The company's success in this venture could potentially lead to a re-evaluation of its market valuation, especially if it can demonstrate a clear path to profitability in this new market segment.
Integration of recently launched Valens chipsets into cutting-edge machine vision products from Teledyne e2v, Airy3D, FRAMOS, D3 Embedded, Leopard Imaging, and other companies, marks Valens' initial penetration into a
HOD HASHARON,
Based on a variety of market research, the machine vision market is set to reach
"Machine vision is rising across a number of industries, and Valens is well positioned to capture a significant market share with two of our most innovative chips – the VA7000 and the VS6320," said Gabi Shriki, SVP, Head of Audio-Video Business at Valens Semiconductor. "We look forward to seeing our chipsets enabling advanced machine vision solutions through our growing partnerships in this industry."
Both the VS6320 and VA7000 provide significant value for vision applications in the industrial market. Designed initially for automotive, the VA7000 chipset is the first to comply with the MIPI A-PHY standard for high-performance sensor connectivity. A-PHY's unique design provides automotive-grade, high-performance connectivity and enables customers to reduce the power, size, and cost of cameras – which are all essential for machine vision applications. The VS6320 is the first ASIC-based USB 3.2 high performance extension solution on the market. Using the VS6320 chipset removes the key limitation of USB-based industrial cameras – their short link distance – while maintaining all of their advantages.
Valens has engaged with leading camera module manufacturers in industrial machine vision, and its chipsets are powering cutting-edge products by Teledyne e2v, Airy3D, FRAMOS, D3 Embedded, Leopard Imaging, and other companies.
Teledyne e2v supports MIPI A-PHY for its Optimom™ range of turnkey imaging modules. This option paves the way for their use in specific MIPI applications where the vision processing unit is some distance away from the module.
"Our Optimom modules are widely used across multiple industries, and the latest Optimom™ 5D is a groundbreaking solution that offers both 2D and 3D vision simultaneously," said François Trolez, Marketing Manager, at Teledyne e2v. "Valens is providing a state-of-the-art long-distance MIPI connection, using simple, unshielded cabling. We included A-PHY as an option because of its flawless EMC performance, as well as its recognition as an industry standard. This will ensure the reliability of the vision data, offering an exciting proposition for our robotic and AMR focused customers and partners."
The new Optimom 5D module features Teledyne e2v's Topaz5D™ image sensor and offers both 2D vision and 3D depth data outputs. This unique 5D technology is enabled by IPs and software from Airy3D.
"Airy3D's DepthIQ single-sensor IP enables machine-vision applications to be realised where traditional short-range stereo and time of flight products fall short," said Ron Low, Sr VP Business Development and Marketing. "Partnering with both Teledyne e2v and Valens Semiconductor, our combined solutions allow for challenges such as occlusions, changing light conditions and long reach latency to be overcome which is an exciting development for the machine-vision industry going forwards."
FRAMOS, the leading global expert in embedded vision systems, has added A-PHY sensor module support to its popular FSM and FSM:GO ecosystem of optical image sensor modules, allowing for high bandwidth, link distance and cable flexibility.
"At FRAMOS, we take pride in providing our customers with the most advanced technologies on the market, bringing the best possible image into the memory of the customer's solution," said André Brela, Product Manager at FRAMOS. "We've invested in collaborating with Valens making the adopter module option with the VA7000 A-PHY chipset available to our joint customers because of the demand we see in the market for standardized long-reach CSI-2 extension, along with the innovations enabled by this technology, including cable length, EMC performance, and advanced link diagnostics."
D3 Embedded, a company specializing in embedded AI imaging solutions, is integrating the VA7000 chipsets into its camera modules, allowing for longer link distances and the use of simple, flexible cabling.
"We were impressed by Valens' ability to do multi-gig link speeds over unshielded cables and connectors," said Scott Reardon, CEO at D3 Embedded. "This is something our customers in the Industrial Vehicles and Robotics market have been looking for and it will open the door to more optimized embedded vision solutions. We're happy to be working with Valens to put this innovative product in front of our customers and partners."
Leopard Imaging, an established supplier of high-performance machine vision cameras, is offering an A-PHY camera module tailored for industrial applications.
"We're familiar with the technological advantages that Valens' A-PHY chipsets bring through our automotive module offering," said Cliff Cheng, SVP of Marketing at Leopard Imaging. "A-PHY solves issues we've had in providing high bandwidth, long distance connectivity will ensuring robust EMC immunity. We look forward to seeing these camera modules powering innovative, cross-market solutions."
The Valens' VA7000-based solutions by Teledyne e2v, Airy3D, FRAMOS, D3 Embedded and Leopard Imaging, as well as the Valens VS6320, will be showcased at the Valens booth (10F80) at VISION in
About Valens Semiconductor
Valens Semiconductor (NYSE:VLN) is a leader in high-performance connectivity, enabling customers to transform the digital experiences of people worldwide. Valens' chipsets are integrated into countless devices from leading customers, powering state-of-the-art audio-video installations, next-generation videoconferencing, and enabling the evolution of ADAS and autonomous driving. Pushing the boundaries of connectivity, Valens sets the standard everywhere it operates, and its technology forms the basis for the leading industry standards such as HDBaseT® and MIPI A-PHY. For more information, visit https://www.valens.com/.
Forward-Looking Statements
This press release includes "forward-looking statements" within the meaning of the "safe harbor" provisions of the United States Private Securities Litigation Reform Act of 1995. Forward-looking statements may be identified by the use of words such as "estimate," "plan," "project," "forecast," "intend," "will," "expect," "anticipate," "believe," "seek," "target" or other similar expressions that predict or indicate future events or trends or that are not statements of historical matters. These forward-looking statements include, but are not limited to, statements regarding our anticipated future results, including financial results, currency exchange rates, and contract wins, and future economic and market conditions. These statements are based on various assumptions, whether or not identified in this press release, and on the current expectations of Valens Semiconductor's ("Valens") management and are not predictions of actual performance. These forward-looking statements are provided for illustrative purposes only and are not intended to serve as and must not be relied on by any investor as, a guarantee, an assurance, a prediction or a definitive statement of fact or probability. Actual events and circumstances are difficult or impossible to predict and will differ from assumptions. Many actual events and circumstances are beyond the control of Valens Semiconductor. These forward-looking statements are subject to a number of risks and uncertainties, including the cyclicality of the semiconductor industry; the effect of inflation and a rising interest rate environment on our customers and industry; the ability of our customers to absorb inventory; the impact of the global pandemic caused by COVID-19 on our customers' budgets and on economic conditions generally, as well as the length, severity of and pace of recovery following the pandemic; competition in the semiconductor industry, and the failure to introduce new technologies and products in a timely manner to compete successfully against competitors; if Valens fails to adjust its supply chain volume due to changing market conditions or fails to estimate its customers' demand; disruptions in relationships with any one of Valens' key customers; any difficulty selling Valens' products if customers do not design its products into their product offerings; Valens' dependence on winning selection processes; even if Valens succeeds in winning selection processes for its products, Valens may not generate timely or sufficient net sales or margins from those wins; sustained yield problems or other delays in the manufacturing process of products; our ability to effectively manage, invest in, grow, and retain our sales force, research and development capabilities, marketing team and other key personnel; our ability to timely adjust product prices to customers following price increase by the supply chain; our ability to adjust our inventory level due to reduction in demand due to inventory buffers accrued by customers; our expectations regarding the outcome of any future litigation in which we are named as a party; our ability to adequately protect and defend our intellectual property and other proprietary rights; the market price and trading volume of the Valens ordinary shares may be volatile and could decline significantly; political, economic, governmental and tax consequences associated with our incorporation and location in
Press Contacts
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Valens Semiconductor Ltd.
Yoni.dayan@valens.com
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Senior Vice President
Financial Profiles, Inc.
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Investor Contacts
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Valens Semiconductor
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FAQ
What are the key Valens Semiconductor chipsets mentioned in the press release for machine vision?
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