UMC Files Form 20-F for 2021 with US Securities and Exchange Commission
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United Microelectronics Corporation (NYSE: UMC) has filed its 2021 annual report on Form 20-F with the US Securities and Exchange Commission. The report highlights UMC's role as a leading semiconductor foundry, providing high-quality IC production with a focus on logic and specialty technologies. UMC operates 12 fabs across Asia, with a maximum capacity of approximately 800,000 8-inch equivalent wafers per month and employs around 20,000 people globally. Shareholders can request a hard copy of the report at no cost via UMC's Investor Relations.
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Filed 2021 annual report on Form 20-F with the SEC, ensuring transparency.
UMC operates 12 fabs in Asia with a substantial manufacturing capacity of 800,000 wafers per month.
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TAIPEI, Taiwan--(BUSINESS WIRE)--
United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), today filed its 2021 annual report on Form 20-F with the US Securities and Exchange Commission. The report is available at https://www.umc.com/en/Download/annual_reports
Shareholders may request a hard copy of the Form 20-F free of charge. Please contact UMC-IR at ir@umc.com.
About UMC
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry. The company provides high quality IC production with a focus on both logic and specialty technologies to serve every major sector of the electronics industry. UMC’s comprehensive technology and manufacturing solutions include logic/RF, embedded high voltage, embedded flash, RFSOI/BCD and IATF-16949 automotive manufacturing certification for all its manufacturing facilities. UMC operates 12 fabs that are strategically located throughout Asia with a maximum capacity of approximately 800,000 8-inch equivalent wafers per month. The company employs approximately 20,000 people worldwide, with offices in Taiwan, China, United States, Europe, Japan, Korea and Singapore. For more information, please visit: http://www.umc.com.
Note from UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are forward-looking within the meaning of the U.S. Federal Securities laws, including statements about introduction of new services and technologies, future outsourcing, competition, wafer capacity, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information regarding these and other risks is included in UMC’s filings with the U.S. Securities and Exchange Commission. UMC does not undertake any obligation to update any forward-looking statement as a result of new information, future events or otherwise, except as required under applicable law.
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