STOCK TITAN

CORRECTING and REPLACING CAPTION UMC Unveils New Fab Expansion in Singapore in Grand Opening Ceremony

Rhea-AI Impact
(No impact)
Rhea-AI Sentiment
(Positive)
Tags

UMC (United Microelectronics ) has officially unveiled its new semiconductor fab facility in Singapore's Pasir Ris Wafer Fab Park. The facility will commence volume production in 2026, boosting UMC's Singapore production capacity to over 1 million wafers annually.

The expansion represents a US$5 billion investment for the first phase, which will achieve a capacity of 30,000 wafers per month. The facility will feature 22nm and 28nm manufacturing solutions - the most advanced foundry processes in Singapore's semiconductor sector - focusing on premium smartphone display chips, IoT device memory chips, and next-generation connectivity chips.

The project will create approximately 700 new jobs locally, including process, equipment, and R&D engineers. The facility, built to Green Mark GoldPlus certification standards, includes 17,949 square meters of solar panels, supporting UMC's goal of 100% renewable energy usage by 2050.

UMC (United Microelectronics) ha ufficialmente presentato la sua nuova fabbrica di semiconduttori nel Pasir Ris Wafer Fab Park di Singapore. La struttura inizierà la produzione di massa nel 2026, aumentando la capacità produttiva di UMC a Singapore a oltre 1 milione di wafer all'anno.

L'espansione rappresenta un investimento di 5 miliardi di dollari USA per la prima fase, che raggiungerà una capacità di 30.000 wafer al mese. La fabbrica presenterà soluzioni di produzione a 22nm e 28nm - i processi di fonderia più avanzati nel settore dei semiconduttori di Singapore - concentrandosi su chip per display di smartphone premium, chip di memoria per dispositivi IoT e chip per connettività di nuova generazione.

Il progetto creerà circa 700 nuovi posti di lavoro a livello locale, inclusi ingegneri di processo, attrezzature e R&S. La struttura, costruita secondo gli standard di certificazione Green Mark GoldPlus, include 17.949 metri quadrati di pannelli solari, supportando l'obiettivo di UMC di utilizzare il 100% di energia rinnovabile entro il 2050.

UMC (United Microelectronics) ha presentado oficialmente su nueva instalación de fabricación de semiconductores en el Pasir Ris Wafer Fab Park de Singapur. La instalación comenzará la producción en volumen en 2026, aumentando la capacidad de producción de UMC en Singapur a más de 1 millón de obleas anualmente.

La expansión representa una inversión de 5 mil millones de dólares estadounidenses para la primera fase, que alcanzará una capacidad de 30,000 obleas por mes. La instalación contará con soluciones de fabricación de 22nm y 28nm - los procesos de fundición más avanzados en el sector de semiconductores de Singapur - enfocándose en chips para pantallas de teléfonos inteligentes premium, chips de memoria para dispositivos IoT y chips de conectividad de próxima generación.

El proyecto creará aproximadamente 700 nuevos empleos localmente, incluidos ingenieros de procesos, equipos e I+D. La instalación, construida según los estándares de certificación Green Mark GoldPlus, incluye 17,949 metros cuadrados de paneles solares, apoyando el objetivo de UMC de utilizar el 100% de energía renovable para 2050.

UMC (유나이티드 마이크로일렉트로닉스)가 싱가포르 파시르 리스 웨이퍼 팹 파크에 새로운 반도체 공장을 공식적으로 공개했습니다. 이 시설은 2026년에 대량 생산을 시작하여 UMC의 싱가포르 생산 능력을 연간 100만 개 이상의 웨이퍼로 늘릴 것입니다.

이 확장은 첫 번째 단계에 대해 50억 달러의 투자를 의미하며, 매월 30,000개의 웨이퍼 용량을 달성할 것입니다. 이 시설은 22nm 및 28nm 제조 솔루션을 갖추고 있으며, 이는 싱가포르 반도체 분야에서 가장 진보된 파운드리 프로세스입니다. 이 시설은 프리미엄 스마트폰 디스플레이 칩, IoT 장치 메모리 칩 및 차세대 연결 칩에 중점을 두고 있습니다.

이 프로젝트는 약 700개의 새로운 일자리를 창출할 것이며, 여기에는 공정, 장비 및 연구개발 엔지니어가 포함됩니다. 이 시설은 Green Mark GoldPlus 인증 기준에 따라 건설되었으며, 17,949 제곱미터의 태양광 패널을 포함하여 UMC의 2050년까지 100% 재생 가능 에너지 사용 목표를 지원합니다.

UMC (United Microelectronics) a officiellement dévoilé sa nouvelle installation de fabrication de semi-conducteurs dans le Pasir Ris Wafer Fab Park à Singapour. L'installation commencera la production en série en 2026, augmentant la capacité de production de UMC à Singapour à plus d'un million de wafers par an.

L'expansion représente un investissement de 5 milliards de dollars américains pour la première phase, qui atteindra une capacité de 30 000 wafers par mois. L'installation proposera des solutions de fabrication de 22nm et 28nm - les processus de fonderie les plus avancés dans le secteur des semi-conducteurs de Singapour - se concentrant sur les puces d'affichage pour smartphones haut de gamme, les puces de mémoire pour dispositifs IoT et les puces de connectivité de nouvelle génération.

Le projet créera environ 700 nouveaux emplois localement, y compris des ingénieurs en processus, en équipements et en R&D. L'installation, construite selon les normes de certification Green Mark GoldPlus, comprend 17 949 mètres carrés de panneaux solaires, soutenant l'objectif d'UMC d'utiliser 100 % d'énergie renouvelable d'ici 2050.

UMC (United Microelectronics) hat offiziell seine neue Halbleiterfabrik im Pasir Ris Wafer Fab Park in Singapur vorgestellt. Die Anlage wird 2026 mit der Serienproduktion beginnen und die Produktionskapazität von UMC in Singapur auf über 1 Million Wafer jährlich steigern.

Die Erweiterung stellt eine Investition von 5 Milliarden US-Dollar für die erste Phase dar, die eine Kapazität von 30.000 Wafern pro Monat erreichen wird. Die Anlage wird 22nm- und 28nm-Fertigungslösungen bieten - die fortschrittlichsten Foundry-Prozesse im Halbleitersektor Singapurs - und sich auf Premium-Smartphone-Display-Chips, IoT-Gerätespeicherchips und Chips für die nächste Generation der Konnektivität konzentrieren.

Das Projekt wird voraussichtlich etwa 700 neue Arbeitsplätze vor Ort schaffen, darunter Prozess-, Anlagen- und F&E-Ingenieure. Die Anlage, die nach den Standards der Green Mark GoldPlus-Zertifizierung gebaut wurde, umfasst 17.949 Quadratmeter Solarpaneele und unterstützt UMCs Ziel, bis 2050 100 % erneuerbare Energien zu nutzen.

Positive
  • None.
Negative
  • None.

New 22nm fab to be one of the most advanced semiconductor manufacturing facilities in Singapore and is set to create approximately 700 new jobs

SINGAPORE--(BUSINESS WIRE)-- Please replace the photo caption with the following corrected caption: (From Left to Right) Michael Hsu, UMC Vice President; Jermaine Loy, EDB Managing Director; Dr Beh Swan Gin, MTI Permanent Secretary;  Teo Chee Hean, Senior Minister; Gan Kim Yong, Deputy Prime Minister; SC Chien, UMC President; Christine Wong, JTC Assistant Chief Executive Officer; Yao Chu Shiang, L&K Chairman.

(From Left to Right) Michael Hsu, UMC Vice President; Jermaine Loy, EDB Managing Director; Dr Beh Swan Gin, MTI Permanent Secretary;  Teo Chee Hean, Senior Minister; Gan Kim Yong, Deputy Prime Minister; SC Chien, UMC President; Christine Wong, JTC Assistant Chief Executive Officer; Yao Chu Shiang, L&K Chairman

(From Left to Right) Michael Hsu, UMC Vice President; Jermaine Loy, EDB Managing Director; Dr Beh Swan Gin, MTI Permanent Secretary;  Teo Chee Hean, Senior Minister; Gan Kim Yong, Deputy Prime Minister; SC Chien, UMC President; Christine Wong, JTC Assistant Chief Executive Officer; Yao Chu Shiang, L&K Chairman

The updated release reads: 

UMC UNVEILS NEW FAB EXPANSION IN SINGAPORE IN GRAND OPENING CEREMONY

New 22nm fab to be one of the most advanced semiconductor manufacturing facilities in Singapore and is set to create approximately 700 new jobs

United Microelectronics Corporation (UMC), a leading global semiconductor foundry, today officially unveiled its new fab facility in Singapore in a grand opening ceremony. The first phase of the new facility will start volume production in 2026, bringing UMC’s total production capacity in Singapore to more than 1 million wafers annually. It will also be one of the most advanced semiconductor foundries in Singapore, manufacturing semiconductors to enable communications, Internet of Things (IoT), automotive, and AI innovations.

The ceremony was attended by Deputy Prime Minister and Minister for Trade and Industry of Singapore Gan Kim Yong, Senior Minister and Coordinating Minister for National Security of Singapore Teo Chee Hean, Permanent Secretary of Singapore’s Ministry of Trade and Industry Beh Swan Gin, Managing Director of the Singapore Economic Development Board (EDB) Jermaine Loy, and JTC Assistant Chief Executive Officer Christine Wong.

The facility, a greenfield expansion adjacent to UMC’s existing fab in the Pasir Ris Wafer Fab Park, spans two phases. Up to US$5 billion will be invested to bring the first phase to full capacity of 30,000 wafers per month, with room for further investment in a second phase expansion in the future. The new facility is equipped for manufacturing with UMC’s industry-leading 22nm and 28nm solutions – the most advanced foundry processes currently in Singapore’s semiconductor sector – for global customers’ products including premium smartphone display chips, power-efficient memory chips for IoT devices, and next-generation connectivity chips. The expansion is expected to create approximately 700 jobs locally over the next few years, including process and equipment engineers as well as research and development engineers.

“This new state-of-the-art facility in Singapore signals a new phase of growth for UMC. It enhances our ability to meet future chip demand, driven by continuous innovations in connectivity, automotive, and AI,” said SC Chien, President of UMC. “The unique geography of Singapore also makes the new facility well placed to support our customers in strengthening supply chain resilience. This fab expansion closely aligns with the Singapore government’s vision to become a leading advanced manufacturing hub, and we are deeply grateful for their support.”

“We welcome UMC’s expansion in Singapore. This new fab introduces new leading edge specialty semiconductor capabilities and production capacity that will enhance Singapore’s competitiveness as a critical node in the global semiconductor supply chain. This significant investment underscores our long-standing partnership with UMC, and we look forward to deepening our collaboration to strengthen Singapore’s semiconductor ecosystem,” said Jermaine Loy, Managing Director of the Singapore Economic Development Board.

The new facility was built according to rigorous sustainability standards, and has obtained the Green Mark GoldPlus certification from Singapore’s Building and Construction Authority. A standard part of all UMC’s new fab designs to align with UMC’s goal to be 100% powered by renewable energy by 2050, the new facility will be installed with 17,949 square meters of solar panels on its rooftop. In addition to the manufacturing site, the expansion also includes a brand-new office building, a full-sized multipurpose sports hall, and other amenities for employees and community members to enjoy.

About UMC

UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry company. The company provides high-quality IC fabrication services, focusing on logic and various specialty technologies to serve all major sectors of the electronics industry. UMC’s comprehensive IC processing technologies and manufacturing solutions include Logic/Mixed-Signal, embedded High-Voltage, embedded Non-Volatile-Memory, RFSOI, BCD etc. Most of UMC's 12-in & 8-in fabs with its core R&D are located in Taiwan, with additional ones throughout Asia. UMC has a total of 12 fabs in production with combined capacity of more than 400,000 wafers per month (12-in equivalent), and all of them are certified with IATF 16949 automotive quality standard. UMC is headquartered in Hsinchu, Taiwan, plus local offices in United States, Europe, China, Japan, Korea & Singapore, with a worldwide total of 20,000 employees. For more information, please visit: http://www.umc.com.

Note from UMC Concerning Forward-Looking Statements

Some of the statements in the foregoing announcement are forward-looking within the meaning of the U.S. Federal Securities laws, including statements about introduction of new services and technologies, future outsourcing, competition, wafer capacity, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information regarding these and other risks is included in UMC’s filings with the U.S. Securities and Exchange Commission. UMC does not undertake any obligation to update any forward-looking statement as a result of new information, future events or otherwise, except as required under applicable law.

Media contact

UMC Corporate Communications

Michelle Yun

886-3-578-2258 x16951

michelle_yun@umc.com

Source: United Microelectronics Corporation

FAQ

When will UMC's new Singapore semiconductor fab start production and what is its capacity?

UMC's new Singapore fab will begin volume production in 2026, with a first-phase capacity of 30,000 wafers per month, contributing to a total Singapore production capacity exceeding 1 million wafers annually.

How much is UMC investing in the new Singapore fab expansion?

UMC is investing up to US$5 billion to bring the first phase to full capacity, with potential for further investment in a second phase expansion.

What manufacturing processes will UMC's new Singapore fab utilize?

The new fab will employ 22nm and 28nm manufacturing solutions, currently the most advanced foundry processes in Singapore's semiconductor sector.

How many jobs will UMC's new Singapore fab create?

The expansion is expected to create approximately 700 new jobs over the next few years, including positions for process, equipment, and R&D engineers.

What sustainability features are included in UMC's new Singapore facility?

The facility has achieved Green Mark GoldPlus certification and includes 17,949 square meters of solar panels, supporting UMC's goal of 100% renewable energy usage by 2050.
United Microelec

NYSE:UMC

UMC Rankings

UMC Latest News

UMC Stock Data

17.49B
2.51B
6.64%
3.32%
Semiconductors
Technology
Link
Taiwan
Hsinchu City