TI pioneers new magnetic packaging technology for power modules, cutting power solution size in half
Texas Instruments (TI) has introduced six new power modules featuring proprietary MagPack integrated magnetic packaging technology. These modules offer improved power density, enhanced efficiency, and reduced EMI, with sizes up to 23% smaller than competing modules. Three of the new devices - TPSM82866A, TPSM82866C, and TPSM82816 - are the industry's smallest 6A power modules, providing a power density of nearly 1A per 1mm² of area.
The MagPack technology combines a power chip with a transformer or inductor in one package, utilizing a 3D package molding process to maximize power output in a smaller space. This innovation is particularly significant for applications like data centers, where power consumption is a critical factor. The new power modules are now available for purchase on TI.com, with evaluation modules starting at $49.
- Introduction of six new power modules with improved power density and efficiency
- MagPack technology reduces module size by up to 23% compared to competitors
- Three new devices are the industry's smallest 6A power modules
- Achieves power density of nearly 1A per 1mm² of area
- Potential for significant impact in data center applications
- None.
Texas Instruments' introduction of the MagPack integrated magnetic packaging technology marks a significant leap in the field of power modules. The new technology allows for a substantial reduction in size while maintaining high levels of power density and efficiency. This is particularly impactful for industries such as data centers, where space and power efficiency are critical. By integrating a power chip with a transformer or inductor into a single package, TI effectively reduces the complexity and footprint of power modules, making them highly desirable for applications requiring compact and efficient power solutions.
In layman's terms, think of these power modules as super-efficient mini power plants that can fit into much smaller spaces than their predecessors. This tech will likely be a game-changer in sectors where every millimeter of board space counts.
For retail investors, it's important to consider that the improved efficiency and reduced size of these power modules could lead to increased demand across various industries. This could positively affect TI's revenue streams and solidify its market position.
From a financial perspective, the introduction of MagPack technology by Texas Instruments could have several positive ramifications. The primary benefit is the potential for increased market share in the power module segment. By offering a product that significantly reduces size and improves efficiency, TI can attract new customers while deepening relationships with existing ones. Historically, innovations that offer significant advantages in terms of size and efficiency tend to drive increased adoption rates, which could translate into higher revenues for TI.
Moreover, the focus on applications such as data centers, which are growing rapidly and are power-intensive, positions TI well to capitalize on this growth. The potential for electricity demand in data centers to double by the end of the decade underscores the urgency for more efficient power solutions, further boosting the prospects for these new modules.
Investors should also consider the long-term cost benefits associated with lower energy consumption and reduced system power losses. These factors contribute to a more compelling value proposition, which may justify a premium pricing strategy and improve profit margins.
For more information, see TI.com/powermodules.
"Designers turn to power modules to save on time, complexity, size and component count, but these benefits have required a compromise on performance – until now," said Jeff Morroni, director of power management research and development at TI's Kilby Labs. "After nearly a decade in the making, TI's integrated magnetic packaging technology enables power designers to meet the defining power trend that has shaped our industry – pushing more power in smaller spaces efficiently and cost-effectively."
Pushing more power in smaller spaces
In power design, size matters. Power modules simplify power designs and save valuable board space by combining a power chip with a transformer or inductor in one package. By leveraging TI's exclusive 3D package molding process, MagPack packaging technology maximizes the height, width and depth of the power modules to push more power in a smaller space.
The magnetic packaging technology includes an integrated power inductor with proprietary, newly engineered material. As a result, engineers can now achieve best-in-class power density and reduce temperature and radiated emissions while minimizing both board space and system power losses. These benefits are especially important in applications such as data centers, where electricity is the biggest cost factor, with some analysts predicting a
To learn more, see the technical article, "MagPack Technology: Four Benefits of new power modules that can help you pack more power in less space."
With decades of expertise, innovative technology, and a portfolio of more than 200 devices with optimized package types for any power design or application, TI's power modules help designers push power further.
Available today on TI.com
- Preproduction quantities of TI's new power modules with MagPack packaging technology are available for purchase now on TI.com.
- Evaluation modules are also available, starting at
US .$49 - Multiple payment, currency and shipping options are available.
Device | Input voltage range | Description | MagPack package |
2.4V to 5.5V | Industry's smallest 6A step-down module with | 2.3mm by 3mm | |
2.4V to 5.5V | Industry's smallest 6A step-down module with | 2.3mm by 3mm | |
2.25V to 5.5V | 3A step-down module with integrated inductor | 2.5mm by 2.6mm | |
2.7V to 6V | Industry's smallest 6A step-down module with | 2.5mm by 3mm | |
2.75V to 6V | 3A step-down module with adjustable frequency | 2.5mm by 3mm | |
1.8V to 5.5V | 5.5V, 5.5A valley current limit boost module with | 2.5mm by 2.6mm |
About Texas Instruments
Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips for markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com.
Trademarks
MagPack is a trademark of Texas Instruments. All registered trademarks and other trademarks belong to their respective owners.
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SOURCE Texas Instruments
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